KR940003002A - 집적회로 - Google Patents

집적회로 Download PDF

Info

Publication number
KR940003002A
KR940003002A KR1019930012241A KR930012241A KR940003002A KR 940003002 A KR940003002 A KR 940003002A KR 1019930012241 A KR1019930012241 A KR 1019930012241A KR 930012241 A KR930012241 A KR 930012241A KR 940003002 A KR940003002 A KR 940003002A
Authority
KR
South Korea
Prior art keywords
lead
semiconductor chip
section
integrated circuit
circuit according
Prior art date
Application number
KR1019930012241A
Other languages
English (en)
Inventor
도미니끄 사비낙
페터 알페론
라이너 틸제너
클라우스 뮐러
Original Assignee
발도르프, 피켄셔
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP17418092A external-priority patent/JP3186226B2/ja
Priority claimed from JP17417792A external-priority patent/JP3198158B2/ja
Application filed by 발도르프, 피켄셔, 지멘스 악티엔게젤샤프트 filed Critical 발도르프, 피켄셔
Publication of KR940003002A publication Critical patent/KR940003002A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/40—Moulds for making articles of definite length, i.e. discrete articles with means for cutting the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0033—Moulds or cores; Details thereof or accessories therefor constructed for making articles provided with holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C43/183—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould
    • B29C43/184—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould shaped by the compression of the material during moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/78—Moulding material on one side only of the preformed part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3665—Moulds for making articles of definite length, i.e. discrete articles cores or inserts, e.g. pins, mandrels, sliders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3418—Loud speakers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

반도체 칩 (CH)은 그것위에 배열된 단말영역으로 플라스틱 물질(M)내에 밀봉된다. 반도체 칩의 접촉을 위해, 리드(L)의 제1섹션(1)이 단말영역 (Pd)에 기계적으로 안정되게 연결된다. 리드(L)는 제2섹션(2)에서 플라스틱 물질 (M)을 통해 외부로 안내되고 거기서 회로의 터미널로서 핀 (P)을 형성한다. 리드(L)의 제3섹션(3)에서 리드(L)가 반도체 칩 (CH)에 접착된다. 본 발명에 따라 리드(L)의 접착을 위해 각 리드(L)와 반도테 칩 (CH) 사이에 접작제 (Adh)가 제공된다. 접착제 (Adh)가 각 리드(L)와 반도테 칩 (CH) 사이에만 위치함으로써, 인접한 리드(L) 사이에 위치란 반도체 칩 (CH)의 표면영역이 접착제 (Adh)로 커버되지 않는다

Description

집적회로
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도 내지 8도 및 10도는 본 발명에 따른 회로의 여러 실시예를 나타낸 평면도 및 횡단면도,
제9도는 구성부분의 바람직한 실시예.

Claims (9)

  1. 플라스틱 물질(M)내에서 반도체 칩 (H)이 그것위에 배옅된 단말영역 (Pd)으로 밀봉되고, -반도체 칩(CH)의 접촉을 위해 리드(L)의 제1섹션(1)이 단말영역 (Pd)에 기계적으로 안정되게 연결되며, -리드(L)가 제2섹션(2)에서 플라스틱 물질(M)을 통해 외부로 안내되고, 거기서 상기 리드(L)가 회로의 터미널로서 핀(P)을 형성하며, -반도체 칩 (CH)의 상부에 위치하는 리드(L)의 제3섹션(3)에서 리드(L)가 반도체 칩 (CH)에 접착되는 집적회로에 있어서, 접착을 위해 각 리드 (L)에는 리드 (L)와 반도체 칩 (CH) 사이에 접착제 (Adh)가 제공되고,상기 접착제 (Adh)가 각 리드(L)와 반도체 칩 (CH) 사이에만 위치함으로써, 인접한 리드(L) 사이에 있는 반도체칩 (CH)의 표면영역이 접착제(Adh)로 커버되지 않는 것을 특징으로 하는 집접회로.
  2. 제1항에 있어서, 접착제 (Adh)가 각각의 리드(L)에서 리드(L)와 반도체 칩 (CH) 사이에 있는 제3섹션(3)의 전체 영역에 배열되는 것을 륵징으로 하는 집적회로.
  3. 제1항에 있어서, 접착제 (Adh)가 각각의 리드(L)에서 리드(L)와 반도체 칩 (CH) 사이에 있는 제3섹션(3)의 부분영역(Ⅲ)에만 배열되는 것을 특징으로 하는 집적회로
  4. 제3항에 있어서, 부분영역 (Ⅲ)이 점형태인 것을 특징으로 하는 집적회로.
  5. 제3항 또는 4항에 있어서, 각각의 리드(L)가 제3섹션(3)에서 부분영역 (Ⅲ)이 시작하는 지점에서 구부러지는 것을 륵징으로 하는 집적회로.
  6. 제3항 내지 5항 중 어느 한 항에 있어서, 제1섹션(1)이 제3섹션(3)의 부분영역(Ⅲ)내에 위치하는 것을 특징으로 하는 집적회로.
  7. 제3항 내지 6항 중 띤느 한 항에 있어서, 회로의 리드 (L)중 적어도 하나가 하나이상의 제1섹션(I) 및 하나이상의 부분영역(Ⅲ)을 가지는 것을 특징으로 하는 집적회로.
  8. 제7항에 있어서, 각각의 제1섹션(I)이 제3섹션(3)의 각각의 부분영역 (Ⅲ)에 위치하는 것을 특징으로 하는 집적회로.
  9. 상기 항 중 어느 한 항에 있어서, 반도체 칩 (CH)의 종방찰 측면 (R1)을 따라 뻗은 반도체 칩 (CH)의 가장자리영역 (R)이 접촉면(Pd)으로 커버되는 것을 특징으로 하는 집접회로.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930012241A 1992-07-01 1993-07-01 집적회로 KR940003002A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP17418092A JP3186226B2 (ja) 1992-07-01 1992-07-01 複合樹脂成形品の製造装置
JP17417792A JP3198158B2 (ja) 1992-07-01 1992-07-01 複合成形品の製造方法
JP92-174180 1992-07-01
JP92111167.0 1992-07-01

Publications (1)

Publication Number Publication Date
KR940003002A true KR940003002A (ko) 1994-02-19

Family

ID=26495878

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019930012195A KR100259661B1 (en) 1992-07-01 1993-06-30 Manufacturing device and manufacturing method for multi-layer molded-product
KR1019930012241A KR940003002A (ko) 1992-07-01 1993-07-01 집적회로

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1019930012195A KR100259661B1 (en) 1992-07-01 1993-06-30 Manufacturing device and manufacturing method for multi-layer molded-product

Country Status (7)

Country Link
US (2) US5770134A (ko)
EP (1) EP0582075B1 (ko)
KR (2) KR100259661B1 (ko)
CA (1) CA2098854C (ko)
DE (1) DE69332285T2 (ko)
ES (1) ES2179046T3 (ko)
TW (1) TW224065B (ko)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07288004A (ja) * 1994-04-19 1995-10-31 Koito Mfg Co Ltd 車両用灯具とその製造装置及び製造方法
FR2720320B1 (fr) * 1994-05-26 1996-09-20 Cera Procédé d'inclusion d'un décor, notamment textile, dans une pièce en matière plastique.
JP3004198B2 (ja) 1995-11-14 2000-01-31 ユニプレス株式会社 複合成形品、その製造方法および製造装置
FR2749796B1 (fr) * 1996-06-13 1998-07-31 Plastic Omnium Cie Procede pour realiser une piece en matiere thermoplastique renforcee, poutre de pare-chocs et pare-chocs comprenant une telle poutre
ES2164277T3 (es) * 1997-02-28 2002-02-16 Yamakawa Ind Co Producto moldeado compuesto y procedimiento y aparato de fabricacion.
DE19827706C2 (de) * 1997-07-11 2002-04-11 Ford Motor Co Verfahren zum Befestigen eines Abdeckmaterials an einem spritzgegossenen Kunststoffteil
FR2768648B1 (fr) * 1997-09-19 1999-11-05 Allibert Ind Procede et moule pour realiser une piece finie comprenant une piece-support recouverte par une feuille-decor et presentant un passage, ainsi que la piece finie
EP0913791A1 (en) * 1997-10-30 1999-05-06 Navitas Co., Limited Method for manufacturing card product and manufacturing apparatus therefor
JPH11192676A (ja) 1997-12-26 1999-07-21 Kyoraku Co Ltd 布貼り成形品およびその再処理方法
US6986854B2 (en) * 1997-12-26 2006-01-17 Kyoraku Co. Ltd. Molded article laminated with fabric and method for reprocessing the same
US6291369B1 (en) * 1998-04-08 2001-09-18 Dai Nippon Printing Co., Ltd. Resin molding
US6533980B1 (en) * 1999-03-01 2003-03-18 Meridian Automotive Systems, Inc. Method of making a combination speaker grill and automative interior trim panel
US6660201B1 (en) * 1999-03-01 2003-12-09 Meridian Automotive Systems, Inc. Method of making a combination speaker grill and automotive trim panel
DE19931767A1 (de) * 1999-07-08 2001-01-11 Bayerische Motoren Werke Ag Verfahren zum Hinterspritzen einer Folie oder Haut in einem Formwerkzeug
JP4461518B2 (ja) * 1999-08-27 2010-05-12 住友化学株式会社 熱可塑性樹脂成形体製造用金型および熱可塑性樹脂成形体の製造方法
US7442334B2 (en) * 1999-09-16 2008-10-28 Tokai Kogyo Co., Ltd. Resin case in which gas-permeability and waterproof quality are compatible, and die for manufacturing such case
US6471276B1 (en) * 2000-02-04 2002-10-29 Universal Trim, Inc. Molded insert netted map pocket
JP4576024B2 (ja) 2000-05-31 2010-11-04 トヨタ紡織株式会社 表皮一体成形品の製造方法および装置
JP4465130B2 (ja) * 2001-03-30 2010-05-19 大和化成工業株式会社 樹脂部材の成形方法及び射出成形装置
FR2843065A1 (fr) * 2002-07-30 2004-02-06 Faurecia Ind Procede de moulage par compression d'une feuille comprenant une matiere plastique et moule correspondant.
DE50209246D1 (de) * 2002-11-25 2007-02-22 Weidmann Plastics Tech Ag Verfahren zur Herstellung eines Werkzeugeinsatzes zum Spritzgiessen eines mikrostrukturierten Teils
KR100484834B1 (ko) * 2002-11-28 2005-04-22 엘지전자 주식회사 세탁기의 디스플레이 패널용 사출금형
GB2408960B (en) * 2003-12-12 2008-01-30 Nokia Corp In-mould labelling
JP4715824B2 (ja) * 2007-09-19 2011-07-06 ブラザー工業株式会社 表示パネル用基板の製造方法
FR2928100B1 (fr) * 2008-02-28 2010-04-02 Plastic Omnium Cie Procede de fabrication d'une piece structurelle de vehicule automobile et une telle piece.
DE102008046084B4 (de) * 2008-09-08 2012-06-21 Peguform Gmbh Verfahren und Vorrichtung zur Herstellung eines Formteils mit mehreren aneinander grenzenden, unterschiedlichen Dekorbereichen
US8715705B2 (en) * 2009-07-29 2014-05-06 Covidien Lp Multilayer medical devices having an encapsulated edge and methods thereof
KR101066098B1 (ko) * 2010-08-25 2011-09-20 백영인 수지제품 제조장치
DE102011081083A1 (de) * 2011-08-17 2013-02-21 Osram Ag Presswerkzeug und verfahren zum pressen eines silikonelements
CN102773965B (zh) * 2012-07-20 2014-12-03 重庆延锋江森汽车部件系统有限公司 汽车座椅坐垫排风口成型模具及成型工艺
JP5866398B2 (ja) 2013-05-15 2016-02-17 東芝機械株式会社 成形システム及び成形品の製造方法
JP5873887B2 (ja) * 2013-05-15 2016-03-01 東芝機械株式会社 成形品製造装置及び成形品の製造方法
TWI618625B (zh) * 2014-10-03 2018-03-21 綠點高新科技股份有限公司 物件的製法及其製品
JP2016203512A (ja) * 2015-04-23 2016-12-08 株式会社小糸製作所 成形用金型、成形品及び成形品の成形方法
JP6543791B2 (ja) * 2015-06-04 2019-07-17 株式会社Ｓｕｂａｒｕ 樹脂成形体の製造方法及びプレス成形装置
KR101766035B1 (ko) * 2015-09-04 2017-08-07 현대자동차주식회사 자동차 내장재의 제조 장치 및 방법
JP6427215B2 (ja) * 2017-03-07 2018-11-21 本田技研工業株式会社 固体高分子型燃料電池用フィルム成形品のプレス加工方法及びプレス加工装置
DE102017223858A1 (de) * 2017-12-28 2019-07-04 Quin Gmbh Verfahren zum Herstellen eines Dekorteils
JP7052571B2 (ja) 2018-06-04 2022-04-12 トヨタ自動車株式会社 成形装置および成形品の製造方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1895738A (en) * 1930-05-09 1933-01-31 Sprague Specialties Co Combined hard and soft rubber article
US3077658A (en) * 1960-04-11 1963-02-19 Gen Dynamics Corp Method of manufacturing molded module assemblies
FR1316239A (fr) * 1962-02-27 1963-01-25 Battenfeld Geb Dispositif pour la fabrication de pièces en matière synthétique moulées par pressage
US3403883A (en) * 1965-05-06 1968-10-01 Northern Electric Co Apparatus for producing inlaid articles
JPS4934474B1 (ko) * 1970-05-21 1974-09-13
DE2628703C3 (de) * 1976-06-25 1980-10-09 Maschinen- Und Werkzeugbau Gmbh, 3563 Dautphetal Anordnung und Verfahren zur Herstellung von Profilen, insbesondere für Fenster und Türen
FR2482514A1 (fr) * 1980-05-13 1981-11-20 Cotte Sarl Ets Marcel Procede pour inserer sans saillie un element rapporte
DK146709C (da) * 1980-12-09 1984-05-21 Eskesen Brdr As Fremgangsmaade til fremstilling af sproejtestoebte plastemner med indstoebte folier med dekorative og/eller beskrivende tryk samt apparat til brug ved udoevelse af fremgangsmaaden
US4470786A (en) * 1981-07-28 1984-09-11 Omron Tateisi Electronics Co. Molding apparatus with retractable preform support pins
FR2530985A1 (fr) * 1982-07-29 1984-02-03 Itw De France Moule pour obtention d'une grille, notamment par injection, procede et moyens de fabrication et de mise en oeuvre
JPS5993316A (ja) * 1982-11-19 1984-05-29 Toshiba Corp 成形体の製造方法
JPS59129111A (ja) * 1983-01-13 1984-07-25 Toyota Motor Corp ブレ−キパツドの製造方法
JPS59150740A (ja) * 1983-02-16 1984-08-29 Sumitomo Chem Co Ltd 多層成形品の製造方法
JPS59150741A (ja) * 1983-02-16 1984-08-29 Sumitomo Chem Co Ltd 多層成形品の製造方法
JPS60219022A (ja) * 1984-04-16 1985-11-01 Toyota Motor Corp 積層成形用金型
JPH0611500B2 (ja) * 1986-06-17 1994-02-16 住友化学工業株式会社 熱可塑性樹脂のプレス成形方法
JPH0415457Y2 (ko) * 1986-07-23 1992-04-07
JPH0696253B2 (ja) * 1986-09-01 1994-11-30 東芝機械株式会社 射出成形品のパンチ加工方法
US4803030A (en) * 1986-12-09 1989-02-07 Alps Electric Co., Ltd. Method of molding case for push-button switch
JPS63159022A (ja) * 1986-12-23 1988-07-01 Sumitomo Chem Co Ltd 多層成形品の製造方法
US5053179A (en) * 1987-04-30 1991-10-01 Sumitomo Chemical Company, Limited Process for producing a multilayer molded article
JPH0615204B2 (ja) * 1987-05-28 1994-03-02 しげる工業株式会社 真空成形装置
JPH0356328Y2 (ko) * 1987-08-28 1991-12-18
US4956139A (en) * 1987-10-06 1990-09-11 Canon Denshi Kabushiki Kaisha Method of producing an exposure blade
JPH01198314A (ja) * 1988-02-03 1989-08-09 Honda Motor Co Ltd 複合成形体の製造方法及びその製造装置
DE3806517A1 (de) * 1988-03-01 1989-09-14 Akzo Gmbh Rohrboden fuer waerme- und/oder stoffaustauscher, dessen verwendung sowie verfahren zu dessen herstellung
NL8801357A (nl) * 1988-05-27 1989-12-18 Ind Mouldings B V Werkwijze voor het vervaardigen van een roldeur of rolluik.
JPH0656705B2 (ja) * 1988-10-13 1994-07-27 富士写真フイルム株式会社 磁気テープカセットの成形方法
CA2002057C (en) * 1988-11-22 1994-01-25 Yasuhiro Hara Clutch driven plates and method of producing the same
JP2708084B2 (ja) * 1992-03-23 1998-02-04 ワイケイケイ株式会社 シートクッション材に面ファスナー止具を装着する方法および発泡成形金型

Also Published As

Publication number Publication date
CA2098854A1 (en) 1994-01-02
EP0582075B1 (en) 2002-09-11
DE69332285D1 (de) 2002-10-17
KR100259661B1 (en) 2000-06-15
US5770134A (en) 1998-06-23
TW224065B (ko) 1994-05-21
ES2179046T3 (es) 2003-01-16
EP0582075A1 (en) 1994-02-09
DE69332285T2 (de) 2003-07-31
CA2098854C (en) 2005-02-01
US5618567A (en) 1997-04-08
KR940005371A (ko) 1994-03-21

Similar Documents

Publication Publication Date Title
KR940003002A (ko) 집적회로
KR970077555A (ko) 적층형 버텀 리드 패키지
KR900005587A (ko) 반도체 디바이스 및 그 제작방법
KR900005586A (ko) 반도체 디바이스 및 그 형성 방법
KR930024126A (ko) 표면실장소자와 그의 반제품
KR930003795A (ko) 집적 회로 접속 방법
EP0680663A4 (en) METHOD FOR MOUNTING A PIEZOELECTRIC ELEMENT ON A SUBSTRATE.
KR900012526A (ko) 전자부품 반송체
KR830004676A (ko) 회로 패키지들의 제조방법
ES2079700T3 (es) Etiqueta con un holograma.
KR880005564A (ko) 박막자기헤드
KR900700302A (ko) Ic카드 및 그 제조방법
KR970003884A (ko) 반도체 장치
KR880005685A (ko) 혼성집적회로
KR970702536A (ko) 칩 카드(chip card)
KR890003025A (ko) 칩고정 테이프
KR960002710A (ko) 테이프 캐리어 패키지 반도체 장치
KR960039417A (ko) 반도체장치 및 그 제조방법 및 전자장치
KR960015882A (ko) 반도체 장치
KR880700616A (ko) 다층 프린트 기판
RU2003110416A (ru) Машинно-считываемый маркировачный ярлык
SG73480A1 (en) High density integrated circuit package
KR930017158A (ko) 반도체 패키지
TW330339B (en) A semiconductor assembly
KR930003333A (ko) 반도체 디바이스

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid