DE3675734D1 - Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage. - Google Patents

Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage.

Info

Publication number
DE3675734D1
DE3675734D1 DE8686110874T DE3675734T DE3675734D1 DE 3675734 D1 DE3675734 D1 DE 3675734D1 DE 8686110874 T DE8686110874 T DE 8686110874T DE 3675734 T DE3675734 T DE 3675734T DE 3675734 D1 DE3675734 D1 DE 3675734D1
Authority
DE
Germany
Prior art keywords
surface mounting
building element
fixing
building
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686110874T
Other languages
English (en)
Inventor
Hans Dipl Ing Hargasser
Joachim Dipl Phys Dathe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE8686110874T priority Critical patent/DE3675734D1/de
Application granted granted Critical
Publication of DE3675734D1 publication Critical patent/DE3675734D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/039—Spraying with other step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Casings For Electric Apparatus (AREA)
DE8686110874T 1985-09-30 1986-08-06 Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage. Expired - Fee Related DE3675734D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8686110874T DE3675734D1 (de) 1985-09-30 1986-08-06 Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3534872 1985-09-30
DE8686110874T DE3675734D1 (de) 1985-09-30 1986-08-06 Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage.

Publications (1)

Publication Number Publication Date
DE3675734D1 true DE3675734D1 (de) 1991-01-03

Family

ID=6282384

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686110874T Expired - Fee Related DE3675734D1 (de) 1985-09-30 1986-08-06 Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage.

Country Status (4)

Country Link
US (1) US4864471A (de)
EP (1) EP0218832B1 (de)
JP (1) JPS6281719A (de)
DE (1) DE3675734D1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4996629A (en) * 1988-11-14 1991-02-26 International Business Machines Corporation Circuit board with self-supporting connection between sides
EP1187227A3 (de) * 1989-05-31 2002-08-28 Osram Opto Semiconductors GmbH & Co. OHG Oberflächenmontierbares Opto-Bauelement und Verfahren zum Herstellen desselben
US5121190A (en) * 1990-03-14 1992-06-09 International Business Machines Corp. Solder interconnection structure on organic substrates
US5162613A (en) * 1991-07-01 1992-11-10 At&T Bell Laboratories Integrated circuit interconnection technique
JP3225062B2 (ja) * 1991-08-05 2001-11-05 ローム株式会社 熱硬化性樹脂シート及びそれを用いた半導体素子の実装方法
US5237829A (en) * 1992-07-29 1993-08-24 Japan Servo Co., Ltd. Ice-making machine having thermal relay
DE4340594C2 (de) * 1992-12-01 1998-04-09 Murata Manufacturing Co Verfahren zur Herstellung und zum Einstellen der Charakteristik eines oberflächenmontierbaren chipförmigen LC-Filters
KR0141229B1 (ko) * 1993-09-22 1998-07-15 김광호 국부 경화방법
US5650595A (en) * 1995-05-25 1997-07-22 International Business Machines Corporation Electronic module with multiple solder dams in soldermask window
SE9503884L (sv) * 1995-11-03 1997-05-04 Ericsson Telefon Ab L M Förfarande för att montera högtalare och högtalarmontage
EP0905700A3 (de) * 1997-09-24 2000-08-02 Siemens Aktiengesellschaft Platine für Datenverarbeitungsgerät
US6711812B1 (en) 1999-04-13 2004-03-30 Unicap Electronics Industrial Corporation Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages
US6675472B1 (en) 1999-04-29 2004-01-13 Unicap Electronics Industrial Corporation Process and structure for manufacturing plastic chip carrier
DE102007062901B3 (de) * 2007-12-21 2009-05-07 Kleiner Gmbh Schnappscheibe

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4821146U (de) * 1971-07-19 1973-03-10
JPS53448A (en) * 1976-06-25 1978-01-06 Kiyoshi Nakajima Device for automatically closing main stopper when gas operation is suspended
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
NL7905518A (nl) * 1978-07-19 1980-01-22 Matsushita Electric Ind Co Ltd Werkwijze voor het monteren van elektronische delen.
JPS5768053A (en) * 1980-10-16 1982-04-26 Seiko Epson Corp Integrated circuit package
DE3110351A1 (de) * 1981-03-17 1982-09-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von elektrischen schichtkondensatoren mit glimmpolymerisatschichten als dielektrika
JPS599310A (ja) * 1982-07-08 1984-01-18 Yanmar Diesel Engine Co Ltd 組立型クランク軸
DE3231277A1 (de) * 1982-08-23 1984-02-23 Siemens AG, 1000 Berlin und 8000 München Regenerierfaehiger elektrischer schichtkondensator in chip-bauart
US4567546A (en) * 1982-11-08 1986-01-28 All States Plastic Mfg. Co., Inc. Anchor base mounting block
JPS59215759A (ja) * 1983-05-24 1984-12-05 Nec Corp 半導体装置
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly

Also Published As

Publication number Publication date
EP0218832B1 (de) 1990-11-22
US4864471A (en) 1989-09-05
EP0218832A1 (de) 1987-04-22
JPS6281719A (ja) 1987-04-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee