KR920003567A - 반도체장치 - Google Patents

반도체장치 Download PDF

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Publication number
KR920003567A
KR920003567A KR1019910012322A KR910012322A KR920003567A KR 920003567 A KR920003567 A KR 920003567A KR 1019910012322 A KR1019910012322 A KR 1019910012322A KR 910012322 A KR910012322 A KR 910012322A KR 920003567 A KR920003567 A KR 920003567A
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KR
South Korea
Prior art keywords
semiconductor device
tip portion
disposed
cross
lead electrode
Prior art date
Application number
KR1019910012322A
Other languages
English (en)
Other versions
KR940003744B1 (ko
Inventor
노조무 다카하시
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR920003567A publication Critical patent/KR920003567A/ko
Application granted granted Critical
Publication of KR940003744B1 publication Critical patent/KR940003744B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

내용 없음.

Description

반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예에 따른 반도체장치를 나타낸 외관도.
제2도는 본 발명의 1실시예에 따른 반도체장치를 상세히 나타낸 도면으로 a도는 정면도, b도는 측면도, c도는 평면도.
제3도 및 제4도는 각각 본 발명의 다른 실시예를 나타낸 측면도.
제5도 및 제6도는 종래의 반도체장치를 나타낸 외관도이다.
* 도면의 주요부분에 대한 부호의 설명
101 : 마운트용 리드전극 102 : 본딩용 리드전극
103 : LED 칩 104 : 본딩와이어
105 : 몰드수지(mold 樹脂)

Claims (2)

  1. 선단부의 단면상에 복수개의 반도체소자(103)가 배설되어 있는 제1리드전극(101)과, 상기 제1리드전극(101)의 선단부의 근방에 각 선단부가 위치하도록 배치되고, 각 선단부의 단면에는 상기 반도체소자(103)간에서 전기적 접속을 도모하는 본딩와이어(104)의 접속부가 각가 설치된 복수개의 제2리드전극(102)을 구비하고서, 상기 단면측에서 보면 상기 복수개의 제2리드전극(102)의 각 접속부가 일직선상에 배열되지 않도록 구성된 것을 특징으로 하는 반도체장치.
  2. 제1항에 있어서, 상기 제1이 리드전극(101)의 선단부의 단면상에는 3개 이상의 반도체소자(103)가 배설된 것을 특징으로 하는 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910012322A 1990-07-24 1991-07-19 반도체장치 KR940003744B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP02-195917 1990-07-24
JP2195917A JP2535651B2 (ja) 1990-07-24 1990-07-24 半導体装置

Publications (2)

Publication Number Publication Date
KR920003567A true KR920003567A (ko) 1992-02-29
KR940003744B1 KR940003744B1 (ko) 1994-04-28

Family

ID=16349134

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910012322A KR940003744B1 (ko) 1990-07-24 1991-07-19 반도체장치

Country Status (5)

Country Link
US (1) US5218233A (ko)
EP (1) EP0468341B1 (ko)
JP (1) JP2535651B2 (ko)
KR (1) KR940003744B1 (ko)
DE (1) DE69118602T2 (ko)

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DE29825022U1 (de) * 1997-07-29 2004-04-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
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AUPQ818100A0 (en) * 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
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DE10261365B4 (de) * 2002-12-30 2006-09-28 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer Mehrzahl von strahlungsemittierenden Halbleiterchips
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US8569960B2 (en) 2011-11-14 2013-10-29 Willis Electric Co., Ltd Conformal power adapter for lighted artificial tree
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Also Published As

Publication number Publication date
US5218233A (en) 1993-06-08
EP0468341B1 (en) 1996-04-10
JPH0482279A (ja) 1992-03-16
DE69118602D1 (de) 1996-05-15
JP2535651B2 (ja) 1996-09-18
KR940003744B1 (ko) 1994-04-28
DE69118602T2 (de) 1996-09-26
EP0468341A1 (en) 1992-01-29

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