GB2029652A - Solder bearing terminal clip - Google Patents
Solder bearing terminal clip Download PDFInfo
- Publication number
- GB2029652A GB2029652A GB7836130A GB7836130A GB2029652A GB 2029652 A GB2029652 A GB 2029652A GB 7836130 A GB7836130 A GB 7836130A GB 7836130 A GB7836130 A GB 7836130A GB 2029652 A GB2029652 A GB 2029652A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder
- body portion
- finger
- mass
- clip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 241000237858 Gastropoda Species 0.000 description 5
- 239000002184 metal Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
Abstract
A terminal clip for attachment to a contact pad on a substrate S comprises an elongate body portion longitudinally split along two lines to define a central finger 37, and one or more additional fingers 36, the fingers 36, 37 being bent out of the plane of the body portion and defining a gap for receiving the substrate S, and a mass 41 of solder mechanically engaged with finger 37 in a position to be melted for bonding the clip to one or two surfaces of the contact pad. <IMAGE>
Description
SPECIFICATION
Solder bearing terminal
This application is a continuation-in-part of U.S.
Application Serial No. 824,441,filed August 15, 1977.
This invention relates to a solder bearing terminal clip for attachment to a contact pad on a substrate wherein one or two solder plugs are mechanically engaged with the clip in positions to be melted for bonding the clip to the contact pad.
Various means have been provided wherein a quantity of solder is associated with a terminal clip so that when the clip has been positioned on a contact pad (usually a metal surface on a substrate introduced into the jaws of the clip) and the assembly is heated, the molten solder covers the adjacent surfaces of the clip and pad to form, when cool, a soldered metallurgical joint between the clip and pad. Clips of this general type are shown in Cox et al.
U.S. Patent No 3,689,684 wherein the pads are pre-tinned; Landman U.S. Patent No. 3,750,252 wherein a continuous solder wire extends along a strip of clips and is held by a bent back clip arm; and
Schell U.S. Patent No. 4,019,803 wherein an individual solder mass is soldered to a clip arm on the side opposite the contact surface with a solder globule extending across one or both edges of the arm to the adjacent contact surface.
The present invention includes a terminal clip for securementto a contact pad on a substrate comprising an elongated clip body portion having a free end and a stem end, said body portion being cut longitudinally along two lines to define a central finger between spaced portions of the body portion, said finger being bent out of the plane of the body portion at approximately the point of attachment of said finger to the body portion, the free end of said body portion beyond said point of attachment consituting at least one additional finger and being bent out of the plane of the body portion in the same direction as the central finger, said central finger and additional finger defining a gap to receive the substrate, and a mass of solder, the central finger being wrapped at least 1800 around said mass of solder for holding said mass of solder in a position adjacent said gap and on the side thereof nearer the stem end of the body portion.
The invention also includes a terminal clip for securement to a contact pad on a substrate comprising a clip body portion, a plurality of contact fingers projecting from an end of the body portion and bent to define a gap adapted to receive the edge of a substrate, and a mass of solder, said fingers including a pair of fingers spaced laterally apart and located distally of the clip and a central finger having a width corresponding substantially to the distance between said spaced fingers, said central finger including means wrapped at least 1800 around said mass of solder for holding said mass of solder in a position adjacent said gap and on the side thereof nearer the clip body portion.
In a terminal clip according to the present invention the solder mass can be securely attached to the central finger in a purely mechanical manner.
Suitably, each clip has its own supply of solder in two convenient locations for melting to form bonds with a pad.
A solder and clip assembly according to the invention can be made by very simple and efficient stamping steps.
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
Figure 1 represents a side view of a clip according to the invention;
Figure 2 represents a front elevation of the clip shown in Figure 1;
Figure 3 represents a plan view of the blank as stamped to produce a clip according to Figures 1 and 2;
Figure 4 represents a detail side view of the head of a first modified form of clip;
Figure 5 represents a section on the line V-V of
Figure 4;
Figure 6 represents a plan view of the blank as stamped to produce a clip according to Figures 4 and 5;
Figure 7 represents a detail side view of the head of a second modified form of clip;
Figure 8 represents a section on the line VIII-VIII in
Figure 7; and
Figure 9 represents a detail plan view of the blank as stamped to produce the clip of Figures 7 and 8.
Referring to the drawings, and particularly to
Figures 1 to 3, the solder terminal strip includes a continuous carrier strip 11 with individual terminal clips 12 connected thereto by stems 13. The carrier strip may be provided with pilot holes 14 at regular intervals, as is customary.
Each clip includes a flat body portion 15, a pair of spring fingers 16, bent to extend upwardly and laterally from the plane of the body portion distally of the clip and spaced apart by the width of a central spring finger 17 which extends laterally in a position spaced from and substantially parallel to the fingers 16, defining a gap 21 adapted to receive the edge of a substrate (not shown). The fingers 16 and 17 are formed from the blank shown in Figure 4 by the parallel cuts 18 which extend from the free end and terminate at end points 18'. The free end of the finger 17 is curved arcuately away from the fingers 16, in a position to wrap around and grip securely, through more than 180 , the short cylindrical mass or slug of solder 22, as clearly shown in Figures 1 and 2.
The terminal clip just described, or an array of several such terminal clips, is applied to the edge of a substrate having one or several contact pads, with the finger 17 resting against the pad (the assembly being inverted) and heat is supplied to melt the solder, which flows around the finger 17 and bonds the clip securely to the substrate with a good electrical contact. The solder, in this clip, is held on the side of the gap nearer the body portion.
While clips of the type just described have been widely and successfully used, there may be situations where the solder from a single slug fails to form a strong and reliable bond. Provision is therefore made for using two solder plugs, one on each opposite surface of the substrate, as described below.
Referring to Figures 4 to 6, the first modified form of clip is shown as having a flat body portion 25, a single central spring finger 27 formed from the blank shown in Figure 6 by the U-shaped cut 28, which has its ends 28' directed toward the free end of the body portion and oppositely disposed additional spring finger 26, said latter finger being constituted by the free end of the body portion itself. The free ends of the fingers 26 and 27 are arcuately curved away from each other (and from the gap 29) in positions to wrap around and grip securely, through more than 180", the cylindrical masses or slugs of solder 30 and 31.
The application of such a clip to a contact pad on a substrate is effected in the same manner as described above, except that a soldered bond can be formed by each of the two solder slugs, on opposite surfaces of the substrate.
The second modified form of clip, shown in
Figures 7 to 9, is basically the same as that shown in
Figures 4 to 6, having a single central finger 37 formed from the main body 35 of the blank by a
U-shaped cut 38 and an oppositelydisposed-addi- tional finger 36. The fingers 36 and 37 are arcuately curved away from each other and wrapped, through more than 180 , around the cylindrical masses or slugs of solder 40 and 41. In this clip, however, each of the fingers 36 and 37 is provided with a narrow elongated slot 42 and 43, respectively, so located longitudinally of the fingers that the slotted portions of the fingers define the gap 39 into which the edge of a substrate S is to be introduced, as shown in
Figure 7.The narrow finger portions on each side of each slot bite into the softer metal of the solder plugs to give the fingers an extra strong grip on the slugs, and the slots provide additional access for the solder, when melted, to flow onto the substrate surface at and near the points of contact between the fingers and such surface. This multiplies the soldered area by including the walls of the slots as well as the substrate and finger surfaces, creating improved electrical conductivity as well as stronger binding.
While the slots are shown in connection with the double solder clips of Figures 7 to 9, advantages would also result from the provision of a slot in the single finger 17 of Figures 1 to 3, if desired, or either one of the slots 42 or 43 could be omitted. In Figures
1 to 3 the total width of the fingers 16 should equal or slightly exceed the width of the central finger 17, to substantially equalize the strength of the fingers on opposite sides of the gap 21.
In each of the clips described above, the solder slug, in the form of a cylindrical bar or wire is in firm
mechanical engagement with the clip fingers or
body, in a position to be melted for the formation of
a bond between the fingers and terminal pad or the
like. The solder slugs may, if desired, have a
cross-section of square or other geometrical form, or
be made from spherical pellets. Each clip also can be
made by simple stamping and assembling steps, with minimal waste of material.
It will thus be seen that the objects set forth above,
among those made apparent from the preceding
description, are efficiently attained and, since certain changes may be made in the above article without department from the spirit and scope of the invention, it is intended that all matter contained in the above description and shown in the accompanying drawing shall be interpreted as illustrative and not in a limiting sense.
Claims (12)
1. A terminal clip for securement to a contact pad on a substrate comprising an elongated clip body portion having a free end and a stem end, said body portion being cut longitudinally along two lines to define a central finger between spaced portions of the body portion, said finger being bent out of the plane of the body portion at approximately the point of attachment of said finger to the body portion, the free end of said body portion beyond said point of attachment constituting at least one additional finger and being bent out of the plane of the body portion in the same direction as the central finger, said central finger and additional finger defining a gap to receive the substrate, and a mass of solder, the central finger being wrapped at least 180 around said mass of solder for holding said mass of solder in a position adjacent said gap and on the side thereof nearer the stem end of the body portion.
2. A terminal clip according to claim 1 wherein the mass of solder is cylindrical.
3. Aterminal clip according to claim 1 wherein the body portion is cut on lines extending from its free end to form two additional fingers.
4. Aterminal clip according to claim 1 wherein the cut in the body portion is substantially U-shaped with its ends directed toward the free end of the body portion and spaced therefrom and wherein said free end constitutes the additional finger.
5. A terminal clip according to claim 4 which includes an additional mass of solder, the additional finger being wrapped at least 180 around said additional mass of solder for holding said mass of solder in a position adjacent said gap and on the side thereof farther from the stem end of the body portion.
6. A terminal clip according to claim 5 wherein said masses of solder are cylindrical.
7. Aterminal clip according to claim 1 wherein the finger is provided with a slot extending between the mass of solder and the gap.
8. A terminal clip according to claim 5 wherein at least one finger is provided with a slot extending between the mass of solder and the gap.
9. Aterminal clip according to claim 5 wherein each finger is provided with a slot extending between the respective mass of solder and the gap.
10. Aterminal clipforsecurementto a contact pad on a substrate comprising a clip body portion, a plurality of contact fingers projecting from an end of the body portion and bent to define a gap adapted to receive the edge of substrate, and a mass of solder, said fingers including a pair of fingers spaced laterally apart and located distally of the clip and a central finger having a width corresponding substantially to the distance between said spaced fingers, said central finger including means wrapped at least 180 around said mass of solder for holding said mass of solder in a position adjacent said gap and on the side thereof nearer the clip body portion.
11. Aterminal clip according to claim 10 wherein the mass of solder is cylindrical.
12. Aterminal clip constructed and arranged substantially as hereinbefore described with reference to, and as illustrated in, the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/935,151 US4203648A (en) | 1977-08-15 | 1978-08-23 | Solder bearing terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2029652A true GB2029652A (en) | 1980-03-19 |
| GB2029652B GB2029652B (en) | 1983-01-12 |
Family
ID=25466629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7836130A Expired GB2029652B (en) | 1978-08-23 | 1978-09-08 | Solder bearing terminal clip |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS58827B2 (en) |
| DE (1) | DE2841665A1 (en) |
| FR (1) | FR2433999A1 (en) |
| GB (1) | GB2029652B (en) |
| IT (1) | IT1192659B (en) |
| NL (1) | NL185593C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2625040A1 (en) * | 1987-12-22 | 1989-06-23 | Cit Alcatel | CONNECTION DELAY PLOT FOR FIXING A CLAW SPINDLE ON THE WAFER OF A HYBRID CIRCUIT SUBSTRATE |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3345993A1 (en) * | 1983-12-20 | 1985-06-27 | Siemens AG, 1000 Berlin und 8000 München | LAYER SWITCHING WITH TERMINALS |
| JPH0732342B2 (en) * | 1984-12-21 | 1995-04-10 | ヤマハ株式会社 | Analog delay circuit |
| JPS6219382A (en) * | 1985-07-19 | 1987-01-28 | 株式会社東芝 | Electric driver |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3351704A (en) * | 1965-03-18 | 1967-11-07 | Berg Electronics Inc | Soldering aid terminal |
| US3689684A (en) * | 1971-02-05 | 1972-09-05 | Du Pont | Lead frame connector and electronic packages containing same |
| US3750252A (en) * | 1972-05-01 | 1973-08-07 | Du Pont | Solder terminal strip |
| US4019803A (en) * | 1975-10-15 | 1977-04-26 | E. I. Du Pont De Nemours And Company | Solder substrate clip |
-
1978
- 1978-09-08 GB GB7836130A patent/GB2029652B/en not_active Expired
- 1978-09-13 JP JP53111820A patent/JPS58827B2/en not_active Expired
- 1978-09-14 FR FR7826468A patent/FR2433999A1/en active Granted
- 1978-09-25 DE DE19782841665 patent/DE2841665A1/en active Granted
- 1978-09-29 IT IT51310/78A patent/IT1192659B/en active
- 1978-12-11 NL NLAANVRAGE7812031,A patent/NL185593C/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2625040A1 (en) * | 1987-12-22 | 1989-06-23 | Cit Alcatel | CONNECTION DELAY PLOT FOR FIXING A CLAW SPINDLE ON THE WAFER OF A HYBRID CIRCUIT SUBSTRATE |
| EP0322696A1 (en) * | 1987-12-22 | 1989-07-05 | Alcatel Cit | Contact pad for connecting a clip-on terminal to a hybrid circuit substrate wafer |
| US4991666A (en) * | 1987-12-22 | 1991-02-12 | Societe Anonyme Dite: Alcatel Cit | Terminal pad for fixing a clawed pin to the edge of a hybrid circuit substrate and a connection formed thereby |
Also Published As
| Publication number | Publication date |
|---|---|
| NL185593C (en) | 1990-05-16 |
| FR2433999B1 (en) | 1983-11-10 |
| IT1192659B (en) | 1988-05-04 |
| JPS58827B2 (en) | 1983-01-08 |
| DE2841665A1 (en) | 1980-03-06 |
| IT7851310A0 (en) | 1978-09-29 |
| NL185593B (en) | 1989-12-18 |
| DE2841665C2 (en) | 1987-04-23 |
| NL7812031A (en) | 1980-02-26 |
| FR2433999A1 (en) | 1980-03-21 |
| JPS5537784A (en) | 1980-03-15 |
| GB2029652B (en) | 1983-01-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19970908 |