ES2075337T3 - Dispositivo electronico que emplea un adhesivo conductivo. - Google Patents

Dispositivo electronico que emplea un adhesivo conductivo.

Info

Publication number
ES2075337T3
ES2075337T3 ES91300162T ES91300162T ES2075337T3 ES 2075337 T3 ES2075337 T3 ES 2075337T3 ES 91300162 T ES91300162 T ES 91300162T ES 91300162 T ES91300162 T ES 91300162T ES 2075337 T3 ES2075337 T3 ES 2075337T3
Authority
ES
Spain
Prior art keywords
conductive
adhesive
circuit
electronic device
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91300162T
Other languages
English (en)
Inventor
Don A Arneson
Todd A Hester
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Molex LLC
Original Assignee
Molex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex LLC filed Critical Molex LLC
Application granted granted Critical
Publication of ES2075337T3 publication Critical patent/ES2075337T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

UN ADITAMENTO ELECTRONICO (10) EL CUAL INCLUYE UNA LAMINA (12) QUE TIENE ENCIMA UN PASO CONDUCTIVO. EL ADHESIVO (18) ES DEPOSITADO EN EL PASO CONDUCTIVO (14), ESTE ADHESIVO INCLUYE UNA BASE NO CONDUCTIVA LO SUFICIENTEMENTE ESPACIADA PARA LA CONDUCCION DE PARTICULAS (22). UN COMPONENTE DEL CIRCUITO (20) ES INTRODUCIDO A TRAVES DEL ADHESIVO (18), Y LA LAMINA DEL CIRCUITO (12), QUEDANDO LA VIA CONDUCTIVA, LA CUAL SE LLEVA UNA PORCION DEL ADHESIVO (18) QUE ESTA ENTRE EL COMPONENTE DEL CIRCUITO (20) Y LA VIA CONDUCTIVA. ASI, LA PORCION COLOCADA (30) DEL ADHESIVO (18) ES COMPRIMIDA PARA ESTABLECER CONTACTO ENTRE LAS PARTICULAS CONDUCTIVAS Y LOS COMPONENTES DEL CIRCUITO (2) Y LA VIA CONDUCTORA (14), DEJANDO AL ADHESIVO (18) CON SOLO UNA PORCION EN SU ESTADO NO CONDUCTIVO.
ES91300162T 1990-01-22 1991-01-10 Dispositivo electronico que emplea un adhesivo conductivo. Expired - Lifetime ES2075337T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/468,458 US4970624A (en) 1990-01-22 1990-01-22 Electronic device employing a conductive adhesive

Publications (1)

Publication Number Publication Date
ES2075337T3 true ES2075337T3 (es) 1995-10-01

Family

ID=23859897

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91300162T Expired - Lifetime ES2075337T3 (es) 1990-01-22 1991-01-10 Dispositivo electronico que emplea un adhesivo conductivo.

Country Status (4)

Country Link
US (1) US4970624A (es)
EP (1) EP0439256B1 (es)
DE (1) DE69111834T2 (es)
ES (1) ES2075337T3 (es)

Families Citing this family (40)

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NL8800901A (nl) * 1988-04-08 1989-11-01 Philips Nv Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie.
US5270903A (en) * 1990-09-10 1993-12-14 Codex Corporation Printed circuit board manufacturing method accommodates wave soldering and press fitting of components
US5197889A (en) * 1992-02-03 1993-03-30 Motorola, Inc. Electrical contact for battery package or similar device
US5604831A (en) * 1992-11-16 1997-02-18 International Business Machines Corporation Optical module with fluxless laser reflow soldered joints
US5295214A (en) * 1992-11-16 1994-03-15 International Business Machines Corporation Optical module with tolerant wave soldered joints
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
DE4326443C2 (de) * 1993-08-06 1996-06-05 Telefunken Microelectron Folientastatur mit bedrahtetem Bauelement
US5751514A (en) * 1993-09-09 1998-05-12 Western Digital Corporation Intelligent disk drive having spring contacts on a board assembly for connecting to exterior-facing electrical contacts coupled to a spindle motor
US5488539A (en) * 1994-01-21 1996-01-30 Sun Microsystems, Inc. Protecting cot packaged ICs during wave solder operations
US5384435A (en) * 1994-01-28 1995-01-24 Molex Incorporated Mounting terminal pins in substrates
US5456616A (en) * 1994-02-04 1995-10-10 Molex Incorporated Electrical device employing a flat flexible circuit
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5983492A (en) * 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
US5605477A (en) * 1995-01-13 1997-02-25 The Whitaker Corporation Flexible etched circuit assembly
US5514839A (en) * 1995-02-09 1996-05-07 Honeywell Inc. Weldable flexible circuit termination for high temperature applications
US5548488A (en) * 1995-04-03 1996-08-20 Prince Corporation Electrical componet mounting system
US5736679A (en) * 1995-12-26 1998-04-07 International Business Machines Corporation Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board
US6083340A (en) * 1997-02-28 2000-07-04 Hokuriku Electric Industry Co., Ltd. Process for manufacturing a multi-layer circuit board
US6086384A (en) * 1997-08-22 2000-07-11 Molex Incorporated Method of fabricating electronic device employing a flat flexible circuit and including the device itself
US6723928B1 (en) 1997-09-29 2004-04-20 Molex Incorporated Terminal pins mounted in flexible substrates
US6030234A (en) * 1998-01-23 2000-02-29 Molex Incorporated Terminal pins mounted in flexible substrates
SE9900163D0 (sv) * 1999-01-20 1999-01-20 Piezomotors Uppsala Ab Flexible printed circuit board arrangement
WO2002101730A2 (en) * 2001-06-08 2002-12-19 Seagate Technology Llc Attachment of a head-gimbal assembly to a printed circuit board actuator arm using z-axis conductive adhesive film
US6781088B2 (en) * 2002-09-12 2004-08-24 Wilson Greatbatch Technologies, Inc. Pin to thin plate joint and method for making the joint
US6808422B2 (en) * 2003-03-19 2004-10-26 Delphi Technologies, Inc. Filter insert for an electrical connector assembly
DE10344261A1 (de) 2003-09-23 2005-05-04 Endress & Hauser Gmbh & Co Kg Leiterplatte mit einer Haltevorrichtung zum Halten bedrahteter elektronischer Bauteile, Verfahren zur Herstellung einer solchen Leiterplatte und deren Verwendung in einem Lötofen
DE102004037786A1 (de) * 2004-08-03 2006-03-16 Endress + Hauser Gmbh + Co. Kg Leiterplatte mit SMD-Bauteilen und mindestens einem bedrahteten Bauteil sowie ein Verfahren zum Bestücken, Befestigen
DE102004057505B4 (de) * 2004-11-29 2008-08-21 Lisa Dräxlmaier GmbH Elektrisches Funktionsbauteil
US20070096132A1 (en) * 2005-11-01 2007-05-03 Jiahn-Chang Wu Coaxial LED lighting board
KR100757910B1 (ko) * 2006-07-06 2007-09-11 삼성전기주식회사 매립패턴기판 및 그 제조방법
US7876577B2 (en) * 2007-03-12 2011-01-25 Tyco Electronics Corporation System for attaching electronic components to molded interconnection devices
JP2009199809A (ja) * 2008-02-20 2009-09-03 Mitsumi Electric Co Ltd コネクタ、光伝送モジュールおよび光−電気伝送モジュール
JP5373809B2 (ja) * 2008-10-21 2013-12-18 株式会社旭電化研究所 メスコネクタ、それに組付けるオスコネクタ、それらを用いた電気・電子機器
TWM383720U (en) * 2009-12-08 2010-07-01 Cooler Master Co Ltd Heat dissipation plate
TWM494399U (zh) * 2014-04-02 2015-01-21 Hon Hai Prec Ind Co Ltd 電連接器
US20160103146A1 (en) * 2014-10-09 2016-04-14 Continental Automotive Systems, Inc. Arrangement and method for connecting electronic components to a terminal for a sensor assembly
KR102139755B1 (ko) 2015-01-22 2020-07-31 삼성전기주식회사 인쇄회로기판 및 그 제조방법
EP3709777A1 (en) * 2019-03-11 2020-09-16 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Solder-free component carrier connection using an elastic element, and method
EP3737215A1 (en) 2019-05-10 2020-11-11 BIOTRONIK SE & Co. KG Method for connecting a connector pin to a printed circuit board

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US4024627A (en) * 1974-04-29 1977-05-24 Amp Incorporated Package mounting of electronic chips, such as light emitting diodes
US4185378A (en) * 1978-02-10 1980-01-29 Chuo Meiban Mfg. Co., LTD. Method for attaching component leads to printed circuit base boards and printed circuit base board advantageously used for working said method
US4642421A (en) * 1984-10-04 1987-02-10 Amp Incorporated Adhesive electrical interconnecting means
US4667401A (en) * 1985-11-26 1987-05-26 Clements James R Method of making an electronic device using an uniaxial conductive adhesive
GB2203442B (en) * 1987-04-14 1991-10-16 James Robert Clements Electronic device including uniaxial conductive adhesive and method of making same

Also Published As

Publication number Publication date
EP0439256B1 (en) 1995-08-09
US4970624A (en) 1990-11-13
DE69111834D1 (de) 1995-09-14
DE69111834T2 (de) 1996-05-02
EP0439256A1 (en) 1991-07-31

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