KR920007093A - 하이브리드형 반도체장치 - Google Patents

하이브리드형 반도체장치 Download PDF

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Publication number
KR920007093A
KR920007093A KR1019910015609A KR910015609A KR920007093A KR 920007093 A KR920007093 A KR 920007093A KR 1019910015609 A KR1019910015609 A KR 1019910015609A KR 910015609 A KR910015609 A KR 910015609A KR 920007093 A KR920007093 A KR 920007093A
Authority
KR
South Korea
Prior art keywords
circuit board
semiconductor device
hybrid semiconductor
island regions
hole
Prior art date
Application number
KR1019910015609A
Other languages
English (en)
Inventor
시게키 사코
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR920007093A publication Critical patent/KR920007093A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Abstract

내용 없음

Description

하이브리드형 반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예에 따른 하이브리드형 반도체장치를 나타낸 단면도,
제2도는 상기 제1도의 관통구머 근방을 상세하게 나타낸 단면도,
제3도는 본 발명의 다른 실시예에 따른 하이브리드형 반도체장치를 나타낸 단면도.

Claims (1)

  1. 하나 또는 복수의 섬영역(22)을 갖춘 리드프레임과, 관통구멍(25)을 갖춘 절연회로기판(21), 상기 하나 또는 복수의 섬영역(22)과 상기 절연회로기판(21)의 이면을 접착시키고 상기 하나 또는 복수의 섬영역(22)과 절연 회로기판(21)의 사이에서와 상기 절연회로기판(21)의 이면과 교차하는 방향에서만 도전성을 갖는 이방성 조전페이스트(23)및 상기 절연회로기판(21)의 표면에 형성되어 상기 관통구멍(25)을 매개해서 상기 이방성 도전페이스트(23)에 접속되는 배선패턴(24)을 구비한 것을 특징으로 하는 하이브리드형 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910015609A 1990-09-11 1991-09-07 하이브리드형 반도체장치 KR920007093A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP02-238881 1990-09-11
JP2238881A JPH04119654A (ja) 1990-09-11 1990-09-11 ハイブリッド型半導体装置

Publications (1)

Publication Number Publication Date
KR920007093A true KR920007093A (ko) 1992-04-28

Family

ID=17036656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910015609A KR920007093A (ko) 1990-09-11 1991-09-07 하이브리드형 반도체장치

Country Status (2)

Country Link
JP (1) JPH04119654A (ko)
KR (1) KR920007093A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19609583A1 (de) * 1995-03-14 1996-09-19 Borg Warner Automotive Kk Spannarm und Kettenführung für einen hydraulischen Kettenspanner
US5690569A (en) * 1996-03-13 1997-11-25 Borg-Warner Automotive, Inc. Single piece reinforced chain guide
US5813935A (en) * 1996-07-23 1998-09-29 Borg-Warner Automotive, Inc. Chain guide with extruded wear face
US5846150A (en) * 1997-03-21 1998-12-08 Borg-Warner Automotive, Inc. Guide posts for guiding and damping chain movement

Also Published As

Publication number Publication date
JPH04119654A (ja) 1992-04-21

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