DE3688957T2 - Verfahren und vorrichtung zum erfassen der halterungsstellung eines elektrischen gerätes und montierungsvorrichtung eines elektronischen gerätes. - Google Patents
Verfahren und vorrichtung zum erfassen der halterungsstellung eines elektrischen gerätes und montierungsvorrichtung eines elektronischen gerätes.Info
- Publication number
- DE3688957T2 DE3688957T2 DE86900843T DE3688957T DE3688957T2 DE 3688957 T2 DE3688957 T2 DE 3688957T2 DE 86900843 T DE86900843 T DE 86900843T DE 3688957 T DE3688957 T DE 3688957T DE 3688957 T2 DE3688957 T2 DE 3688957T2
- Authority
- DE
- Germany
- Prior art keywords
- detecting
- holding position
- electrical
- mounting
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/022—Feeding of components with orientation of the elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S294/00—Handling: hand and hoist-line implements
- Y10S294/907—Sensor controlled device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
- Y10T29/49769—Using optical instrument [excludes mere human eyeballing]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
- Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60008809A JPH0736480B2 (ja) | 1985-01-21 | 1985-01-21 | 電子部品の姿勢変更が可能な電子部品装着システム |
JP60008810A JPS61167803A (ja) | 1985-01-21 | 1985-01-21 | 電子部品の保持位置検出方法および装置 |
JP60008811A JPS61168298A (ja) | 1985-01-21 | 1985-01-21 | 電子部品の姿勢変更が可能な電子部品装着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3688957D1 DE3688957D1 (de) | 1993-10-07 |
DE3688957T2 true DE3688957T2 (de) | 1994-01-20 |
Family
ID=27278188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE86900843T Expired - Fee Related DE3688957T2 (de) | 1985-01-21 | 1986-01-20 | Verfahren und vorrichtung zum erfassen der halterungsstellung eines elektrischen gerätes und montierungsvorrichtung eines elektronischen gerätes. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4747198A (de) |
EP (1) | EP0213206B1 (de) |
DE (1) | DE3688957T2 (de) |
WO (1) | WO1986004479A1 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4958297A (en) * | 1986-07-17 | 1990-09-18 | Honeywell Inc. | Apparatus for interfacing video information and computer-generated graphics on a visual display terminal |
JPS6354000A (ja) * | 1986-08-22 | 1988-03-08 | 三洋電機株式会社 | 電子部品の位置検出装置 |
JPH0767033B2 (ja) * | 1987-01-14 | 1995-07-19 | 三洋電機株式会社 | 自動装着装置 |
US4844324A (en) * | 1987-09-29 | 1989-07-04 | Todd Thomas W | Solder system and method of using same |
EP0360985B1 (de) * | 1988-06-29 | 1995-01-25 | Matsushita Electric Industrial Co., Ltd. | Elektronischen Bauelemente ergreifendes Gerät |
DE3823836A1 (de) * | 1988-07-14 | 1990-01-18 | Fraunhofer Ges Forschung | Verfahren zum vermessen von der bestueckung von leiterplatten dienenden bauelementen und einrichtung zur durchfuehrung des verfahrens |
US4951383A (en) * | 1988-11-14 | 1990-08-28 | Sanyo Electric Co., Ltd. | Electronic parts automatic mounting apparatus |
JPH0775817B2 (ja) * | 1989-02-27 | 1995-08-16 | 富士機械製造株式会社 | 電子部品の保持位置検出装置 |
JP2804601B2 (ja) * | 1989-05-31 | 1998-09-30 | 三洋電機株式会社 | 部品供給装置 |
JP2620646B2 (ja) * | 1989-06-07 | 1997-06-18 | 三洋電機株式会社 | 電子部品自動装着装置 |
JP2503082B2 (ja) * | 1989-09-05 | 1996-06-05 | 富士機械製造株式会社 | 電子部品装着装置 |
JPH03160799A (ja) * | 1989-11-17 | 1991-07-10 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
JP2589411B2 (ja) * | 1990-12-27 | 1997-03-12 | シャープ株式会社 | チップ位置検出方法 |
US5278634A (en) | 1991-02-22 | 1994-01-11 | Cyberoptics Corporation | High precision component alignment sensor system |
US5381508A (en) * | 1993-08-25 | 1995-01-10 | Krumenacher; Paul F. | Suction and light guide assembly |
JPH08279697A (ja) * | 1995-04-10 | 1996-10-22 | Fuji Mach Mfg Co Ltd | 電子部品装着ヘッド,電子部品装着装置および電子部品装着方法 |
JP3472404B2 (ja) * | 1996-03-15 | 2003-12-02 | 富士機械製造株式会社 | 電子部品供給装置 |
JPH1068759A (ja) * | 1996-05-31 | 1998-03-10 | Advantest Corp | 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法 |
JP4079471B2 (ja) * | 1996-09-17 | 2008-04-23 | 松下電器産業株式会社 | 電子部品装着機および電子部品実装方法 |
JP3523972B2 (ja) * | 1996-12-26 | 2004-04-26 | 松下電器産業株式会社 | 部品実装方法及び部品実装装置 |
JP4167790B2 (ja) * | 2000-03-10 | 2008-10-22 | 東レエンジニアリング株式会社 | チップ実装装置 |
US7096572B2 (en) * | 2000-05-23 | 2006-08-29 | Siemens Aktiengesellschaft | Device for fitting substrates with electric components |
JP4620285B2 (ja) * | 2001-05-14 | 2011-01-26 | 富士機械製造株式会社 | 電気部品装着システムの運転方法 |
JP2003092492A (ja) * | 2001-09-18 | 2003-03-28 | Fuji Mach Mfg Co Ltd | 部品供給装置および部品供給方法 |
US7746481B2 (en) | 2007-03-20 | 2010-06-29 | Cyberoptics Corporation | Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam |
WO2008153885A1 (en) * | 2007-06-05 | 2008-12-18 | Cyberoptics Corporation | Component sensor for pick and place machine using improved shadow imaging |
DE102012014558B4 (de) * | 2012-07-24 | 2014-02-20 | Datacon Technology Gmbh | Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung |
JP6398082B2 (ja) * | 2015-02-26 | 2018-10-03 | パナソニックIpマネジメント株式会社 | 部品実装方法および部品実装装置 |
CN108262700B (zh) * | 2016-12-29 | 2020-06-09 | 联创汽车电子有限公司 | 电子控制器夹持装置 |
CN107891259A (zh) * | 2017-10-26 | 2018-04-10 | 江西宝群电子科技有限公司 | 一种膜片精确单张取料装置 |
CN107966450B (zh) * | 2017-12-12 | 2018-11-20 | 宁波格劳博机器人有限公司 | 电池极片涂布外观缺陷检测分选系统 |
TWI706698B (zh) * | 2018-12-19 | 2020-10-01 | 鴻勁精密股份有限公司 | 電子元件作業機構及其應用之作業設備 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5130700A (ja) * | 1974-09-07 | 1976-03-16 | Toyoda Machine Works Ltd | Nejishimetsukesochi |
JPS52135165A (en) * | 1976-05-07 | 1977-11-11 | Ntn Toyo Bearing Co Ltd | Robbot apparatus for article having through hole |
JPS5924439Y2 (ja) * | 1979-04-17 | 1984-07-19 | セイコ−精機株式会社 | ドライビングフイクスチヤ |
CH638072A5 (fr) * | 1980-05-19 | 1983-08-31 | Far Fab Assortiments Reunies | Procede et dispositif de report d'un composant electronique sur un substrat. |
US4342090A (en) * | 1980-06-27 | 1982-07-27 | International Business Machines Corp. | Batch chip placement system |
JPS57164310A (en) | 1981-04-03 | 1982-10-08 | Hitachi Ltd | Automatic assembling device |
JPS58213496A (ja) | 1982-06-07 | 1983-12-12 | 株式会社日立製作所 | 部品実装装置 |
JPS5924439A (ja) * | 1982-07-31 | 1984-02-08 | Konishiroku Photo Ind Co Ltd | 磁気記録媒体 |
JPS5928399A (ja) * | 1982-08-09 | 1984-02-15 | 三洋電機株式会社 | 電子部品装着装置 |
US4529315A (en) * | 1983-01-28 | 1985-07-16 | Westinghouse Electric Corp. | Multi-channel position detection system |
US4628464A (en) * | 1983-10-07 | 1986-12-09 | Westinghouse Electric Corp. | Robotic system for mounting electrical components |
DE3474750D1 (en) * | 1983-11-05 | 1988-11-24 | Zevatech Ag | Method and device positioning elements on a work piece |
US4598456A (en) * | 1984-10-19 | 1986-07-08 | Westinghouse Electric Corp. | Assembly system for electronic circuit boards |
JPS61152100A (ja) * | 1984-12-26 | 1986-07-10 | ティーディーケイ株式会社 | 電子部品装着装置及びその方法 |
ATE41283T1 (de) * | 1985-01-08 | 1989-03-15 | Siemens Ag | Sensor zur bauteilbestueckung. |
-
1986
- 1986-01-20 US US06/908,017 patent/US4747198A/en not_active Ceased
- 1986-01-20 DE DE86900843T patent/DE3688957T2/de not_active Expired - Fee Related
- 1986-01-20 WO PCT/JP1986/000020 patent/WO1986004479A1/ja active IP Right Grant
- 1986-01-20 EP EP86900843A patent/EP0213206B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0213206A1 (de) | 1987-03-11 |
EP0213206A4 (de) | 1989-03-02 |
DE3688957D1 (de) | 1993-10-07 |
WO1986004479A1 (en) | 1986-07-31 |
EP0213206B1 (de) | 1993-09-01 |
US4747198A (en) | 1988-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |