FR2781924B1 - Procede de montage de circuits integres - Google Patents

Procede de montage de circuits integres

Info

Publication number
FR2781924B1
FR2781924B1 FR9809946A FR9809946A FR2781924B1 FR 2781924 B1 FR2781924 B1 FR 2781924B1 FR 9809946 A FR9809946 A FR 9809946A FR 9809946 A FR9809946 A FR 9809946A FR 2781924 B1 FR2781924 B1 FR 2781924B1
Authority
FR
France
Prior art keywords
integrated circuits
mounting integrated
mounting
soldering
assembled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9809946A
Other languages
English (en)
Other versions
FR2781924A1 (fr
Inventor
Jean Paul Farroni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR9809946A priority Critical patent/FR2781924B1/fr
Priority to US09/364,529 priority patent/US6247637B1/en
Publication of FR2781924A1 publication Critical patent/FR2781924A1/fr
Priority to US09/845,137 priority patent/US20010025876A1/en
Application granted granted Critical
Publication of FR2781924B1 publication Critical patent/FR2781924B1/fr
Priority to US10/858,334 priority patent/US7410091B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C15/00—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores
    • G11C15/04—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
FR9809946A 1998-07-30 1998-07-30 Procede de montage de circuits integres Expired - Fee Related FR2781924B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9809946A FR2781924B1 (fr) 1998-07-30 1998-07-30 Procede de montage de circuits integres
US09/364,529 US6247637B1 (en) 1998-07-30 1999-07-30 Method of integrated circuit assembly
US09/845,137 US20010025876A1 (en) 1998-07-30 2001-04-30 Method of integrated circuit assembly
US10/858,334 US7410091B2 (en) 1998-07-30 2004-06-01 Method of integrated circuit assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9809946A FR2781924B1 (fr) 1998-07-30 1998-07-30 Procede de montage de circuits integres

Publications (2)

Publication Number Publication Date
FR2781924A1 FR2781924A1 (fr) 2000-02-04
FR2781924B1 true FR2781924B1 (fr) 2002-11-29

Family

ID=9529344

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9809946A Expired - Fee Related FR2781924B1 (fr) 1998-07-30 1998-07-30 Procede de montage de circuits integres

Country Status (2)

Country Link
US (3) US6247637B1 (fr)
FR (1) FR2781924B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2781924B1 (fr) * 1998-07-30 2002-11-29 St Microelectronics Sa Procede de montage de circuits integres
DE10339487B4 (de) * 2003-08-27 2007-03-15 Infineon Technologies Ag Verfahren zum Aufbringen eines Halbleiterchips auf einen Träger
US20050098890A1 (en) * 2003-10-08 2005-05-12 Stephan Blaszczak Method for producing an adhesive bond and adhesive bond between a chip and a planar surface
JP4669270B2 (ja) * 2004-12-02 2011-04-13 富士通株式会社 Ｒｆｉｄタグおよびその製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3591839A (en) * 1969-08-27 1971-07-06 Siliconix Inc Micro-electronic circuit with novel hermetic sealing structure and method of manufacture
JPS5772357A (en) * 1980-10-24 1982-05-06 Nec Corp Mounting method of integrated circuit
DE3208604A1 (de) * 1982-03-10 1983-09-22 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum herstellen einer grossflaechigen fluessigkristall-anzeigezelle
FR2620569A1 (fr) * 1987-09-11 1989-03-17 Radiotechnique Compelec Procede pour calibrer l'epaisseur d'une soudure d'un composant electronique sur un substrat
US5251806A (en) * 1990-06-19 1993-10-12 International Business Machines Corporation Method of forming dual height solder interconnections
JP3298194B2 (ja) * 1992-05-12 2002-07-02 富士電機株式会社 はんだ付け方法
US5324569A (en) * 1993-02-26 1994-06-28 Hewlett-Packard Company Composite transversely plastic interconnect for microchip carrier
US5385290A (en) * 1993-11-24 1995-01-31 At&T Corp. Soldering material and procedure
JPH0817241A (ja) * 1994-06-30 1996-01-19 Mitsuboshi Belting Ltd 銅導体ペーストおよび銅導体膜の製造方法
US5425493A (en) * 1994-08-10 1995-06-20 International Business Machines Corporation Selective addition of a solder ball to an array of solder balls
US5725493A (en) * 1994-12-12 1998-03-10 Avery; Robert Logan Intravitreal medicine delivery
JPH08316619A (ja) * 1995-05-12 1996-11-29 Ibiden Co Ltd プリント配線板及びその製造方法
JPH09260438A (ja) * 1996-03-27 1997-10-03 Sumitomo Kinzoku Electro Device:Kk セラミックパッケージ及びその製造方法
US5667132A (en) * 1996-04-19 1997-09-16 Lucent Technologies Inc. Method for solder-bonding contact pad arrays
JP3315871B2 (ja) * 1996-09-03 2002-08-19 日本特殊陶業株式会社 半田バンプを有する配線基板及びその製造方法
US5868887A (en) * 1996-11-08 1999-02-09 W. L. Gore & Associates, Inc. Method for minimizing warp and die stress in the production of an electronic assembly
EP1445995B1 (fr) * 1996-12-27 2007-02-14 Matsushita Electric Industrial Co., Ltd. Procédé pour monter un composant électronique sur une plaquette de circuit et système pour la mise en oeuvre de ce procédé
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
US5872400A (en) * 1997-06-25 1999-02-16 International Business Machines Corporation High melting point solder ball coated with a low melting point solder
JP3335896B2 (ja) * 1997-12-26 2002-10-21 株式会社東芝 ハンダ材及びハンダ材の製造方法
US6337445B1 (en) * 1998-03-16 2002-01-08 Texas Instruments Incorporated Composite connection structure and method of manufacturing
FR2781924B1 (fr) * 1998-07-30 2002-11-29 St Microelectronics Sa Procede de montage de circuits integres
JP3565047B2 (ja) * 1998-10-07 2004-09-15 松下電器産業株式会社 半田バンプの形成方法および半田バンプの実装方法
TW507484B (en) * 2000-03-15 2002-10-21 Matsushita Electric Ind Co Ltd Method of manufacturing multi-layer ceramic circuit board and conductive paste used for the same

Also Published As

Publication number Publication date
US7410091B2 (en) 2008-08-12
US20040217153A1 (en) 2004-11-04
US20010025876A1 (en) 2001-10-04
US6247637B1 (en) 2001-06-19
FR2781924A1 (fr) 2000-02-04

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080331