DE68920813D1 - Elektronischen Bauelemente ergreifendes Gerät. - Google Patents

Elektronischen Bauelemente ergreifendes Gerät.

Info

Publication number
DE68920813D1
DE68920813D1 DE68920813T DE68920813T DE68920813D1 DE 68920813 D1 DE68920813 D1 DE 68920813D1 DE 68920813 T DE68920813 T DE 68920813T DE 68920813 T DE68920813 T DE 68920813T DE 68920813 D1 DE68920813 D1 DE 68920813D1
Authority
DE
Germany
Prior art keywords
electronic components
device picking
picking
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68920813T
Other languages
English (en)
Other versions
DE68920813T2 (de
Inventor
Yasuo Izumi
Kazumi Ishimoto
Yutaka Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63161605A external-priority patent/JPH0210897A/ja
Priority claimed from JP63184963A external-priority patent/JPH0234999A/ja
Priority claimed from JP63184966A external-priority patent/JPH0234996A/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE68920813D1 publication Critical patent/DE68920813D1/de
Application granted granted Critical
Publication of DE68920813T2 publication Critical patent/DE68920813T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Cleaning By Liquid Or Steam (AREA)
DE68920813T 1988-06-29 1989-06-27 Elektronischen Bauelemente ergreifendes Gerät. Expired - Fee Related DE68920813T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63161605A JPH0210897A (ja) 1988-06-29 1988-06-29 電子部品装着装置
JP63184963A JPH0234999A (ja) 1988-07-25 1988-07-25 部品装着装置及びその清浄方法
JP63184966A JPH0234996A (ja) 1988-07-25 1988-07-25 部品装着装置

Publications (2)

Publication Number Publication Date
DE68920813D1 true DE68920813D1 (de) 1995-03-09
DE68920813T2 DE68920813T2 (de) 1995-05-24

Family

ID=27321887

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68920813T Expired - Fee Related DE68920813T2 (de) 1988-06-29 1989-06-27 Elektronischen Bauelemente ergreifendes Gerät.

Country Status (4)

Country Link
US (1) US5018936A (de)
EP (1) EP0360985B1 (de)
KR (1) KR920000989B1 (de)
DE (1) DE68920813T2 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5289625A (en) * 1989-04-05 1994-03-01 Canon Kabushiki Kaisha Method for supplying articles and apparatus therefor
FR2661310B1 (fr) * 1990-04-20 1996-08-23 Eurosoft Robotique Chargeur de composants pour machine de pose automatique de composants electroniques et procede de reperage et d'identification d'un tel chargeur.
JP2844857B2 (ja) * 1990-06-21 1999-01-13 ソニー株式会社 混成集積回路の製造装置
US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
JP3058708B2 (ja) * 1991-04-09 2000-07-04 松下電器産業株式会社 部品装着機
JP2997338B2 (ja) * 1991-07-01 2000-01-11 株式会社テンリュウテクニックス チップマウンタ
US5179769A (en) * 1991-09-18 1993-01-19 John H. Ferguson, Sr. Vision system for bobbin stripping
US5251946A (en) * 1992-01-21 1993-10-12 Emhart Inc. Compound tool drive
US5878484A (en) * 1992-10-08 1999-03-09 Tdk Corporation Chip-type circuit element mounting apparatus
US6435808B1 (en) 1993-10-06 2002-08-20 Tdk Corporation Chip-type circuit element mounting apparatus
US5590456A (en) * 1994-12-07 1997-01-07 Lucent Technologies Inc. Apparatus for precise alignment and placement of optoelectric components
US5768765A (en) * 1995-02-21 1998-06-23 Samsung Aerospace Industries, Ltd. Component mounting apparatus
DE19536005B4 (de) * 1995-09-28 2006-02-02 INSTITUT FüR MIKROTECHNIK MAINZ GMBH Vorrichtung zum hochgenauen Erfassen und Positionieren von Mikrobauelementen
US5742396A (en) * 1996-06-03 1998-04-21 Motorola, Inc. Method and apparatus for detecting obstructed vacuum nozzles
US5873511A (en) * 1997-05-08 1999-02-23 Shapiro; Herbert M. Apparatus and method for forming solder bonding pads
US5953812A (en) * 1997-07-03 1999-09-21 Schlumberger Technologies, Inc. Misinsert sensing in pick and place tooling
EP0895450B1 (de) * 1997-07-28 2005-11-16 Matsushita Electric Industrial Co., Ltd. Bauteilzuführer und Vorrichtung zur Bestückung
WO1999025168A1 (fr) * 1997-11-10 1999-05-20 Matsushita Electric Industrial Co., Ltd. Appareil de montage de pieces et appareil d'alimentation en pieces
JP3147845B2 (ja) * 1998-02-13 2001-03-19 日本電気株式会社 チップ部品接合装置および方法
DE19823196A1 (de) * 1998-05-23 2000-01-13 Deutsch Zentr Luft & Raumfahrt Verfahren und Einrichtung zur Durchführung von Arbeitsschritten an miniaturisierten Baugruppen
DE19842951C1 (de) * 1998-09-18 2000-06-21 Siemens Nixdorf Inf Syst Bestückungsautomat mit Identifikationseinrichtung für Bauteilegebinde
DE19849720A1 (de) * 1998-10-28 2000-05-04 Bosch Gmbh Robert Verfahren und Greifersystem zur Durchführung des Verfahrens zur präzisen Handhabung und Montage von kleinen Bauteilen
US6571462B1 (en) * 1999-04-27 2003-06-03 Matsushita Electric Industrial Co., Ltd Electronic component mounting apparatus using duplicate sources of components
EP1112482A4 (de) * 1999-07-10 2002-10-23 Semiconductor Tech & Instr Inc Vorrichtung und verfahren zur prüfung nach dem versiegeln
US6203082B1 (en) 1999-07-12 2001-03-20 Rd Automation Mounting apparatus for electronic parts
US6364386B1 (en) 1999-10-27 2002-04-02 Agilent Technologies, Inc. Apparatus and method for handling an integrated circuit
US6889813B1 (en) 2000-06-22 2005-05-10 Amkor Technology, Inc. Material transport method
US6530735B1 (en) 2000-06-22 2003-03-11 Amkor Technology, Inc. Gripper assembly
US6695120B1 (en) * 2000-06-22 2004-02-24 Amkor Technology, Inc. Assembly for transporting material
DE10219771B4 (de) * 2002-05-03 2006-05-11 Emag Ag Vorrichtung zum automatischen Reinigen von in Maschinenkassetten aufgenommenen Vakuumhaltern oder -pipetten
US6974168B2 (en) * 2002-09-30 2005-12-13 Intel Corporation System and method for performing simultaneous precision die bond of photonic components onto a single substrate
JP4384439B2 (ja) * 2002-11-21 2009-12-16 富士機械製造株式会社 対基板作業機、対基板作業システムおよび対基板作業機用作業ヘッド使用準備処理プログラム
DE102005029407B4 (de) * 2005-06-24 2008-06-19 Mühlbauer Ag Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat
US7676061B2 (en) * 2006-05-02 2010-03-09 Telesis Technologies, Inc. Laser safety system
DE102009015496A1 (de) * 2009-03-30 2010-10-07 Siemens Electronics Assembly Systems Gmbh & Co. Kg Verfahren zum Erfassen und Verfolgen von zu bestückenden Elementen
DE102011056029A1 (de) * 2011-12-05 2013-06-06 Rehau Ag + Co Transportverfahren zur Ablage von Fasermatten, Transportvorrichtung sowie eine Vorrichtung zum Greifen eines flächigen Halbzeugs
DE102011056033A1 (de) * 2011-12-05 2013-06-06 Rehau Ag + Co. Vorrichtung zum Greifen eines flächigen Halbzeuges, sowie Transportvorrichtung und Transportverfahren zur Ablage und Lagefixierung von flächigen Halbzeugen
US9539730B2 (en) * 2012-07-10 2017-01-10 Nissan Motor Co., Ltd. Holding apparatus for fuel cell electrolyte membrane
EP2874183A1 (de) * 2013-11-15 2015-05-20 mechatronic Systemtechnik GmbH Vorrichtung zum wenigstens Entleeren eines Transportbehälters
KR20160004818A (ko) * 2014-07-04 2016-01-13 한화테크윈 주식회사 흡착 노즐 및 그 제조 방법
US9701872B2 (en) 2014-09-23 2017-07-11 International Business Machines Corporation Picktip having non-planar topography
DE102019120955B8 (de) * 2019-08-02 2021-03-18 Asm Amicra Microtechnologies Gmbh Bondtool, Bondvorrichtung und Bondverfahren

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4345371A (en) * 1979-03-14 1982-08-24 Sony Corporation Method and apparatus for manufacturing hybrid integrated circuits
FR2541468B1 (fr) * 1983-02-17 1986-07-11 Commissariat Energie Atomique Dispositif d'alignement d'un faisceau laser par l'intermediaire de moyens optiques de visee, procede de reperage de l'axe d'emission du faisceau laser et procede de mise en oeuvre du dispositif, pour controler l'alignement
JPS60171799A (ja) * 1984-02-17 1985-09-05 松下電器産業株式会社 電子部品自動装着装置
DE3688957T2 (de) * 1985-01-21 1994-01-20 Fuji Machine Mfg Verfahren und vorrichtung zum erfassen der halterungsstellung eines elektrischen gerätes und montierungsvorrichtung eines elektronischen gerätes.
US4696101A (en) * 1985-06-07 1987-09-29 Vanzetti Systems, Inc. Method and apparatus for placing and electrically connecting components on a printed circuit board

Also Published As

Publication number Publication date
DE68920813T2 (de) 1995-05-24
KR920000989B1 (ko) 1992-01-31
EP0360985A2 (de) 1990-04-04
KR910002324A (ko) 1991-01-31
EP0360985B1 (de) 1995-01-25
US5018936A (en) 1991-05-28
EP0360985A3 (de) 1991-04-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee