KR940022812A - 반도체장치용 패키지 및 반도체장치 - Google Patents
반도체장치용 패키지 및 반도체장치 Download PDFInfo
- Publication number
- KR940022812A KR940022812A KR1019940005728A KR19940005728A KR940022812A KR 940022812 A KR940022812 A KR 940022812A KR 1019940005728 A KR1019940005728 A KR 1019940005728A KR 19940005728 A KR19940005728 A KR 19940005728A KR 940022812 A KR940022812 A KR 940022812A
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- South Korea
- Prior art keywords
- semiconductor device
- hole
- wiring board
- center
- printed wiring
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract 2
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- H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- Lead Frames For Integrated Circuits (AREA)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
염가이고 소형인 동시에 인너리드쪽의 본딩만으로 칩의 탑재가 가능하게 된다.
중앙에 칩수납구멍(25)을 갖고 한쪽면에 외부접속용단자(24)가 형성된 프린트배선기판(21)의 다른면에 중앙에 수납구멍(25)과 축선이 일치되는 구멍을 갖는 지지필름(27)위에 소정의 회로패턴(28a)이 형성되고 또 구멍내부로 돌출되는 미세패턴의 인터리드(28b)가 형성된 기판(26)이 프린트배선기판(21)의 회로패턴과 전기적으로 도통을 취하여 접합되어 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 반도체장치용 패키지의 일예를 나타낸 종단면도, 제2도는 제1도의 패키지의 저면도이다.
Claims (2)
- 중앙에 칩수납구멍을 갖고 한쪽면에 외부접속용단자가 형성된 프린트배선기판의 다른면에 중앙에 상기 수납구멍과 축선이 일치되는 구멍을 갖는 지지필름상의 소정의 회로패턴이 형성되고 또 구멍내부로 돌출되는 미세패턴의 인너리드가 형성된 기판이 상기 프린트배선기판의 회로패턴과 전기적 도통을 취하여 접합되어 있는 것을 특징으로 하는 반도체장치용 패키지.
- 제1항에 있어서, 상기 반도체장치용 패키지의 인너리드위에 칩이 일괄본딩되어 탑재되고 상기 수납 구멍을 덮고 또 칩에 직접 또는 간접적으로 맞닿아 히트싱크가 고정되고 상기 수납구멍의 반대쪽을 덮어 캡이 고정되어서 칩이 봉지되어 있는 것을 특징으로 하는 반도체장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5063737A JPH06275677A (ja) | 1993-03-23 | 1993-03-23 | 半導体装置用パッケージおよび半導体装置 |
JP93-63737 | 1993-03-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940022812A true KR940022812A (ko) | 1994-10-21 |
KR0135585B1 KR0135585B1 (ko) | 1998-04-22 |
Family
ID=13238028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940005728A KR0135585B1 (ko) | 1993-03-23 | 1994-03-22 | 반도체 장치용 패키지 및 반도체 장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5404273A (ko) |
EP (1) | EP0617465B1 (ko) |
JP (1) | JPH06275677A (ko) |
KR (1) | KR0135585B1 (ko) |
DE (1) | DE69414291T2 (ko) |
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JP2010267954A (ja) * | 2009-04-15 | 2010-11-25 | Panasonic Corp | 電子機器 |
US9202660B2 (en) | 2013-03-13 | 2015-12-01 | Teledyne Wireless, Llc | Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes |
FR3037439A1 (fr) * | 2015-06-12 | 2016-12-16 | St Microelectronics Sa | Dispositif electronique a plaque arriere evidee. |
DE102015115271B4 (de) * | 2015-09-10 | 2021-07-15 | Infineon Technologies Ag | Elektronikbaugruppe mit entstörkondensatoren und verfahren zum betrieb der elektronikbaugruppe |
US10410952B2 (en) | 2016-12-15 | 2019-09-10 | Infineon Technologies Ag | Power semiconductor packages having a substrate with two or more metal layers and one or more polymer-based insulating layers for separating the metal layers |
US10008411B2 (en) | 2016-12-15 | 2018-06-26 | Infineon Technologies Ag | Parallel plate waveguide for power circuits |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4939570A (en) * | 1988-07-25 | 1990-07-03 | International Business Machines, Corp. | High power, pluggable tape automated bonding package |
FR2641102B1 (ko) * | 1988-12-27 | 1991-02-22 | Ebauchesfabrik Eta Ag | |
US4964019A (en) * | 1989-12-27 | 1990-10-16 | Ag Communication Systems Corporation | Multilayer bonding and cooling of integrated circuit devices |
JPH0496257A (ja) * | 1990-08-03 | 1992-03-27 | Hitachi Ltd | ピングリッドアレイ形半導体集積回路装置 |
US5294750A (en) * | 1990-09-18 | 1994-03-15 | Ngk Insulators, Ltd. | Ceramic packages and ceramic wiring board |
US5102829A (en) * | 1991-07-22 | 1992-04-07 | At&T Bell Laboratories | Plastic pin grid array package |
JP3000307B2 (ja) * | 1991-08-28 | 2000-01-17 | 株式会社日立製作所 | 冷却装置付き半導体装置およびその製造方法 |
-
1993
- 1993-03-23 JP JP5063737A patent/JPH06275677A/ja active Pending
-
1994
- 1994-03-22 DE DE69414291T patent/DE69414291T2/de not_active Expired - Fee Related
- 1994-03-22 EP EP94302013A patent/EP0617465B1/en not_active Expired - Lifetime
- 1994-03-22 KR KR1019940005728A patent/KR0135585B1/ko not_active IP Right Cessation
- 1994-03-23 US US08/216,323 patent/US5404273A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH06275677A (ja) | 1994-09-30 |
DE69414291D1 (de) | 1998-12-10 |
EP0617465B1 (en) | 1998-11-04 |
US5404273A (en) | 1995-04-04 |
DE69414291T2 (de) | 1999-03-25 |
EP0617465A1 (en) | 1994-09-28 |
KR0135585B1 (ko) | 1998-04-22 |
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