DE69425796D1 - Elektronische Schaltungsanordnung mit verbesserter Hitzeableitung - Google Patents

Elektronische Schaltungsanordnung mit verbesserter Hitzeableitung

Info

Publication number
DE69425796D1
DE69425796D1 DE69425796T DE69425796T DE69425796D1 DE 69425796 D1 DE69425796 D1 DE 69425796D1 DE 69425796 T DE69425796 T DE 69425796T DE 69425796 T DE69425796 T DE 69425796T DE 69425796 D1 DE69425796 D1 DE 69425796D1
Authority
DE
Germany
Prior art keywords
heat dissipation
electronic circuit
circuit arrangement
improved heat
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69425796T
Other languages
English (en)
Other versions
DE69425796T2 (de
Inventor
Randy L Pollock
George F Anderson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of DE69425796D1 publication Critical patent/DE69425796D1/de
Publication of DE69425796T2 publication Critical patent/DE69425796T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69425796T 1993-07-29 1994-06-27 Elektronische Schaltungsanordnung mit verbesserter Hitzeableitung Expired - Fee Related DE69425796T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/099,670 US5388027A (en) 1993-07-29 1993-07-29 Electronic circuit assembly with improved heatsinking

Publications (2)

Publication Number Publication Date
DE69425796D1 true DE69425796D1 (de) 2000-10-12
DE69425796T2 DE69425796T2 (de) 2001-03-29

Family

ID=22276071

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69425796T Expired - Fee Related DE69425796T2 (de) 1993-07-29 1994-06-27 Elektronische Schaltungsanordnung mit verbesserter Hitzeableitung

Country Status (5)

Country Link
US (1) US5388027A (de)
EP (1) EP0637076B1 (de)
JP (1) JPH0758257A (de)
CN (1) CN1047278C (de)
DE (1) DE69425796T2 (de)

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US5929523A (en) * 1996-03-07 1999-07-27 3C Semiconductor Corporation Os rectifying Schottky and ohmic junction and W/WC/TiC ohmic contacts on SiC
US6388272B1 (en) 1996-03-07 2002-05-14 Caldus Semiconductor, Inc. W/WC/TAC ohmic and rectifying contacts on SiC
US6211463B1 (en) * 1998-01-26 2001-04-03 Saint-Gobain Industrial Ceramics, Inc. Electronic circuit package with diamond film heat conductor
US6261868B1 (en) 1999-04-02 2001-07-17 Motorola, Inc. Semiconductor component and method for manufacturing the semiconductor component
US6072238A (en) * 1999-04-07 2000-06-06 Motorola, Inc. Semiconductor component
JP4178030B2 (ja) * 2001-01-19 2008-11-12 シェブロン ユー．エス．エー． インコーポレイテッド マイクロエレクトロニクスにおけるダイヤモンドイド含有材料
KR100432715B1 (ko) * 2001-07-18 2004-05-24 엘지전자 주식회사 방열부재를 갖는 인쇄회로기판 및 그 제조방법
AT6666U1 (de) * 2002-09-23 2004-01-26 Plansee Ag Wärmesenke aus diamant-haltigem verbundwerkstoff mit mehrlagigem überzug
TWI239606B (en) * 2002-11-07 2005-09-11 Kobe Steel Ltd Heat spreader and semiconductor device and package using the same
US8220489B2 (en) 2002-12-18 2012-07-17 Vapor Technologies Inc. Faucet with wear-resistant valve component
US6904935B2 (en) * 2002-12-18 2005-06-14 Masco Corporation Of Indiana Valve component with multiple surface layers
US7866342B2 (en) * 2002-12-18 2011-01-11 Vapor Technologies, Inc. Valve component for faucet
US7866343B2 (en) * 2002-12-18 2011-01-11 Masco Corporation Of Indiana Faucet
US8555921B2 (en) 2002-12-18 2013-10-15 Vapor Technologies Inc. Faucet component with coating
TW566828U (en) * 2003-04-11 2003-12-11 Delta Electronics Inc Fan circuit board and fan structure with fan circuit board
CN100370604C (zh) * 2004-04-15 2008-02-20 鸿富锦精密工业（深圳）有限公司 一种热界面材料及其制造方法
US20070026205A1 (en) * 2005-08-01 2007-02-01 Vapor Technologies Inc. Article having patterned decorative coating
US20070035930A1 (en) * 2005-08-10 2007-02-15 Chien-Min Sung Methods and devices for cooling printed circuit boards
WO2008051187A1 (en) * 2006-08-11 2008-05-02 Kinik Company Methods and devices for cooling printed circuit boards
US20080048192A1 (en) * 2006-08-22 2008-02-28 Chien-Min Sung LED devices and associated methods
US20080144291A1 (en) * 2006-12-13 2008-06-19 Shao Chung Hu Methods and devices for cooling printed circuit boards
US8395318B2 (en) 2007-02-14 2013-03-12 Ritedia Corporation Diamond insulated circuits and associated methods
US8110846B2 (en) * 2007-05-31 2012-02-07 Chien-Min Sung Diamond semiconductor devices and associated methods
US8232137B2 (en) * 2009-12-10 2012-07-31 Intersil Americas Inc. Heat conduction for chip stacks and 3-D circuits
JP5687027B2 (ja) * 2010-10-27 2015-03-18 三菱重工業株式会社 インバータ一体型電動圧縮機
JP6880777B2 (ja) * 2017-01-27 2021-06-02 富士通株式会社 光モジュール
US11488888B2 (en) * 2019-11-08 2022-11-01 Microchip Technology Caldicot Limited Chemical vapor deposition diamond (CVDD) wires for thermal transport

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3716759A (en) * 1970-10-12 1973-02-13 Gen Electric Electronic device with thermally conductive dielectric barrier
US3739232A (en) * 1972-04-10 1973-06-12 Northrop Corp Interconnected electrical circuit board assembly and method of fabrication
US3949263A (en) * 1974-12-20 1976-04-06 Raytheon Company Diamond brazing method for slow wave energy propagating structures
US4425195A (en) * 1982-11-10 1984-01-10 Martin Marietta Corporation Method of fabricating a diamond heat sink
GB8328573D0 (en) * 1983-10-26 1983-11-30 Plessey Co Plc Diamond heatsink assemblies
US4689583A (en) * 1984-02-13 1987-08-25 Raytheon Company Dual diode module with heat sink, for use in a cavity power combiner
JPS61214455A (ja) * 1985-03-19 1986-09-24 Mitsubishi Electric Corp 混成集積回路装置
GB2182200B (en) * 1985-08-31 1989-04-26 Plessey Co Plc Mesa semiconductor device
JPH0685445B2 (ja) * 1985-12-23 1994-10-26 松下電器産業株式会社 光電変換素子
US4922324A (en) * 1987-01-20 1990-05-01 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device
US4999740A (en) * 1989-03-06 1991-03-12 Allied-Signal Inc. Electronic device for managing and dissipating heat and for improving inspection and repair, and method of manufacture thereof
JP2773219B2 (ja) * 1989-04-12 1998-07-09 住友電気工業株式会社 半導体装置
US5012386A (en) * 1989-10-27 1991-04-30 Motorola, Inc. High performance overmolded electronic package
US5109268A (en) * 1989-12-29 1992-04-28 Sgs-Thomson Microelectronics, Inc. Rf transistor package and mounting pad
US5126206A (en) * 1990-03-20 1992-06-30 Diamonex, Incorporated Diamond-on-a-substrate for electronic applications
KR910019484A (ko) * 1990-04-06 1991-11-30 피터 드 제이거 회로판
US5120495A (en) * 1990-08-27 1992-06-09 The Standard Oil Company High thermal conductivity metal matrix composite
US5045972A (en) * 1990-08-27 1991-09-03 The Standard Oil Company High thermal conductivity metal matrix composite
US5124179A (en) * 1990-09-13 1992-06-23 Diamonex, Incorporated Interrupted method for producing multilayered polycrystalline diamond films
CA2050091C (en) * 1990-10-03 1999-06-15 Richard C. Eden Electronic circuit and method with thermal management
US5128006A (en) * 1991-01-23 1992-07-07 At&T Bell Laboratories Deposition of diamond films on semicondutor substrates

Also Published As

Publication number Publication date
CN1098844A (zh) 1995-02-15
EP0637076B1 (de) 2000-09-06
CN1047278C (zh) 1999-12-08
US5388027A (en) 1995-02-07
JPH0758257A (ja) 1995-03-03
DE69425796T2 (de) 2001-03-29
EP0637076A2 (de) 1995-02-01
EP0637076A3 (de) 1995-08-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: SCHUMACHER & WILLSAU, PATENTANWALTSSOZIETAET, 80335 MUENCHEN

8327 Change in the person/name/address of the patent owner

Owner name: FREESCALE SEMICONDUCTOR, INC., AUSTIN, TEX., US

8339 Ceased/non-payment of the annual fee