KR930003795A - 집적 회로 접속 방법 - Google Patents

집적 회로 접속 방법 Download PDF

Info

Publication number
KR930003795A
KR930003795A KR1019920010010A KR920010010A KR930003795A KR 930003795 A KR930003795 A KR 930003795A KR 1019920010010 A KR1019920010010 A KR 1019920010010A KR 920010010 A KR920010010 A KR 920010010A KR 930003795 A KR930003795 A KR 930003795A
Authority
KR
South Korea
Prior art keywords
substrate
adhesive
component
anisotropic conductor
cutout
Prior art date
Application number
KR1019920010010A
Other languages
English (en)
Other versions
KR960008512B1 (en
Inventor
숀탈러 데이빗
Original Assignee
로버트 비. 레비
아메리칸 텔리폰 앤드 텔레그라프 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 로버트 비. 레비, 아메리칸 텔리폰 앤드 텔레그라프 캄파니 filed Critical 로버트 비. 레비
Publication of KR930003795A publication Critical patent/KR930003795A/ko
Application granted granted Critical
Publication of KR960008512B1 publication Critical patent/KR960008512B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1424—Card cages
    • H05K7/1425—Card cages of standardised dimensions, e.g. 19"-subrack
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

내용 없음.

Description

집적 회로 접속 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 칩의 부착 방법을 나타내는 집적회로 칩과 기판의 분해도,
제2도는 제1도의 선2-2를 따라 취한 칩과 기판의 측면도.

Claims (6)

  1. 부품(10)상의 다구의 전도성 부재(14) 각각을 기판(12)상의 다수의 금속부 중 대응하는 것을 상호 연결시키는 집직회로 접속 방법에 있어서, 적어도 하나의 절개부(14)를 갖는 비등방 전도체(18)인 비점착성 시이트를 상기 절개부가 한쌍의 금속부 사이에 있는 기판의 일부를 노출시키도록 기판상에 배치하는 단계와, 상기 비등방전도체내의 절개부를 접착물로 채우는 단계 및, 각 전도성 부재가 대응하는 각 금속부와 정렬되고, 부품의 적어도 일부가 접착물에 의해 기판에 접착하여 비등방 전도체가 압축된 상태로 유지 되도록 부품을 비등방 전도체에 배치하는 단계를 포함하는 것을 특징으로 하는 직접회로 접속방법.
  2. 제1항에 있어서, 상기 비등방 전도체(18)는 단일 절개부(24)를 가지며 상기 절개부가 기판에 대해 중앙에 위치하도록 기판상에 배치되는 것을 특징으로 하는 직접회로 접속 방법.
  3. 제1항에 있어서, 부품과 기판사이의 접착물 결합부를 절단함으로써 금속부에 아무런 손상을 주지않고 기판으로 부터 부품을 제거하는 것을 특징으로 하는 집적회로 접속 방법.
  4. 제1주요 표면상에 예정된 형태로 정렬된 다수의 금속부를 갖는 기판(12)과, 기판의 제1주요 표면상에 놓여 있고, 제1주요 표면상의 한쌍의 금속부 사이에 있는 기판의 일부를 노출하기 위한 적어도 하나의 절개부(24)를 갖는 비등방 전도체(18)의 시이트와, 비등방 전도체의 절개부 안에 침전된 일정량의 접착물(26)과, 다수의 전도성 부재(14)를 가지며, 접착물과 집촉하도록 비등방 전도체 내의 적어도 일부분의 절개부에 놓여있고, 각각의 전도성 부재가 기판상의 금속부에 대응하여 정렬되도륵 위치하며 비등방 전도체가 압축된 상태로 유지하도록 접착물에 의해 기판에 고정되는 적어도 하나의 부품을 포함하는 것을 특징으로 하는 조립체.
  5. 제4항에 있어서, 상기 접착물이 열경화성 접착물로 이루어지는 것을 특징으로 하는 조립체.
  6. 제4항에 있어서, 상기 부품이 미봉합(unpackaged)반도체 칩으로 구성되는 것을 특징으로 하는 조립체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR92010010A 1991-07-01 1992-06-10 Integrated circuit interconnecting method KR960008512B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US724,080 1991-07-01
US07/724,080 US5162613A (en) 1991-07-01 1991-07-01 Integrated circuit interconnection technique

Publications (2)

Publication Number Publication Date
KR930003795A true KR930003795A (ko) 1993-02-24
KR960008512B1 KR960008512B1 (en) 1996-06-26

Family

ID=24908902

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92010010A KR960008512B1 (en) 1991-07-01 1992-06-10 Integrated circuit interconnecting method

Country Status (6)

Country Link
US (1) US5162613A (ko)
EP (1) EP0521672B1 (ko)
JP (1) JP2695578B2 (ko)
KR (1) KR960008512B1 (ko)
DE (1) DE69209169T2 (ko)
TW (1) TW238423B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100569119B1 (ko) * 2000-04-14 2006-04-10 주식회사 만도 차량용 파워스티어링 유압시험용 연결지그

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3225062B2 (ja) * 1991-08-05 2001-11-05 ローム株式会社 熱硬化性樹脂シート及びそれを用いた半導体素子の実装方法
US5459500A (en) * 1992-03-25 1995-10-17 Scitex Digital Printing, Inc. Charge plate connectors and method of making
DE4327560A1 (de) * 1993-08-17 1995-02-23 Hottinger Messtechnik Baldwin Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung
US5432679A (en) * 1994-05-31 1995-07-11 The Whitaker Corporation Pressure equalizer for an integrated circuit chip interconnected to circuitry on a thin film membrane
US5697148A (en) * 1995-08-22 1997-12-16 Motorola, Inc. Flip underfill injection technique
US6580369B1 (en) 1995-10-11 2003-06-17 Motorola, Inc. Electronic tag assembly and method therefor
US5647123A (en) * 1995-10-16 1997-07-15 Motorola, Inc. Method for improving distribution of underfill between a flip chip die and a circuit board
US5783867A (en) * 1995-11-06 1998-07-21 Ford Motor Company Repairable flip-chip undercoating assembly and method and material for same
GB2307598B (en) * 1995-11-24 2000-02-23 Varintelligent Combined printed circuit board and integrated circuit driver
US5807767A (en) * 1996-01-02 1998-09-15 Micron Technology, Inc. Technique for attaching die to leads
US6460245B1 (en) * 1996-03-07 2002-10-08 Tessera, Inc. Method of fabricating semiconductor chip assemblies
WO1999018766A1 (en) * 1997-10-02 1999-04-15 Matsushita Electric Industrial Co., Ltd. Method for mounting semiconductor element to circuit board, and semiconductor device
JP3063839B2 (ja) * 1997-11-18 2000-07-12 日本電気株式会社 実装部品の実装構造および実装方法
US6510606B2 (en) * 1998-06-15 2003-01-28 Lockheed Martin Corporation Multichip module
US6293804B2 (en) * 1999-02-08 2001-09-25 Ericsson Inc. Self-aligning LCD connector assembly
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
JP2000286526A (ja) * 1999-03-30 2000-10-13 Murata Mfg Co Ltd 表面実装構造及びその表面実装構造に用いられる表面実装型電子部品
TW561266B (en) * 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
JP4048076B2 (ja) * 2001-07-10 2008-02-13 株式会社日本触媒 ミカエル型付加物の分解方法
FI119215B (fi) 2002-01-31 2008-08-29 Imbera Electronics Oy Menetelmä komponentin upottamiseksi alustaan ja elektroniikkamoduuli
US8455994B2 (en) * 2002-01-31 2013-06-04 Imbera Electronics Oy Electronic module with feed through conductor between wiring patterns
CN1333494C (zh) * 2002-07-05 2007-08-22 日本压着端子制造株式会社 布线板结构以及连接器制造方法
US6906598B2 (en) * 2002-12-31 2005-06-14 Mcnc Three dimensional multimode and optical coupling devices
JP3755824B2 (ja) * 2003-03-04 2006-03-15 株式会社らいふ 複数電極接着用の電子部品とその実装方法
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US8068346B2 (en) 2004-05-04 2011-11-29 Hamilton Sundstrand Corporation Circuit board with high density power semiconductors
JP2014082448A (ja) * 2012-09-28 2014-05-08 Sumitomo Bakelite Co Ltd 導電接続シート、端子間の接続方法、接続部の形成方法、半導体装置および電子機器
US10104772B2 (en) * 2014-08-19 2018-10-16 International Business Machines Incorporated Metallized particle interconnect with solder components
KR20160109071A (ko) * 2015-03-09 2016-09-21 현대자동차주식회사 회로기판을 갖는 전동식 펌프
US11626336B2 (en) * 2019-10-01 2023-04-11 Qualcomm Incorporated Package comprising a solder resist layer configured as a seating plane for a device

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
JPS5656174U (ko) * 1979-10-04 1981-05-15
JPS5787146A (en) * 1980-11-19 1982-05-31 Fujitsu Ltd Electrical connecting structure for indication electrode and integrated circuit element
US4731282A (en) * 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
AU572615B2 (en) * 1983-12-27 1988-05-12 Sony Corporation Electrically conductive adhesive sheet circuit board and electrical connection structure
GB8405598D0 (en) * 1984-03-02 1984-04-04 Plessey Co Plc Electrical connectors
JPS60200114A (ja) * 1984-03-26 1985-10-09 Hitachi Ltd 液体金属中構造物映像化装置
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
US4642421A (en) * 1984-10-04 1987-02-10 Amp Incorporated Adhesive electrical interconnecting means
US4554033A (en) * 1984-10-04 1985-11-19 Amp Incorporated Method of forming an electrical interconnection means
US4640981A (en) * 1984-10-04 1987-02-03 Amp Incorporated Electrical interconnection means
US4588456A (en) * 1984-10-04 1986-05-13 Amp Incorporated Method of making adhesive electrical interconnecting means
JPS61173471A (ja) * 1985-01-28 1986-08-05 シャープ株式会社 熱圧着コネクタ−
US4729809A (en) * 1985-03-14 1988-03-08 Amp Incorporated Anisotropically conductive adhesive composition
US4659872A (en) * 1985-04-30 1987-04-21 Amp Incorporated Flexible flat multiconductor cable
US4818607A (en) * 1985-08-01 1989-04-04 Northrop Corporation Small hollow particles with conductive coating
US4661192A (en) * 1985-08-22 1987-04-28 Motorola, Inc. Low cost integrated circuit bonding process
DE3675734D1 (de) * 1985-09-30 1991-01-03 Siemens Ag Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage.
JPS62107444U (ko) * 1985-12-25 1987-07-09
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US4737112A (en) * 1986-09-05 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Anisotropically conductive composite medium
US4808112A (en) * 1986-09-25 1989-02-28 Tektronix, Inc. High density connector design using anisotropically pressure-sensitive electroconductive composite sheets
JPS63249393A (ja) * 1987-04-03 1988-10-17 シャープ株式会社 電子部品の接続方法
JPH07116258B2 (ja) * 1987-07-01 1995-12-13 大塚化学株式会社 抗菌性ポリマ−
US4820376A (en) * 1987-11-05 1989-04-11 American Telephone And Telegraph Company At&T Bell Laboratories Fabrication of CPI layers
JPH01136344A (ja) * 1987-11-24 1989-05-29 Seiko Epson Corp 半導体チップの実装構造
US4999136A (en) * 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
EP0360971A3 (en) * 1988-08-31 1991-07-17 Mitsui Mining & Smelting Co., Ltd. Mounting substrate and its production method, and printed wiring board having connector function and its connection method
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
US5046953A (en) * 1990-05-25 1991-09-10 Hewlett-Packard Company Method and apparatus for mounting an integrated circuit on a printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100569119B1 (ko) * 2000-04-14 2006-04-10 주식회사 만도 차량용 파워스티어링 유압시험용 연결지그

Also Published As

Publication number Publication date
JP2695578B2 (ja) 1997-12-24
JPH0766286A (ja) 1995-03-10
EP0521672B1 (en) 1996-03-20
TW238423B (ko) 1995-01-11
DE69209169T2 (de) 1996-07-25
KR960008512B1 (en) 1996-06-26
EP0521672A1 (en) 1993-01-07
DE69209169D1 (de) 1996-04-25
US5162613A (en) 1992-11-10

Similar Documents

Publication Publication Date Title
KR930003795A (ko) 집적 회로 접속 방법
KR970008536A (ko) 반도체 장치 및 그 제조 방법
EP0357362A3 (en) Housing for electronic components
KR940022812A (ko) 반도체장치용 패키지 및 반도체장치
DE68928320T2 (de) Randmontierte Packung vom Oberflächen-Montierungstyp, für integrierte Halbleiterschaltungsanordnungen
EP0619608A3 (en) Circuit board for optical devices
KR870003681A (ko) 리드(lead)를 갖는 전기부품
KR940003002A (ko) 집적회로
EP1041633A4 (en) SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE
DE69635603D1 (de) Höckerkontakt für eine Leiterplatte und Halbleitermodul mit derselben
ES464959A1 (es) Perfeccionamientos introducidos en un paquete ceramico meta-lizado para circuitos de alta velocidad.
CA2129336A1 (en) Self-locking heat sinks for surface mount devices
EP1189271A3 (en) Wiring boards and mounting of semiconductor devices thereon
EP0913866A4 (en) ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, PRINTED CIRCUIT BOARD THUS EQUIPPED, AND ELECTRONIC EQUIPMENT COMPRISING SUCH A PRINTED CIRCUIT BOARD
EP0883182A3 (en) Lattice arrangement of electrodes on a multi-layer circuit board
KR900012526A (ko) 전자부품 반송체
EP0810655A3 (en) A package for a semiconductor device
KR830004676A (ko) 회로 패키지들의 제조방법
EP0394588A3 (en) Solder terminal
KR890018026A (ko) Ic유니트 및 그 접합방법
DE68900352D1 (de) Filtriereinrichtung, insbesondere fuer einen schmierkreis einer turbomaschine.
KR970060465A (ko) 표면 보상형 열 분산 장치
EP0997944A3 (en) Printed circuit board with integrated circuit devices mounted on both sides thereof
EP1041618A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, PRINTED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT
DE69013646D1 (de) Integrierte Halbleiterschaltungsvorrichtung mit Kontaktierungsflächen am Rande des Halbleiterchips.

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20110622

Year of fee payment: 16

EXPY Expiration of term