KR910019484A - 회로판 - Google Patents

회로판 Download PDF

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Publication number
KR910019484A
KR910019484A KR1019910005458A KR910005458A KR910019484A KR 910019484 A KR910019484 A KR 910019484A KR 1019910005458 A KR1019910005458 A KR 1019910005458A KR 910005458 A KR910005458 A KR 910005458A KR 910019484 A KR910019484 A KR 910019484A
Authority
KR
South Korea
Prior art keywords
circuit board
matrix
particles
concentration
weight
Prior art date
Application number
KR1019910005458A
Other languages
English (en)
Inventor
린 조운즈 바바라
Original Assignee
피터 드 제이거
드 비어스 인더스트리얼 다이아몬드 디비젼(프로프라이어터리) 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB909007895A external-priority patent/GB9007895D0/en
Priority claimed from GB909025657A external-priority patent/GB9025657D0/en
Application filed by 피터 드 제이거, 드 비어스 인더스트리얼 다이아몬드 디비젼(프로프라이어터리) 리미티드 filed Critical 피터 드 제이거
Publication of KR910019484A publication Critical patent/KR910019484A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

내용 없음

Description

회로판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예의 평면도, 제2도는 제1도의 라인 2-2를 따라 절취하여 본 단면도, 제3도는 본 발명의 제2실시예의 측단면도.

Claims (9)

  1. 회로판에 있어서, 자체-지지 시트가 (i) 전기 회로 또는 회로의 소자를 보유 지지하는 표면, 및 (ⅱ) 표면의 뒤에 있고 상기 표면과 열전도 전달이 되며, 중합체, 금속 및 세라믹 중에서 선택된 내트릭스내에 다이아몬드 또는 입방형 질화붕소 입자들의 덩어리를 포함하고 상기 매트릭스내의 입자들의 농도가 60중량%를 초과하지 않는 영역을 포함하는 것을 특징으로 하는 회로판.
  2. 제1항에 있어서, 상기 중합체 매트릭스가 열가소성 중합체인 것을 특징으로 하는 회로판.
  3. 제2항에 있어서, 상기 열가소성 중합체가 페놀계 개질된 폐놀계, 멜라민, 플리아미드, 플리아미드-이미드, 폴리카보네이즈, 폴리술판, 아트릴로니트릴 스티렌 플라스틱 및 올레핀 중합체 중에서 선택되는 것을 특징으로 하는 회로판.
  4. 제1항에 있어서, 상기 매트릭스가 구리, 니켈, 몰리브덴, 알루미늄 및 스테인레스 강철 중에서 선택된 금속 매트릭스인 것을 특징으로 하는 회로판.
  5. 제1항에 있어서, 상기 매트릭스가 알루미나, 질화알루미늄, 탄화규소, 산화규소, 질화규소, 및 산화베릴륨 중에서 선택된 세라믹 매트릭스인 것을 특징으로 하는 회로판.
  6. 제1항 내지 제5항 중의 어느 한 항에 있어서, 상기 입자들의 농도가 10 내지 60중량%의 범위내에 있는 것을 특징으로 하는 회로판.
  7. 제1항 내지 제6항중의 어느 한 항에 있어서, 상기 입자들의 농도가 30 내지 60중량%의 범위내에 있는 것을 특징으로 하는 회로판.
  8. 제1항 내지 제7항 중의 어느 한 항에 있어서, 중합테 물질층이 상기 영역과 상기 표면 사이에 제공되는 것을 특징으로 하는 회로판.
  9. 제8항에 있어서, 상기 영역이 중합체 층에 접합된 층을 포함하는 것을 특징으로 하는 회로판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910005458A 1990-04-06 1991-04-04 회로판 KR910019484A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB909007895A GB9007895D0 (en) 1990-04-06 1990-04-06 Expansion controlled layers
GB9007895.7 1990-04-06
GB909025657A GB9025657D0 (en) 1990-11-26 1990-11-26 Thermally conductive layers
GB90256579 1990-11-26

Publications (1)

Publication Number Publication Date
KR910019484A true KR910019484A (ko) 1991-11-30

Family

ID=26296912

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910005458A KR910019484A (ko) 1990-04-06 1991-04-04 회로판

Country Status (3)

Country Link
EP (1) EP0450968A3 (ko)
JP (1) JPH05291708A (ko)
KR (1) KR910019484A (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244712A (en) * 1991-01-15 1993-09-14 Norton Company Laminated diamond substrate
US5388027A (en) * 1993-07-29 1995-02-07 Motorola, Inc. Electronic circuit assembly with improved heatsinking
US5847927A (en) * 1997-01-27 1998-12-08 Raytheon Company Electronic assembly with porous heat exchanger and orifice plate
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
AT6666U1 (de) 2002-09-23 2004-01-26 Plansee Ag Wärmesenke aus diamant-haltigem verbundwerkstoff mit mehrlagigem überzug
DE102004058335A1 (de) * 2004-11-29 2006-06-14 Schulz-Harder, Jürgen, Dr.-Ing. Substrat
FR2992468B1 (fr) * 2012-06-25 2015-07-03 Alstom Transport Sa Circuit electrique susceptible d'etre connecte directement a de la haute tension
CN103596407B (zh) * 2012-08-13 2016-08-10 华硕电脑股份有限公司 热缓冲元件
JP6508182B2 (ja) * 2016-12-16 2019-05-08 株式会社豊田中央研究所 半導体モジュールとその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0040552A1 (en) * 1980-05-20 1981-11-25 De Beers Industrial Diamond Division (Proprietary) Limited Heat sinks
US4492730A (en) * 1982-03-26 1985-01-08 Showa Denko Kabushiki Kaisha Substrate of printed circuit
JPS6083831A (ja) * 1983-10-14 1985-05-13 三菱電機株式会社 熱伝導性銅張り積層板
JPS60245154A (ja) * 1984-05-19 1985-12-04 Fujitsu Ltd 半導体装置実装用多層基板
US4810563A (en) * 1986-03-14 1989-03-07 The Bergquist Company Thermally conductive, electrically insulative laminate
US4782893A (en) * 1986-09-15 1988-11-08 Trique Concepts, Inc. Electrically insulating thermally conductive pad for mounting electronic components
JPS6433990A (en) * 1987-07-29 1989-02-03 Hitachi Chemical Co Ltd High thermal conductivity wiring board
JPH0212888A (ja) * 1988-06-30 1990-01-17 Fujikura Ltd 高放熱性ホウロウ回路基板

Also Published As

Publication number Publication date
EP0450968A2 (en) 1991-10-09
EP0450968A3 (en) 1992-11-19
JPH05291708A (ja) 1993-11-05

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