DE69132714D1 - Elektronische Schaltung mit Kühlungsmitteln - Google Patents

Elektronische Schaltung mit Kühlungsmitteln

Info

Publication number
DE69132714D1
DE69132714D1 DE69132714T DE69132714T DE69132714D1 DE 69132714 D1 DE69132714 D1 DE 69132714D1 DE 69132714 T DE69132714 T DE 69132714T DE 69132714 T DE69132714 T DE 69132714T DE 69132714 D1 DE69132714 D1 DE 69132714D1
Authority
DE
Germany
Prior art keywords
coolants
electronic circuit
electronic
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69132714T
Other languages
English (en)
Inventor
Richard C Eden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Abrasives Inc
Original Assignee
Norton Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Norton Co filed Critical Norton Co
Application granted granted Critical
Publication of DE69132714D1 publication Critical patent/DE69132714D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
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    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
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    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69132714T 1990-10-03 1991-09-30 Elektronische Schaltung mit Kühlungsmitteln Expired - Lifetime DE69132714D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59220990A 1990-10-03 1990-10-03

Publications (1)

Publication Number Publication Date
DE69132714D1 true DE69132714D1 (de) 2001-10-11

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DE69132714T Expired - Lifetime DE69132714D1 (de) 1990-10-03 1991-09-30 Elektronische Schaltung mit Kühlungsmitteln

Country Status (5)

Country Link
US (1) US5300810A (de)
EP (1) EP0479205B1 (de)
JP (1) JP2882706B2 (de)
CA (1) CA2050091C (de)
DE (1) DE69132714D1 (de)

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US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US7198969B1 (en) * 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
JPH0779144B2 (ja) * 1992-04-21 1995-08-23 インターナショナル・ビジネス・マシーンズ・コーポレイション 耐熱性半導体チップ・パッケージ
US5328715A (en) * 1993-02-11 1994-07-12 General Electric Company Process for making metallized vias in diamond substrates
US5388027A (en) * 1993-07-29 1995-02-07 Motorola, Inc. Electronic circuit assembly with improved heatsinking
US5785754A (en) * 1994-11-30 1998-07-28 Sumitomo Electric Industries, Ltd. Substrate, semiconductor device, element-mounted device and preparation of substrate
JP4048579B2 (ja) * 1997-08-28 2008-02-20 住友電気工業株式会社 冷媒流路を含む熱消散体とその製造方法
US6180881B1 (en) * 1998-05-05 2001-01-30 Harlan Ruben Isaak Chip stack and method of making same
US6246583B1 (en) 1999-03-04 2001-06-12 International Business Machines Corporation Method and apparatus for removing heat from a semiconductor device
AU1348901A (en) * 1999-10-28 2001-05-08 P1 Diamond, Inc. Improved diamond thermal management components
AU2001247378A1 (en) 2000-03-13 2001-09-24 Sun Microsystems, Inc. Method and apparatus for bonding substrates
FR2810192A1 (fr) * 2000-06-08 2001-12-14 Cit Alcatel Montage electronique a haute densite d'interconnexions
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JPH04273466A (ja) 1992-09-29
JP2882706B2 (ja) 1999-04-12
EP0479205B1 (de) 2001-09-05
CA2050091C (en) 1999-06-15
US5300810A (en) 1994-04-05
EP0479205A3 (en) 1992-11-19
CA2050091A1 (en) 1992-04-04
EP0479205A2 (de) 1992-04-08

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