DE3785978T2 - Gerät zum Feststellen der räumlichen Anordnung eines elektronischen Bauteils. - Google Patents

Gerät zum Feststellen der räumlichen Anordnung eines elektronischen Bauteils.

Info

Publication number
DE3785978T2
DE3785978T2 DE87112051T DE3785978T DE3785978T2 DE 3785978 T2 DE3785978 T2 DE 3785978T2 DE 87112051 T DE87112051 T DE 87112051T DE 3785978 T DE3785978 T DE 3785978T DE 3785978 T2 DE3785978 T2 DE 3785978T2
Authority
DE
Germany
Prior art keywords
determining
electronic component
spatial arrangement
spatial
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE87112051T
Other languages
English (en)
Other versions
DE3785978D1 (de
Inventor
Mohara Masayuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Instruments Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of DE3785978D1 publication Critical patent/DE3785978D1/de
Application granted granted Critical
Publication of DE3785978T2 publication Critical patent/DE3785978T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53087Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53261Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE87112051T 1986-08-22 1987-08-19 Gerät zum Feststellen der räumlichen Anordnung eines elektronischen Bauteils. Expired - Lifetime DE3785978T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61197907A JPS6354000A (ja) 1986-08-22 1986-08-22 電子部品の位置検出装置

Publications (2)

Publication Number Publication Date
DE3785978D1 DE3785978D1 (de) 1993-07-01
DE3785978T2 true DE3785978T2 (de) 1993-12-02

Family

ID=16382261

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87112051T Expired - Lifetime DE3785978T2 (de) 1986-08-22 1987-08-19 Gerät zum Feststellen der räumlichen Anordnung eines elektronischen Bauteils.

Country Status (4)

Country Link
US (1) US4867569A (de)
EP (1) EP0257553B1 (de)
JP (1) JPS6354000A (de)
DE (1) DE3785978T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19921906A1 (de) * 1999-05-12 2000-11-23 Hella Kg Hueck & Co Beleuchtungseinrichtung für ein LC-Display

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244560Y2 (de) * 1987-04-03 1990-11-27
CA1285661C (en) * 1988-08-19 1991-07-02 Randy Tsang Automatic visual measurement of surface mount device placement
US4951383A (en) * 1988-11-14 1990-08-28 Sanyo Electric Co., Ltd. Electronic parts automatic mounting apparatus
JPH03212999A (ja) * 1990-01-18 1991-09-18 Yamagata Kashio Kk 電子部品搭載作業装置
US5044072A (en) * 1990-04-13 1991-09-03 Air-Vac Engineering Company, Inc. Vision system apparatus and method for component/pad alignment
JPH07105637B2 (ja) * 1990-05-31 1995-11-13 三洋電機株式会社 部品装着装置
JPH04269607A (ja) * 1991-02-25 1992-09-25 Mitsui Eng & Shipbuild Co Ltd 物体の寸法計測装置
US5195234A (en) * 1991-08-19 1993-03-23 Motorola, Inc. Method and apparatus for visual alignment of parts
JP2586709Y2 (ja) * 1991-10-07 1998-12-09 三洋電機株式会社 電子部品の位置検出装置
US5304773A (en) * 1992-02-19 1994-04-19 Trumpf Inc. Laser work station with optical sensor for calibration of guidance system
DE4209524A1 (de) * 1992-03-24 1993-09-30 Siemens Ag Verfahren zur Lageerkennung und/oder Teilungsprüfung und/oder Koplanaritätsprüfung der Anschlüsse von Bauelementen und Bestückkopf für die automatische Bestückung von Bauelementen
JP3114034B2 (ja) * 1992-06-05 2000-12-04 ヤマハ発動機株式会社 部品実装方法及び部品実装装置
US5214841A (en) * 1992-09-23 1993-06-01 Emhart Inc. Machine for placing surface mount components
JP3242492B2 (ja) * 1993-06-14 2001-12-25 ヤマハ発動機株式会社 実装機の部品認識装置
US5793121A (en) * 1994-01-03 1998-08-11 Electro Mechanical Products, Inc. Low resistance current interrupter
JPH08139499A (ja) * 1994-11-11 1996-05-31 Yamaha Motor Co Ltd 円筒状部品の認識方法
EP0727936A1 (de) * 1995-02-20 1996-08-21 Yamaha Hatsudoki Kabushiki Kaisha Vorrichtung zur Erkennung eines Werkstückes
TW326619B (en) * 1996-03-15 1998-02-11 Matsushita Electric Ind Co Ltd Electronic part mounting apparatus and method thereof
US5953812A (en) * 1997-07-03 1999-09-21 Schlumberger Technologies, Inc. Misinsert sensing in pick and place tooling
DE19823938C1 (de) 1998-05-28 2000-02-10 Siemens Ag Verfahren und Vorrichtung zum linearen Positionieren und zur Lageerkennung eines Substrates
JP3678007B2 (ja) * 1998-07-10 2005-08-03 松下電器産業株式会社 電子部品実装装置における電子部品認識装置および電子部品認識方法
JP4353567B2 (ja) 1999-01-28 2009-10-28 富士機械製造株式会社 保持装置および撮像方法
US6203082B1 (en) 1999-07-12 2001-03-20 Rd Automation Mounting apparatus for electronic parts
JP4122187B2 (ja) * 2002-08-08 2008-07-23 松下電器産業株式会社 照明装置、及びこれを備えた認識装置並びに部品実装装置
JP4041768B2 (ja) * 2002-09-12 2008-01-30 松下電器産業株式会社 部品装着ヘッド
WO2009096119A1 (ja) * 2008-01-29 2009-08-06 Advantest Corporation 電子部品ハンドリング装置および電子部品の位置検出方法
JP5584651B2 (ja) * 2011-05-12 2014-09-03 ヤマハ発動機株式会社 吸着状態検査装置、表面実装機及び部品試験装置
CN102685288A (zh) * 2012-04-27 2012-09-19 昆山威茂电子科技有限公司 一种手机产品检验设备
US10620608B2 (en) * 2017-03-07 2020-04-14 Raytheon Company Collet contrast disk

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1925215A1 (de) * 1969-05-17 1970-11-26 Philips Patentverwaltung Anordnung zum selbsttaetigen Kontaktieren der Verbindungsdraehte an Halbleiterdioden
DE2643810C2 (de) * 1976-09-29 1983-08-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Einjustieren
JPS57103399A (en) * 1980-12-18 1982-06-26 Matsushita Electric Ind Co Ltd Device for mounting and inspecting leadless electronic part
US4575637A (en) * 1983-07-28 1986-03-11 Polaroid Corporation Part positioning system employing a mask and photodetector array
US4628464A (en) * 1983-10-07 1986-12-09 Westinghouse Electric Corp. Robotic system for mounting electrical components
JPS60103700A (ja) * 1983-11-11 1985-06-07 株式会社日立製作所 部品の位置決め装置
US4747198A (en) * 1985-01-21 1988-05-31 Fuji Machine Mfg. Co., Ltd. Method and apparatus for detecting hold-position of electronic component, and apparatus for mounting electronic component
JPH0797019B2 (ja) * 1986-06-12 1995-10-18 松下電器産業株式会社 部品認識用照明方法及びその装置
JPH103700A (ja) * 1996-06-18 1998-01-06 Sony Miyuujitsuku Entertainment:Kk 金属膜を有する光ディスクの不良化方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19921906A1 (de) * 1999-05-12 2000-11-23 Hella Kg Hueck & Co Beleuchtungseinrichtung für ein LC-Display

Also Published As

Publication number Publication date
JPS6354000A (ja) 1988-03-08
EP0257553B1 (de) 1993-05-26
JPH0446000B2 (de) 1992-07-28
DE3785978D1 (de) 1993-07-01
US4867569A (en) 1989-09-19
EP0257553A3 (en) 1988-10-26
EP0257553A2 (de) 1988-03-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HITACHI HIGH-TECH INSTRUMENTS CO., LTD., GUNMA, JP