KR960002710A - 테이프 캐리어 패키지 반도체 장치 - Google Patents

테이프 캐리어 패키지 반도체 장치 Download PDF

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Publication number
KR960002710A
KR960002710A KR1019950007882A KR19950007882A KR960002710A KR 960002710 A KR960002710 A KR 960002710A KR 1019950007882 A KR1019950007882 A KR 1019950007882A KR 19950007882 A KR19950007882 A KR 19950007882A KR 960002710 A KR960002710 A KR 960002710A
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KR
South Korea
Prior art keywords
semiconductor substrate
carrier package
tape carrier
semiconductor device
inner leads
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Application number
KR1019950007882A
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English (en)
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KR0161653B1 (ko
Inventor
미쯔아끼 오소노
나오유끼 타지마
가쯔노부 모리
Original Assignee
쯔지 하루오
샤프 가부시끼가이샤
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Application filed by 쯔지 하루오, 샤프 가부시끼가이샤 filed Critical 쯔지 하루오
Publication of KR960002710A publication Critical patent/KR960002710A/ko
Application granted granted Critical
Publication of KR0161653B1 publication Critical patent/KR0161653B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

반도체장치에 접착된 대향하는 내측 리드 어레이를 갖는 TCP(테이프 캐리어 패키지)에 있어서, 돌출부(들)가 수지가 유출되도록 하는 범위내에서, 반도체의 일측상에 멀리 떨어진 간격으로 배치된 각 내측 리드에 제공된다.

Description

테이프 캐리어 패키지 반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4a도는 본 발명의 1 실시예의 캐리어테이프 패턴의 평면도이다.
제4b도는 제4a도에 보인 캐리어를 경화수지로 밀봉시킨 TCP 반도체장치의 단면도이다.
제5도는 테이프 캐리어 패키지 반도체장치의 제조단계를 보인 흐름도이다.

Claims (4)

  1. 디바이스홀을 갖는 캐리어테이프; 디바이스홀내측에 배치된 반도체 기판; 및 상기 반도체 기판의 캐리어테이프사이에 제공된 복수의 내측리드를 포함하며, 상기 반도체 기판의 제 1 변상에 배열된 내측리드들의 간격이 상기 반도체 기판의 제 2 변상에 배열된 내측리드들의 간격보다 크게 형성되도록 하면서 상기 반도체 기판의 제 1 및 제 2 변이 각각의 상기 디바이스홀의 대향 에지들로부터 같은 거리를 두도록 상기 반도체 기판이 상기 디바이스 내측에 배치될 때, 상기 반도체 기판의 제 1 변에서 상기 디바이스홀의 대향 에지까지의 범위에, 하나의 돌출부 또는 한쌍의 돌출부가 상기 제 1 변상의 각 내측리드의 일측 또는 양측에 제공되는 테이프 캐리어 패키지 반도체 장치.
  2. 제1항에 있어서, 상기 돌출부의 말단부의 형상이 인접한 내측리드의 것과 평행한 선으로 형성되는 테이프 캐리어 패키지 반도체 장치.
  3. 제1항에 있어서, 상기 제 1 변상의 내측리드들간의 전체 간극 면적이 제 2 변상의 내측리드들간의 전체 간극 면적과 같도록 돌출부들의 전체 면적이 결정되는 테이프 캐리어 패키지 반도체 장치.
  4. 제1항에 있어서, 상기 반도체 기판의 제 1 변에서 상기 디바이스홀의 대향 에지까지의 범위에, 하나의 돌출부 또는 한쌍의 돌출부가 상기 제 2 변상의 각 내측리드의 일측 또는 양측에 제공되는 테이프 캐리어 패키지 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950007882A 1994-06-23 1995-03-31 테이프 캐리어 패키지 반도체장치 KR0161653B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-141584 1994-06-23
JP6141584A JP2989476B2 (ja) 1994-06-23 1994-06-23 Ｔｃｐ半導体装置

Publications (2)

Publication Number Publication Date
KR960002710A true KR960002710A (ko) 1996-01-26
KR0161653B1 KR0161653B1 (ko) 1999-02-01

Family

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Family Applications (1)

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KR1019950007882A KR0161653B1 (ko) 1994-06-23 1995-03-31 테이프 캐리어 패키지 반도체장치

Country Status (4)

Country Link
US (1) US5614760A (ko)
JP (1) JP2989476B2 (ko)
KR (1) KR0161653B1 (ko)
TW (1) TW286428B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101907904B1 (ko) 2018-04-27 2018-10-16 주식회사 모습 기념 코인 제조 장치

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5736432A (en) * 1996-09-20 1998-04-07 National Semiconductor Corporation Lead frame with lead finger locking feature and method for making same
US6104619A (en) * 1997-12-16 2000-08-15 Kabushiki Kaisha Toshiba Tape carrier package and its fabrication method therefor
JP3147071B2 (ja) * 1998-01-19 2001-03-19 日本電気株式会社 半導体装置及びその製造方法
KR100574278B1 (ko) * 1998-11-27 2006-09-22 삼성전자주식회사 테이프 캐리어 패키지 및 이를 이용한 액정표시기모듈
US6201299B1 (en) * 1999-06-23 2001-03-13 Advanced Semiconductor Engineering, Inc. Substrate structure of BGA semiconductor package
JP2003258184A (ja) * 2002-02-27 2003-09-12 Nec Kyushu Ltd 半導体装置およびリードフレーム
TW200703606A (en) * 2005-07-15 2007-01-16 Siliconware Precision Industries Co Ltd Semiconductor package and fabrication method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103659A (en) * 1977-02-22 1978-09-09 Takuma Co Ltd Apparatus for sucking sludge in precipitation tank
US4996583A (en) * 1989-02-15 1991-02-26 Matsushita Electric Industrial Co., Ltd. Stack type semiconductor package
US5157478A (en) * 1989-04-19 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Tape automated bonding packaged semiconductor device incorporating a heat sink
US5250842A (en) * 1990-09-07 1993-10-05 Nec Corporation Semiconductor devices using tab tape
JPH05152486A (ja) * 1991-11-26 1993-06-18 Asahi Glass Co Ltd 回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101907904B1 (ko) 2018-04-27 2018-10-16 주식회사 모습 기념 코인 제조 장치

Also Published As

Publication number Publication date
US5614760A (en) 1997-03-25
JPH088277A (ja) 1996-01-12
JP2989476B2 (ja) 1999-12-13
TW286428B (ko) 1996-09-21
KR0161653B1 (ko) 1999-02-01

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