JPS5537784A - Terminal with solder - Google Patents

Terminal with solder

Info

Publication number
JPS5537784A
JPS5537784A JP11182078A JP11182078A JPS5537784A JP S5537784 A JPS5537784 A JP S5537784A JP 11182078 A JP11182078 A JP 11182078A JP 11182078 A JP11182078 A JP 11182078A JP S5537784 A JPS5537784 A JP S5537784A
Authority
JP
Japan
Prior art keywords
solder
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11182078A
Other languages
Japanese (ja)
Other versions
JPS58827B2 (en
Inventor
Seidoraa Jiyatsuku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ennovi Advanced Mobility Solutions NJ Inc
Original Assignee
North American Specialties Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/935,151 external-priority patent/US4203648A/en
Application filed by North American Specialties Corp filed Critical North American Specialties Corp
Publication of JPS5537784A publication Critical patent/JPS5537784A/en
Publication of JPS58827B2 publication Critical patent/JPS58827B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Resistors (AREA)
JP53111820A 1978-08-23 1978-09-13 solder terminal Expired JPS58827B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/935,151 US4203648A (en) 1977-08-15 1978-08-23 Solder bearing terminal

Publications (2)

Publication Number Publication Date
JPS5537784A true JPS5537784A (en) 1980-03-15
JPS58827B2 JPS58827B2 (en) 1983-01-08

Family

ID=25466629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53111820A Expired JPS58827B2 (en) 1978-08-23 1978-09-13 solder terminal

Country Status (6)

Country Link
JP (1) JPS58827B2 (en)
DE (1) DE2841665C2 (en)
FR (1) FR2433999A1 (en)
GB (1) GB2029652B (en)
IT (1) IT1192659B (en)
NL (1) NL185593C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61147614A (en) * 1984-12-21 1986-07-05 Nippon Gakki Seizo Kk Analog delay circuit

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3345993A1 (en) * 1983-12-20 1985-06-27 Siemens AG, 1000 Berlin und 8000 München LAYER SWITCHING WITH TERMINALS
JPS6219382A (en) * 1985-07-19 1987-01-28 株式会社東芝 Electric driver
FR2625040B1 (en) * 1987-12-22 1991-01-04 Cit Alcatel CONNECTION DELAY PLOT FOR FIXING A CLAW SPINDLE ON THE WAFER OF A HYBRID CIRCUIT SUBSTRATE

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3351704A (en) * 1965-03-18 1967-11-07 Berg Electronics Inc Soldering aid terminal
US3689684A (en) * 1971-02-05 1972-09-05 Du Pont Lead frame connector and electronic packages containing same
US3750252A (en) * 1972-05-01 1973-08-07 Du Pont Solder terminal strip
US4019803A (en) * 1975-10-15 1977-04-26 E. I. Du Pont De Nemours And Company Solder substrate clip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61147614A (en) * 1984-12-21 1986-07-05 Nippon Gakki Seizo Kk Analog delay circuit

Also Published As

Publication number Publication date
DE2841665A1 (en) 1980-03-06
GB2029652A (en) 1980-03-19
NL185593B (en) 1989-12-18
IT7851310A0 (en) 1978-09-29
IT1192659B (en) 1988-05-04
GB2029652B (en) 1983-01-12
NL7812031A (en) 1980-02-26
NL185593C (en) 1990-05-16
FR2433999A1 (en) 1980-03-21
JPS58827B2 (en) 1983-01-08
DE2841665C2 (en) 1987-04-23
FR2433999B1 (en) 1983-11-10

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