KR870004506A - 표면 패케이징용(Packaging)반도체 패케이지 - Google Patents
표면 패케이징용(Packaging)반도체 패케이지 Download PDFInfo
- Publication number
- KR870004506A KR870004506A KR1019860006340A KR860006340A KR870004506A KR 870004506 A KR870004506 A KR 870004506A KR 1019860006340 A KR1019860006340 A KR 1019860006340A KR 860006340 A KR860006340 A KR 860006340A KR 870004506 A KR870004506 A KR 870004506A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- substrate
- surface packaging
- packaging
- conductor pattern
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 내지 제3도는 이 발명의 한 실시예로서,
제1도는 외관도인데 (a)는 평면도.
제2도는 표면 패케이징용 반도체 패케이지를 기판에 붙인 상태를 나타내는 확대 단면도.
제3도는 기판의 평면도.
도면의 주요부분에 대한 부호의 설명
1 : 모울드(mold) 2 : 리드선
4 : 기판 5 : 도체패턴
8 : 표면 패케이징용 반도체 패케이지 9 : 돌기
10 : 구멍
Claims (1)
- 표면에 도체패턴을 가진 기판표면의 소정위치에 패케이징 되고 상기 도체패턴에 리드선이 접속되는 표면패케이징용 반도체 패케이지에 있어서, 상기 기판에 걸어맞추어 상기 기판에 대한 상기 소정위치로의 위치결정 및 위치변동을 방지하는 돌기를 모울드의 상기 기판으로의 패케이징면측에 설치한 것을 특징으로 하는 표면케패케이징용 반도체 패케이지.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP232659 | 1985-10-17 | ||
JP60232659A JPS6292342A (ja) | 1985-10-17 | 1985-10-17 | 表面実装用半導体パツケ−ジ |
Publications (1)
Publication Number | Publication Date |
---|---|
KR870004506A true KR870004506A (ko) | 1987-05-09 |
Family
ID=16942773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860006340A KR870004506A (ko) | 1985-10-17 | 1986-07-31 | 표면 패케이징용(Packaging)반도체 패케이지 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS6292342A (ko) |
KR (1) | KR870004506A (ko) |
DE (1) | DE3635154A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68925922T2 (de) * | 1988-05-30 | 1996-09-05 | Canon Kk | Elektrischer Schaltungsapparat |
DE10031762A1 (de) * | 2000-06-29 | 2002-01-10 | Bosch Gmbh Robert | Elektronisches Bauelement |
JP5493920B2 (ja) | 2010-01-29 | 2014-05-14 | オムロン株式会社 | 実装部品、電子機器および実装方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7322421U (de) * | 1973-06-15 | 1973-12-13 | Doehler P | Steckfassung fuer integrierte schaltungsbauteile mit einem gehaeuse, von welchem zwei parallele reihen von kontaktsteckerstiften wegragen |
FR2538166A1 (fr) * | 1982-12-17 | 1984-06-22 | Thomson Csf | Microboitier d'encapsulation d'un composant electronique, muni d'une pluralite de connexions repliees |
-
1985
- 1985-10-17 JP JP60232659A patent/JPS6292342A/ja active Pending
-
1986
- 1986-07-31 KR KR1019860006340A patent/KR870004506A/ko not_active Application Discontinuation
- 1986-10-13 DE DE19863635154 patent/DE3635154A1/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
DE3635154A1 (de) | 1987-04-23 |
JPS6292342A (ja) | 1987-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |