KR940022812A - 반도체장치용 패키지 및 반도체장치 - Google Patents

반도체장치용 패키지 및 반도체장치 Download PDF

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KR940022812A
KR940022812A KR1019940005728A KR19940005728A KR940022812A KR 940022812 A KR940022812 A KR 940022812A KR 1019940005728 A KR1019940005728 A KR 1019940005728A KR 19940005728 A KR19940005728 A KR 19940005728A KR 940022812 A KR940022812 A KR 940022812A
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semiconductor device
hole
wiring board
center
printed wiring
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KR0135585B1 (ko
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마사도시 아까가와
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이노우에 사다오
신꼬오 덴기 고오교오 가부시끼가이샤
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Abstract

염가이고 소형인 동시에 인너리드쪽의 본딩만으로 칩의 탑재가 가능하게 된다.
중앙에 칩수납구멍(25)을 갖고 한쪽면에 외부접속용단자(24)가 형성된 프린트배선기판(21)의 다른면에 중앙에 수납구멍(25)과 축선이 일치되는 구멍을 갖는 지지필름(27)위에 소정의 회로패턴(28a)이 형성되고 또 구멍내부로 돌출되는 미세패턴의 인터리드(28b)가 형성된 기판(26)이 프린트배선기판(21)의 회로패턴과 전기적으로 도통을 취하여 접합되어 있다.

Description

반도체장치용 패키지 및 반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 반도체장치용 패키지의 일예를 나타낸 종단면도, 제2도는 제1도의 패키지의 저면도이다.

Claims (2)

  1. 중앙에 칩수납구멍을 갖고 한쪽면에 외부접속용단자가 형성된 프린트배선기판의 다른면에 중앙에 상기 수납구멍과 축선이 일치되는 구멍을 갖는 지지필름상의 소정의 회로패턴이 형성되고 또 구멍내부로 돌출되는 미세패턴의 인너리드가 형성된 기판이 상기 프린트배선기판의 회로패턴과 전기적 도통을 취하여 접합되어 있는 것을 특징으로 하는 반도체장치용 패키지.
  2. 제1항에 있어서, 상기 반도체장치용 패키지의 인너리드위에 칩이 일괄본딩되어 탑재되고 상기 수납 구멍을 덮고 또 칩에 직접 또는 간접적으로 맞닿아 히트싱크가 고정되고 상기 수납구멍의 반대쪽을 덮어 캡이 고정되어서 칩이 봉지되어 있는 것을 특징으로 하는 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940005728A 1993-03-23 1994-03-22 반도체 장치용 패키지 및 반도체 장치 KR0135585B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5063737A JPH06275677A (ja) 1993-03-23 1993-03-23 半導体装置用パッケージおよび半導体装置
JP93-63737 1993-03-23

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KR940022812A true KR940022812A (ko) 1994-10-21
KR0135585B1 KR0135585B1 (ko) 1998-04-22

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US (1) US5404273A (ko)
EP (1) EP0617465B1 (ko)
JP (1) JPH06275677A (ko)
KR (1) KR0135585B1 (ko)
DE (1) DE69414291T2 (ko)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5854534A (en) 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5397921A (en) * 1993-09-03 1995-03-14 Advanced Semiconductor Assembly Technology Tab grid array
JPH0831988A (ja) * 1994-07-20 1996-02-02 Nec Corp テープキャリアパッケージの封止構造
JPH0846085A (ja) * 1994-08-02 1996-02-16 Fujitsu Ltd 半導体装置及びその製造方法
EP0698922B1 (en) * 1994-08-12 2001-06-06 STMicroelectronics S.r.l. Leadframe for supporting integrated semiconductor devices
JPH0878574A (ja) * 1994-09-08 1996-03-22 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
KR0170023B1 (ko) * 1994-12-16 1999-02-01 황인길 반도체 패키지
US5972736A (en) * 1994-12-21 1999-10-26 Sun Microsystems, Inc. Integrated circuit package and method
JP2636777B2 (ja) * 1995-02-14 1997-07-30 日本電気株式会社 マイクロプロセッサ用半導体モジュール
WO1997004629A1 (en) * 1995-07-14 1997-02-06 Olin Corporation Metal ball grid electronic package
JP2910670B2 (ja) * 1996-04-12 1999-06-23 日本電気株式会社 半導体実装構造
WO1997044821A1 (en) * 1996-05-22 1997-11-27 Olin Corporation Metal electronic package with peripherally attached leads
US5726079A (en) * 1996-06-19 1998-03-10 International Business Machines Corporation Thermally enhanced flip chip package and method of forming
USRE39426E1 (en) 1996-06-19 2006-12-12 International Business Machines Corporation Thermally enhanced flip chip package and method of forming
US5724230A (en) * 1996-06-21 1998-03-03 International Business Machines Corporation Flexible laminate module including spacers embedded in an adhesive
JP2770820B2 (ja) * 1996-07-01 1998-07-02 日本電気株式会社 半導体装置の実装構造
US5812376A (en) * 1997-04-21 1998-09-22 Chrysler Corporation Mounting assembly for electrical components and heat sinks
TW449844B (en) * 1997-05-17 2001-08-11 Hyundai Electronics Ind Ball grid array package having an integrated circuit chip
US6552264B2 (en) 1998-03-11 2003-04-22 International Business Machines Corporation High performance chip packaging and method
JP2000114413A (ja) * 1998-09-29 2000-04-21 Sony Corp 半導体装置、その製造方法および部品の実装方法
TW399309B (en) * 1998-09-30 2000-07-21 World Wiser Electronics Inc Cavity-down package structure with thermal via
JP3269815B2 (ja) * 1999-12-13 2002-04-02 富士通株式会社 半導体装置及びその製造方法
US6350954B1 (en) 2000-01-24 2002-02-26 Motorola Inc. Electronic device package, and method
WO2001094874A1 (de) * 2000-06-07 2001-12-13 Siemens Aktiengesellschaft Zündbauteil zum auslösen eines insassenschutzmittels eines kraftfahrzeuges
JP2002134650A (ja) * 2000-10-23 2002-05-10 Rohm Co Ltd 半導体装置およびその製造方法
US6469907B1 (en) 2000-10-23 2002-10-22 Team Pacific, Corporation Packaging for power and other circuitry
US6828663B2 (en) 2001-03-07 2004-12-07 Teledyne Technologies Incorporated Method of packaging a device with a lead frame, and an apparatus formed therefrom
US6653167B2 (en) * 2001-09-10 2003-11-25 Sun Microsystems, Inc. Facilitating heat transfer from an integrated circuit package
US6784540B2 (en) * 2001-10-10 2004-08-31 International Rectifier Corp. Semiconductor device package with improved cooling
US6933603B2 (en) * 2002-07-11 2005-08-23 Teledyne Technologies Incorporated Multi-substrate layer semiconductor packages and method for making same
JP3858834B2 (ja) * 2003-02-24 2006-12-20 オンキヨー株式会社 半導体素子の放熱器
US7656236B2 (en) 2007-05-15 2010-02-02 Teledyne Wireless, Llc Noise canceling technique for frequency synthesizer
US8179045B2 (en) 2008-04-22 2012-05-15 Teledyne Wireless, Llc Slow wave structure having offset projections comprised of a metal-dielectric composite stack
JP2010267954A (ja) * 2009-04-15 2010-11-25 Panasonic Corp 電子機器
US9202660B2 (en) 2013-03-13 2015-12-01 Teledyne Wireless, Llc Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes
FR3037439A1 (fr) * 2015-06-12 2016-12-16 St Microelectronics Sa Dispositif electronique a plaque arriere evidee.
DE102015115271B4 (de) * 2015-09-10 2021-07-15 Infineon Technologies Ag Elektronikbaugruppe mit entstörkondensatoren und verfahren zum betrieb der elektronikbaugruppe
US10410952B2 (en) 2016-12-15 2019-09-10 Infineon Technologies Ag Power semiconductor packages having a substrate with two or more metal layers and one or more polymer-based insulating layers for separating the metal layers
US10008411B2 (en) 2016-12-15 2018-06-26 Infineon Technologies Ag Parallel plate waveguide for power circuits

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939570A (en) * 1988-07-25 1990-07-03 International Business Machines, Corp. High power, pluggable tape automated bonding package
FR2641102B1 (ko) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
US4964019A (en) * 1989-12-27 1990-10-16 Ag Communication Systems Corporation Multilayer bonding and cooling of integrated circuit devices
JPH0496257A (ja) * 1990-08-03 1992-03-27 Hitachi Ltd ピングリッドアレイ形半導体集積回路装置
US5294750A (en) * 1990-09-18 1994-03-15 Ngk Insulators, Ltd. Ceramic packages and ceramic wiring board
US5102829A (en) * 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
JP3000307B2 (ja) * 1991-08-28 2000-01-17 株式会社日立製作所 冷却装置付き半導体装置およびその製造方法

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DE69414291D1 (de) 1998-12-10
EP0617465B1 (en) 1998-11-04
US5404273A (en) 1995-04-04
DE69414291T2 (de) 1999-03-25
EP0617465A1 (en) 1994-09-28
KR0135585B1 (ko) 1998-04-22

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