DE69220333D1 - Elektronische Baugruppe mit schützendem Verkapselungsmaterial - Google Patents

Elektronische Baugruppe mit schützendem Verkapselungsmaterial

Info

Publication number
DE69220333D1
DE69220333D1 DE69220333T DE69220333T DE69220333D1 DE 69220333 D1 DE69220333 D1 DE 69220333D1 DE 69220333 T DE69220333 T DE 69220333T DE 69220333 T DE69220333 T DE 69220333T DE 69220333 D1 DE69220333 D1 DE 69220333D1
Authority
DE
Germany
Prior art keywords
electronic assembly
encapsulation material
protective encapsulation
protective
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69220333T
Other languages
English (en)
Inventor
Barry Alan Bonitz
James Vernon Ellerson
Kishen Narain Kapur
Jack Marlyn Mccreary
Irving Memis
Gerald Michael Vettel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25191568&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69220333(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69220333D1 publication Critical patent/DE69220333D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
DE69220333T 1991-12-11 1992-10-19 Elektronische Baugruppe mit schützendem Verkapselungsmaterial Expired - Lifetime DE69220333D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80543591A 1991-12-11 1991-12-11

Publications (1)

Publication Number Publication Date
DE69220333D1 true DE69220333D1 (de) 1997-07-17

Family

ID=25191568

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69220333T Expired - Lifetime DE69220333D1 (de) 1991-12-11 1992-10-19 Elektronische Baugruppe mit schützendem Verkapselungsmaterial

Country Status (4)

Country Link
US (1) US5414928A (de)
EP (1) EP0546285B1 (de)
JP (1) JP2522889B2 (de)
DE (1) DE69220333D1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5574629A (en) * 1989-06-09 1996-11-12 Sullivan; Kenneth W. Solderless printed wiring devices
US5469333A (en) * 1993-05-05 1995-11-21 International Business Machines Corporation Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads
US5787569A (en) * 1996-02-21 1998-08-04 Lucent Technologies Inc. Encapsulated package for power magnetic devices and method of manufacture therefor
US5851311A (en) * 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
US5689878A (en) * 1996-04-17 1997-11-25 Lucent Technologies Inc. Method for protecting electronic circuit components
FR2753044B1 (fr) * 1996-08-27 1998-10-30 Siemens Automotive Sa Procede d'assemblage de composants electroniques sur une carte de circuit imprime
US5808870A (en) * 1996-10-02 1998-09-15 Stmicroelectronics, Inc. Plastic pin grid array package
US6403882B1 (en) * 1997-06-30 2002-06-11 International Business Machines Corporation Protective cover plate for flip chip assembly backside
US6177726B1 (en) * 1999-02-11 2001-01-23 Philips Electronics North America Corporation SiO2 wire bond insulation in semiconductor assemblies
US6247229B1 (en) * 1999-08-25 2001-06-19 Ankor Technology, Inc. Method of forming an integrated circuit device package using a plastic tape as a base
US20020100165A1 (en) 2000-02-14 2002-08-01 Amkor Technology, Inc. Method of forming an integrated circuit device package using a temporary substrate
US6319739B1 (en) * 2000-04-06 2001-11-20 Advanced Micro Devices, Inc. Mold compound selection for TSOP post mold cure processing
GB2369250B (en) * 2000-11-21 2004-06-16 Hi Key Ltd A method and apparatus for reinforcing a ribbon cable adjacent a joint to a PCB
US6974765B2 (en) * 2001-09-27 2005-12-13 Intel Corporation Encapsulation of pin solder for maintaining accuracy in pin position
JP4498991B2 (ja) * 2005-07-15 2010-07-07 新光電気工業株式会社 半導体装置及び電子装置
KR100933864B1 (ko) 2008-03-31 2009-12-24 삼성에스디아이 주식회사 배터리 팩
JP2011176071A (ja) * 2010-02-24 2011-09-08 Hitachi Automotive Systems Ltd 電子制御モジュール
JP2017050399A (ja) * 2015-09-02 2017-03-09 日立オートモティブシステムズ株式会社 車載制御装置
JP7115385B2 (ja) * 2019-03-27 2022-08-09 株式会社オートネットワーク技術研究所 回路基板及び、回路基板を含む電気接続箱の製造方法
US11152315B2 (en) * 2019-10-15 2021-10-19 Advanced Semiconductor Engineering, Inc. Electronic device package and method for manufacturing the same
CN113613404A (zh) * 2021-08-06 2021-11-05 环维电子(上海)有限公司 电子元件的热熔胶包裹保护方法及装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
US4311267A (en) * 1979-05-04 1982-01-19 Gte Automatic Electric Laboratories, Inc. Method of screening paste solder onto leaded hybrid substrates
CH660551GA3 (de) * 1982-12-27 1987-05-15
JPS6046095A (ja) * 1983-08-24 1985-03-12 沖電気工業株式会社 電子回路の実装方法
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
JPS6245138A (ja) * 1985-08-23 1987-02-27 Sony Corp 電子部品装置の製法
JPS62136865A (ja) * 1985-12-11 1987-06-19 Hitachi Ltd モジユ−ル実装構造
US4830922A (en) * 1986-02-28 1989-05-16 Sparrowhawk Bryan L Removable controlled thickness conformal coating
JPS63143851A (ja) * 1986-12-08 1988-06-16 Nec Corp 半導体装置
JPS6472590A (en) * 1987-09-14 1989-03-17 Furukawa Electric Co Ltd Method of mounting component of aluminum conductor circuit substrate
JPH02139465A (ja) * 1988-11-16 1990-05-29 Unitika Ltd カーペットの二次基布用不織布
JPH0621576Y2 (ja) * 1989-04-03 1994-06-08 富士通テン株式会社 コーティング材の塗布装置
JP2800294B2 (ja) * 1989-08-24 1998-09-21 日本電気株式会社 半導体ｉｃの接続方法
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making

Also Published As

Publication number Publication date
EP0546285A1 (de) 1993-06-16
JPH05235243A (ja) 1993-09-10
US5414928A (en) 1995-05-16
JP2522889B2 (ja) 1996-08-07
EP0546285B1 (de) 1997-06-11

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Legal Events

Date Code Title Description
8332 No legal effect for de