KR860001681A - 플레트-리드 포장형 전자소자의 장착구조 - Google Patents

플레트-리드 포장형 전자소자의 장착구조 Download PDF

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Publication number
KR860001681A
KR860001681A KR1019850005293A KR850005293A KR860001681A KR 860001681 A KR860001681 A KR 860001681A KR 1019850005293 A KR1019850005293 A KR 1019850005293A KR 850005293 A KR850005293 A KR 850005293A KR 860001681 A KR860001681 A KR 860001681A
Authority
KR
South Korea
Prior art keywords
lead
electronic device
flat
mounting structure
packaged electronic
Prior art date
Application number
KR1019850005293A
Other languages
English (en)
Other versions
KR910000996B1 (ko
Inventor
쓰요시 야마모도 (외 2)
Original Assignee
야마모도 다꾸마
후지쓰 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마모도 다꾸마, 후지쓰 가부시끼 가이샤 filed Critical 야마모도 다꾸마
Publication of KR860001681A publication Critical patent/KR860001681A/ko
Application granted granted Critical
Publication of KR910000996B1 publication Critical patent/KR910000996B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

내용 없음

Description

플레트-리드 포장형 전자소자의 장착구조
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 FLP전자소자의 납땜부에서 파괴를 설명하는 부분적 개략도.
제2도는 FLP전자소자의 냉각기구의 개략도.
제5도는 본 발명에 따른 실시예의 부분적 개략도.
* 도면의 주요 부분에 대한 부호의 설명
1 : FLP전자소자 2 : 인쇄배선판 3,31 : 보강부재 5 : 리드단자.

Claims (6)

  1. 펙키지(package)표면으로부터 튀어나온 리드단자의 끝이 펙키지 평면에 대하여 수평이 되도록 굽어 있으며 상기 리드단자의 나머지 부분은 평면의 법선에 대하여 소망각도만큼 안쪽으로 경사진 것을 특징으로 하는 플레트-리드 포장형(flat-lead package type) 전자소자의 장착구조(mounting structute).
  2. 제1항에 있어서, 상기 리드단자를 접속하는 보강부재가 상기 전자소자와 상기 소자가 배열되는 인쇄배선판 사이의 간극(gap)에 제공되는 것을 특징으로 하는 플레트-리드 포장형 전자소자의 장착구조.
  3. 제2항에 있어서, 상기 보강부재는 상기 부재측면에 제공되는 홈에서 상기 리드단자와 접속되는 것을 특징으로 하는 플레트-리드 포장형 전자소자의 장착구조.
  4. 제1항에 있어서, 상기 소망각도가 θ0인 것을 특징으로 하는 플레트-리드 포장형 전자소자의 장착구조.
  5. 제1항에 있어서, 상기 보강부재는 상기 리드단자를 접촉하여 이를 보강하는 것을 특징으로 하는 플레트-리드 포장형 전자소자의 장착구조.
  6. 제1항에 있어서, 상기 보강부재는 상기 리드단자의 소망각도를 형성하는 것을 특징으로 하는 플레트-리드 포장형 전자소자의 장착구조.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850005293A 1984-07-24 1985-07-24 플레트-리드 포장형 전자소자의 장착구조 KR910000996B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP84-153403 1984-07-24
JP59-153403 1984-07-24
JP15340384A JPS6132490A (ja) 1984-07-24 1984-07-24 フラツトリ−ドパツケ−ジ型電子部品の取付け構造

Publications (2)

Publication Number Publication Date
KR860001681A true KR860001681A (ko) 1986-03-20
KR910000996B1 KR910000996B1 (ko) 1991-02-19

Family

ID=15561725

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850005293A KR910000996B1 (ko) 1984-07-24 1985-07-24 플레트-리드 포장형 전자소자의 장착구조

Country Status (9)

Country Link
US (1) US4703393A (ko)
EP (1) EP0169788B1 (ko)
JP (1) JPS6132490A (ko)
KR (1) KR910000996B1 (ko)
AU (1) AU565047B2 (ko)
BR (1) BR8503495A (ko)
CA (1) CA1233910A (ko)
DE (1) DE3582091D1 (ko)
ES (1) ES8609873A1 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JP2726042B2 (ja) * 1987-02-03 1998-03-11 三菱電機株式会社 半導体装置
US4862247A (en) * 1987-11-24 1989-08-29 Texas Instruments Incorporated Contact joint for semiconductor chip carriers
CA1327710C (en) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Cooling system for ic package
US4827611A (en) * 1988-03-28 1989-05-09 Control Data Corporation Compliant S-leads for chip carriers
JPH01313969A (ja) * 1988-06-13 1989-12-19 Hitachi Ltd 半導体装置
US5191404A (en) * 1989-12-20 1993-03-02 Digital Equipment Corporation High density memory array packaging
JP3187106B2 (ja) * 1991-12-27 2001-07-11 ローム株式会社 電気回路素子のパッケージ構造
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5455386A (en) * 1994-01-14 1995-10-03 Olin Corporation Chamfered electronic package component
US5969259A (en) * 1995-04-07 1999-10-19 Sensym, Inc. Side port package for micromachined fluid sensor
US5610436A (en) * 1995-06-07 1997-03-11 Bourns, Inc. Surface mount device with compensation for thermal expansion effects
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5883789A (en) * 1997-09-19 1999-03-16 United Technologies Corporation Method of mounting a PC board to a hybrid
US6339534B1 (en) * 1999-11-05 2002-01-15 International Business Machines Corporation Compliant leads for area array surface mounted components

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3588618A (en) * 1970-03-02 1971-06-28 Raychem Corp Unsoldering method and apparatus using heat-recoverable materials
US4377316A (en) * 1981-02-27 1983-03-22 International Business Machines Corporation High density interconnection means for chip carriers
JPS57155758A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
EP0169788A2 (en) 1986-01-29
JPS6132490A (ja) 1986-02-15
KR910000996B1 (ko) 1991-02-19
AU4525585A (en) 1986-01-30
BR8503495A (pt) 1986-04-15
JPH0256838B2 (ko) 1990-12-03
DE3582091D1 (de) 1991-04-18
AU565047B2 (en) 1987-09-03
EP0169788A3 (en) 1987-11-04
US4703393A (en) 1987-10-27
EP0169788B1 (en) 1991-03-13
CA1233910A (en) 1988-03-08
ES545480A0 (es) 1986-09-01
ES8609873A1 (es) 1986-09-01

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