DE69300850T2 - Verfahren zum Montieren von Komponenten und Vorrichtung dafür. - Google Patents
Verfahren zum Montieren von Komponenten und Vorrichtung dafür.Info
- Publication number
- DE69300850T2 DE69300850T2 DE69300850T DE69300850T DE69300850T2 DE 69300850 T2 DE69300850 T2 DE 69300850T2 DE 69300850 T DE69300850 T DE 69300850T DE 69300850 T DE69300850 T DE 69300850T DE 69300850 T2 DE69300850 T2 DE 69300850T2
- Authority
- DE
- Germany
- Prior art keywords
- device therefor
- assembling components
- assembling
- components
- therefor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4174387A JP2659651B2 (ja) | 1992-07-01 | 1992-07-01 | 部品実装方法及び装置 |
JP4211838A JP2600044B2 (ja) | 1992-08-07 | 1992-08-07 | 部品装着方法及び同装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69300850D1 DE69300850D1 (de) | 1996-01-04 |
DE69300850T2 true DE69300850T2 (de) | 1996-03-28 |
Family
ID=26496018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69300850T Expired - Lifetime DE69300850T2 (de) | 1992-07-01 | 1993-07-01 | Verfahren zum Montieren von Komponenten und Vorrichtung dafür. |
Country Status (3)
Country | Link |
---|---|
US (2) | US5377405A (de) |
EP (1) | EP0578136B1 (de) |
DE (1) | DE69300850T2 (de) |
Families Citing this family (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100329586B1 (ko) * | 1993-10-29 | 2002-09-19 | 산요 덴키 가부시키가이샤 | 전자부품자동장착장치및전자부품의장착방법 |
JP3090567B2 (ja) * | 1993-12-29 | 2000-09-25 | ヤマハ発動機株式会社 | 実装機における部品認識方法および同装置 |
DE69416980T2 (de) * | 1993-12-27 | 1999-07-01 | Yamaha Motor Co Ltd | Verfahren und Montagevorrichtung zum Montieren eines Bauelementes auf eine spezifische Position |
JPH07212096A (ja) * | 1994-01-21 | 1995-08-11 | Yamaha Motor Co Ltd | 実装機の部品認識装置 |
KR100367272B1 (ko) * | 1994-08-11 | 2003-03-15 | 사이버옵틱스 코포레이션 | 부품정렬센서및부품검출시스템 |
JPH08162797A (ja) * | 1994-12-08 | 1996-06-21 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
JP2937785B2 (ja) * | 1995-02-02 | 1999-08-23 | ヤマハ発動機株式会社 | 実装機の部品状態検出装置 |
JP2993398B2 (ja) * | 1995-05-31 | 1999-12-20 | ニチデン機械株式会社 | ピックアップ装置及びピックアップ方法 |
US5946409A (en) * | 1995-05-31 | 1999-08-31 | Nec Corporation | Pick-up apparatus and method for semiconductor devices |
CN1099226C (zh) * | 1995-07-12 | 2003-01-15 | 松下电器产业株式会社 | 电子零部件装配方法和装置 |
JP3196626B2 (ja) * | 1995-12-26 | 2001-08-06 | ソニー株式会社 | 部品実装方法 |
US6119336A (en) * | 1996-09-26 | 2000-09-19 | Matsushita Electric Industrial Co., Ltd. | Electronic component sucking method |
JP3502228B2 (ja) * | 1996-09-27 | 2004-03-02 | サンデン株式会社 | 低温庫 |
JP3358462B2 (ja) * | 1996-09-27 | 2002-12-16 | 松下電器産業株式会社 | 電子部品実装方法 |
JP3358464B2 (ja) * | 1996-10-11 | 2002-12-16 | 松下電器産業株式会社 | 電子部品実装方法 |
JP3914602B2 (ja) * | 1997-01-06 | 2007-05-16 | 松下電器産業株式会社 | 電子部品実装装置におけるノズル交換方法 |
IT1291779B1 (it) | 1997-02-17 | 1999-01-21 | Magnetek Spa | Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti |
JP3907786B2 (ja) | 1997-06-16 | 2007-04-18 | 松下電器産業株式会社 | 電子部品実装方法及び装置 |
US5910878A (en) * | 1997-06-26 | 1999-06-08 | International Business Machines Corporation | Method and apparatus for protecting electrical devices from static electricity |
US6016949A (en) * | 1997-07-01 | 2000-01-25 | International Business Machines Corporation | Integrated placement and soldering pickup head and method of using |
US6346988B1 (en) | 1997-08-01 | 2002-02-12 | Hama Sensors, Inc. | Laser position array optical measuring system and method |
JP3596243B2 (ja) * | 1997-08-07 | 2004-12-02 | 松下電器産業株式会社 | 電子部品実装方法 |
US6085407A (en) * | 1997-08-21 | 2000-07-11 | Micron Technology, Inc. | Component alignment apparatuses and methods |
US6276051B1 (en) * | 1998-01-29 | 2001-08-21 | Fuji Machine Mfg. Co., Ltd. | Electric-component transferring apparatus |
JPH11251792A (ja) | 1998-03-03 | 1999-09-17 | Matsushita Electric Ind Co Ltd | 電子部品装着機 |
JP4303345B2 (ja) * | 1998-03-12 | 2009-07-29 | Juki株式会社 | 表面実装部品搭載機 |
US6633663B1 (en) * | 1998-05-05 | 2003-10-14 | International Business Machines Corporation | Method and system for determining component dimensional information |
US6538750B1 (en) | 1998-05-22 | 2003-03-25 | Cyberoptics Corporation | Rotary sensor system with a single detector |
US6292261B1 (en) | 1998-05-22 | 2001-09-18 | Cyberoptics Corporation | Rotary sensor system with at least two detectors |
JP3659003B2 (ja) * | 1998-07-03 | 2005-06-15 | 松下電器産業株式会社 | 電子部品実装方法 |
US6701610B1 (en) * | 1998-07-28 | 2004-03-09 | Koninklijke Philips Electronics N.V. | Pick and place machine with varied nozzle lengths |
WO2000008588A2 (en) | 1998-08-04 | 2000-02-17 | Cyberoptics Corporation | Enhanced sensor |
JP4428865B2 (ja) | 1998-10-30 | 2010-03-10 | サイバーオプティクス コーポレーション | 多ノズル配置整列センサ内のグリントを制御するために改良された方法および装置 |
US6639239B2 (en) | 1998-10-30 | 2003-10-28 | Cyberoptics Corporation | Angle rejection filter |
US6608320B1 (en) | 1998-11-05 | 2003-08-19 | Cyberoptics Corporation | Electronics assembly apparatus with height sensing sensor |
JP3506952B2 (ja) * | 1999-05-28 | 2004-03-15 | 株式会社大橋製作所 | 電気部品の位置出し供給方法及びその装置 |
KR100328345B1 (ko) * | 1999-09-01 | 2002-03-12 | 정문술 | 표면실장장치 및 그 실장방법 |
WO2001019156A1 (fr) * | 1999-09-02 | 2001-03-15 | Matsushita Electric Industrial Co., Ltd. | Procede et dispositif d'identification et de montage de pieces |
DE60024375T2 (de) * | 1999-09-03 | 2006-06-14 | Matsushita Electric Ind Co Ltd | Bauteilen-bestückungsverfahren und Einrichtung |
EP1816906B1 (de) * | 1999-09-27 | 2008-07-16 | Matsushita Electric Industrial Co., Ltd. | Bestückungsverfahren und Bestückungsvorrichtung |
US6538244B1 (en) | 1999-11-03 | 2003-03-25 | Cyberoptics Corporation | Pick and place machine with improved vision system including a linescan sensor |
JP4480840B2 (ja) * | 2000-03-23 | 2010-06-16 | パナソニック株式会社 | 部品実装装置、及び部品実装方法 |
KR100348400B1 (ko) | 2000-05-20 | 2002-08-10 | 미래산업 주식회사 | 표면실장장치의 모듈헤드의 노즐회전장치 |
US6535291B1 (en) | 2000-06-07 | 2003-03-18 | Cyberoptics Corporation | Calibration methods for placement machines incorporating on-head linescan sensing |
KR20010114161A (ko) * | 2000-06-21 | 2001-12-29 | 마츠시타 덴끼 산교 가부시키가이샤 | 부품의 장착 장치 및 장착 방법 |
US6718630B2 (en) * | 2000-09-18 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting components on substrate |
WO2002026011A2 (en) * | 2000-09-19 | 2002-03-28 | Matsushita Electric Industrial Co., Ltd. | Component suction device, component mounting apparatus and component mounting method |
US6762847B2 (en) | 2001-01-22 | 2004-07-13 | Cyberoptics Corporation | Laser align sensor with sequencing light sources |
US6909515B2 (en) | 2001-01-22 | 2005-06-21 | Cyberoptics Corporation | Multiple source alignment sensor with improved optics |
AT414077B (de) * | 2001-08-14 | 2006-08-15 | Datacon Semiconductor Equip | Verfahren und einrichtung zur positionsveränderung von elektronischen bauteilen |
US7813559B2 (en) | 2001-11-13 | 2010-10-12 | Cyberoptics Corporation | Image analysis for pick and place machines with in situ component placement inspection |
US7555831B2 (en) * | 2001-11-13 | 2009-07-07 | Cyberoptics Corporation | Method of validating component feeder exchanges |
US7239399B2 (en) * | 2001-11-13 | 2007-07-03 | Cyberoptics Corporation | Pick and place machine with component placement inspection |
US6874225B2 (en) * | 2001-12-18 | 2005-04-05 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus |
EP1541001B1 (de) * | 2002-09-13 | 2006-01-11 | Matsushita Electric Industrial Co., Ltd. | Bestückungskopf und ursprungserkennung von dem bestückungskopf |
US20070135309A1 (en) * | 2002-12-10 | 2007-06-14 | Michael Swab | Feeder cart used to integrate feeder mechanisms and surface mount machines of varying types |
TW200419640A (en) * | 2003-02-25 | 2004-10-01 | Matsushita Electric Ind Co Ltd | Electronic component placement machine and electronic component placement method |
US7322981B2 (en) * | 2003-08-28 | 2008-01-29 | Jackson Roger P | Polyaxial bone screw with split retainer ring |
US7761977B2 (en) * | 2003-07-03 | 2010-07-27 | Assembleon N.V. | Component placement device |
DE112004001261B4 (de) * | 2003-08-04 | 2021-08-12 | Assembléon N.V. | Verfahren zum aufnehmen von bauelementen mit hilfe einer bauelementbestückungsvorrichtung |
US7559134B2 (en) * | 2003-11-04 | 2009-07-14 | Cyberoptics Corporation | Pick and place machine with improved component placement inspection |
US7706595B2 (en) * | 2003-11-07 | 2010-04-27 | Cyberoptics Corporation | Pick and place machine with workpiece motion inspection |
US20050125993A1 (en) * | 2003-11-07 | 2005-06-16 | Madsen David D. | Pick and place machine with improved setup and operation procedure |
US20060016066A1 (en) * | 2004-07-21 | 2006-01-26 | Cyberoptics Corporation | Pick and place machine with improved inspection |
US20060075631A1 (en) * | 2004-10-05 | 2006-04-13 | Case Steven K | Pick and place machine with improved component pick up inspection |
US7630465B2 (en) * | 2004-11-23 | 2009-12-08 | Harris Corporation | Wireless communications device providing time and frequency-domain channel estimates interpolation and related methods |
DE102005054921A1 (de) * | 2004-12-13 | 2006-06-22 | Assembléon N.V. | Berührungslose Schnittstelle für Bestückungsmaschinen |
US20070003126A1 (en) * | 2005-05-19 | 2007-01-04 | Case Steven K | Method and apparatus for evaluating a component pick action in an electronics assembly machine |
WO2007015561A1 (en) * | 2005-08-02 | 2007-02-08 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounter and mounting method |
JP4896136B2 (ja) * | 2005-09-14 | 2012-03-14 | サイバーオプティクス コーポレーション | 改善された構成部品ピックイメージ処理を備えたピックアンドプレース機 |
WO2007048445A1 (de) * | 2005-10-26 | 2007-05-03 | Alphasem Gmbh | Verfahren und vorrichtung zum ablegen von elektronischen bauteilen, insbesondere halbleiterchips auf einem substrat |
US20070130755A1 (en) * | 2005-10-31 | 2007-06-14 | Duquette David W | Electronics assembly machine with embedded solder paste inspection |
US20070276867A1 (en) * | 2006-05-23 | 2007-11-29 | David Fishbaine | Embedded inspection image archival for electronics assembly machines |
KR20080060415A (ko) * | 2006-12-27 | 2008-07-02 | 미래산업 주식회사 | 핸들러의 전자부품 픽커 |
WO2008115532A1 (en) | 2007-03-20 | 2008-09-25 | Cyberoptics Corporation | Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam |
WO2008153885A1 (en) * | 2007-06-05 | 2008-12-18 | Cyberoptics Corporation | Component sensor for pick and place machine using improved shadow imaging |
JP2009124019A (ja) * | 2007-11-16 | 2009-06-04 | Fujitsu Ltd | 基板ユニットの製造方法及びマウンタ装置 |
KR101519602B1 (ko) * | 2010-03-03 | 2015-05-14 | 삼성테크윈 주식회사 | 헤드 노즐 유닛, 전자 부품 실장 장치 및 전자 부품 실장 방법 |
EP2822373B1 (de) * | 2012-02-28 | 2019-01-09 | FUJI Corporation | Maschine zur montage von komponenten |
WO2015063934A1 (ja) * | 2013-10-31 | 2015-05-07 | 富士機械製造株式会社 | 部品装着機 |
CN103681417B (zh) * | 2013-12-18 | 2016-05-25 | 大连佳峰电子有限公司 | 一种半导体装片直流电机驱动平台 |
US11129315B2 (en) * | 2017-03-28 | 2021-09-21 | Fuji Corporation | Component mounter |
CN115319432B (zh) * | 2022-08-23 | 2023-08-11 | 四川朵唯智能云谷有限公司 | 一种可进行组装检测的自上料式手表机芯齿轮装配设备 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8103574A (nl) * | 1981-07-29 | 1983-02-16 | Philips Nv | Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat. |
EP0144717B1 (de) * | 1983-11-05 | 1988-10-19 | Zevatech AG | Verfahren und Vorrichtung zur Positionierung von Bauteilen auf einem Werkstück |
JP2537770B2 (ja) * | 1984-08-31 | 1996-09-25 | 松下電器産業株式会社 | 電子部品の装着方法 |
DE3532500C2 (de) * | 1984-09-17 | 1996-03-14 | Tdk Corp | Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette |
JPS62114289A (ja) * | 1985-11-14 | 1987-05-26 | 松下電器産業株式会社 | 電子部品の装着方法および装置 |
JPH0767033B2 (ja) * | 1987-01-14 | 1995-07-19 | 三洋電機株式会社 | 自動装着装置 |
CA1320005C (en) * | 1988-06-16 | 1993-07-06 | Kotaro Harigane | Electronic component mounting apparatus |
KR910003705B1 (en) * | 1988-07-26 | 1991-06-08 | Samsung Electronic | Driving apparatus and method thereof for a assembling machine |
JP2620646B2 (ja) * | 1989-06-07 | 1997-06-18 | 三洋電機株式会社 | 電子部品自動装着装置 |
JPH0810795B2 (ja) * | 1989-09-06 | 1996-01-31 | 松下電器産業株式会社 | 電子部品の実装装置及び実装方法 |
US5040291A (en) * | 1990-05-04 | 1991-08-20 | Universal Instruments Corporation | Multi-spindle pick and place method and apparatus |
JPH0494600A (ja) * | 1990-08-11 | 1992-03-26 | Tdk Corp | 電子部品装着方法及び装置 |
US5278634A (en) * | 1991-02-22 | 1994-01-11 | Cyberoptics Corporation | High precision component alignment sensor system |
-
1993
- 1993-07-01 EP EP93110547A patent/EP0578136B1/de not_active Expired - Lifetime
- 1993-07-01 US US08/086,512 patent/US5377405A/en not_active Expired - Lifetime
- 1993-07-01 DE DE69300850T patent/DE69300850T2/de not_active Expired - Lifetime
-
1994
- 1994-09-30 US US08/316,554 patent/US5491888A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0578136B1 (de) | 1995-11-22 |
US5377405A (en) | 1995-01-03 |
US5491888A (en) | 1996-02-20 |
DE69300850D1 (de) | 1996-01-04 |
EP0578136A1 (de) | 1994-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent |