DE69227690D1 - Elektronische baugruppe mit verbesserter erdung - Google Patents

Elektronische baugruppe mit verbesserter erdung

Info

Publication number
DE69227690D1
DE69227690D1 DE69227690T DE69227690T DE69227690D1 DE 69227690 D1 DE69227690 D1 DE 69227690D1 DE 69227690 T DE69227690 T DE 69227690T DE 69227690 T DE69227690 T DE 69227690T DE 69227690 D1 DE69227690 D1 DE 69227690D1
Authority
DE
Germany
Prior art keywords
electronic assembly
improved earthing
earthing
improved
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69227690T
Other languages
English (en)
Other versions
DE69227690T2 (de
Inventor
Joerg Ferchau
Kenneth Kotyuk
Randall Diaz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tandem Computers Inc
Original Assignee
Tandem Computers Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tandem Computers Inc filed Critical Tandem Computers Inc
Publication of DE69227690D1 publication Critical patent/DE69227690D1/de
Application granted granted Critical
Publication of DE69227690T2 publication Critical patent/DE69227690T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H05K9/0016—Gaskets or seals having a spring contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE69227690T 1991-08-09 1992-08-06 Elektronische baugruppe mit verbesserter erdung Expired - Fee Related DE69227690T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74299491A 1991-08-09 1991-08-09
PCT/US1992/006463 WO1993003594A1 (en) 1991-08-09 1992-08-06 Electronic assembly with improved grounding and emi shielding

Publications (2)

Publication Number Publication Date
DE69227690D1 true DE69227690D1 (de) 1999-01-07
DE69227690T2 DE69227690T2 (de) 1999-05-20

Family

ID=24987091

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69227690T Expired - Fee Related DE69227690T2 (de) 1991-08-09 1992-08-06 Elektronische baugruppe mit verbesserter erdung

Country Status (6)

Country Link
US (1) US5311408A (de)
EP (1) EP0598028B1 (de)
JP (1) JP2945760B2 (de)
CA (1) CA2114325C (de)
DE (1) DE69227690T2 (de)
WO (1) WO1993003594A1 (de)

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US6997722B2 (en) * 2003-03-25 2006-02-14 Elma Electronic Inc. ESD system for grounding electronics within an enclosure
US6998944B2 (en) * 2003-11-14 2006-02-14 Itt Manufacturing Enterprises, Inc. Method and apparatus for microwave interconnection
US7675729B2 (en) 2003-12-22 2010-03-09 X2Y Attenuators, Llc Internally shielded energy conditioner
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
GB2439862A (en) 2005-03-01 2008-01-09 X2Y Attenuators Llc Conditioner with coplanar conductors
US7355857B2 (en) 2006-02-07 2008-04-08 Methode Electronics, Inc. Heat sink gasket
EP1991996A1 (de) 2006-03-07 2008-11-19 X2Y Attenuators, L.L.C. Energiekonditionierungsstrukturen
US7866711B2 (en) * 2006-08-22 2011-01-11 Ti Group Automotive Systems, Llc Quick connector with conductive path
JP4913539B2 (ja) * 2006-10-25 2012-04-11 日本圧着端子製造株式会社 ソケットコンタクト
US8025515B2 (en) * 2008-02-08 2011-09-27 Ericsson Ab Systems and methods for connecting a circuit board with a chassis
US7690927B1 (en) * 2009-03-19 2010-04-06 International Business Machines Corporation Processor scaling across multiple computer blades
US7927147B1 (en) 2009-12-15 2011-04-19 Hewlett-Packard Development Company, L.P. Connector assembly
KR101811902B1 (ko) 2010-07-02 2018-01-25 톰슨 라이센싱 전자 디바이스에서 접지를 위한 시스템
US8289718B2 (en) * 2010-10-29 2012-10-16 Zf Friedrichshafen Ag Connector assembly for electrical and mechanical interconnection of modules
US20130003323A1 (en) * 2011-06-29 2013-01-03 Loc Huynh Conductive gasket holder
KR101697576B1 (ko) * 2012-04-09 2017-02-01 엘에스산전 주식회사 디지털 보호 계전기 및 그것의 백플레인 접지 방법
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DE102021210573A1 (de) 2021-09-23 2023-03-23 Robert Bosch Gesellschaft mit beschränkter Haftung Erdungskontaktsystem, Gerätegehäuse, Geräteeinheit, Wärmepumpeneinheit und Verfahren zur Herstellung eines Erdungskontaktsystems

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Also Published As

Publication number Publication date
JP2945760B2 (ja) 1999-09-06
EP0598028B1 (de) 1998-11-25
US5311408A (en) 1994-05-10
EP0598028A4 (de) 1995-07-26
EP0598028A1 (de) 1994-05-25
JPH06510636A (ja) 1994-11-24
DE69227690T2 (de) 1999-05-20
CA2114325C (en) 1997-01-28
WO1993003594A1 (en) 1993-02-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee