ES8609873A1 - Una estructura de montaje de un componente electronico de plomo en hojas del tipo de paquete - Google Patents

Una estructura de montaje de un componente electronico de plomo en hojas del tipo de paquete

Info

Publication number
ES8609873A1
ES8609873A1 ES545480A ES545480A ES8609873A1 ES 8609873 A1 ES8609873 A1 ES 8609873A1 ES 545480 A ES545480 A ES 545480A ES 545480 A ES545480 A ES 545480A ES 8609873 A1 ES8609873 A1 ES 8609873A1
Authority
ES
Spain
Prior art keywords
flat
electronic component
mounting structure
type electronic
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES545480A
Other languages
English (en)
Other versions
ES545480A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of ES545480A0 publication Critical patent/ES545480A0/es
Publication of ES8609873A1 publication Critical patent/ES8609873A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Se trata de una estructura de montaje de un componente eletrónico del tipo de paquete de conductores planos, en la cual los extremos de los terminales de conductor sacados fuera de la superficie del paquete están curvados para quedar horizontales respecto al plano del paquete, y las otras partes de dichos terminales están inclinadas hacia adentro un ángulo deseado respecto a la normal al plano.
ES545480A 1984-07-24 1985-07-23 Una estructura de montaje de un componente electronico de plomo en hojas del tipo de paquete Expired ES8609873A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15340384A JPS6132490A (ja) 1984-07-24 1984-07-24 フラツトリ−ドパツケ−ジ型電子部品の取付け構造

Publications (2)

Publication Number Publication Date
ES545480A0 ES545480A0 (es) 1986-09-01
ES8609873A1 true ES8609873A1 (es) 1986-09-01

Family

ID=15561725

Family Applications (1)

Application Number Title Priority Date Filing Date
ES545480A Expired ES8609873A1 (es) 1984-07-24 1985-07-23 Una estructura de montaje de un componente electronico de plomo en hojas del tipo de paquete

Country Status (9)

Country Link
US (1) US4703393A (es)
EP (1) EP0169788B1 (es)
JP (1) JPS6132490A (es)
KR (1) KR910000996B1 (es)
AU (1) AU565047B2 (es)
BR (1) BR8503495A (es)
CA (1) CA1233910A (es)
DE (1) DE3582091D1 (es)
ES (1) ES8609873A1 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JP2726042B2 (ja) * 1987-02-03 1998-03-11 三菱電機株式会社 半導体装置
US4862247A (en) * 1987-11-24 1989-08-29 Texas Instruments Incorporated Contact joint for semiconductor chip carriers
CA1327710C (en) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Cooling system for ic package
US4827611A (en) * 1988-03-28 1989-05-09 Control Data Corporation Compliant S-leads for chip carriers
JPH01313969A (ja) * 1988-06-13 1989-12-19 Hitachi Ltd 半導体装置
US5191404A (en) * 1989-12-20 1993-03-02 Digital Equipment Corporation High density memory array packaging
JP3187106B2 (ja) * 1991-12-27 2001-07-11 ローム株式会社 電気回路素子のパッケージ構造
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5455386A (en) * 1994-01-14 1995-10-03 Olin Corporation Chamfered electronic package component
US5969259A (en) * 1995-04-07 1999-10-19 Sensym, Inc. Side port package for micromachined fluid sensor
US5610436A (en) * 1995-06-07 1997-03-11 Bourns, Inc. Surface mount device with compensation for thermal expansion effects
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5883789A (en) * 1997-09-19 1999-03-16 United Technologies Corporation Method of mounting a PC board to a hybrid
US6339534B1 (en) * 1999-11-05 2002-01-15 International Business Machines Corporation Compliant leads for area array surface mounted components

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3588618A (en) * 1970-03-02 1971-06-28 Raychem Corp Unsoldering method and apparatus using heat-recoverable materials
US4377316A (en) * 1981-02-27 1983-03-22 International Business Machines Corporation High density interconnection means for chip carriers
JPS57155758A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
DE3582091D1 (de) 1991-04-18
JPH0256838B2 (es) 1990-12-03
KR860001681A (ko) 1986-03-20
CA1233910A (en) 1988-03-08
EP0169788A3 (en) 1987-11-04
JPS6132490A (ja) 1986-02-15
AU4525585A (en) 1986-01-30
US4703393A (en) 1987-10-27
EP0169788A2 (en) 1986-01-29
EP0169788B1 (en) 1991-03-13
BR8503495A (pt) 1986-04-15
KR910000996B1 (ko) 1991-02-19
ES545480A0 (es) 1986-09-01
AU565047B2 (en) 1987-09-03

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19990201