KR850001658A - 인쇄 배선판 - Google Patents

인쇄 배선판 Download PDF

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Publication number
KR850001658A
KR850001658A KR1019840005250A KR840005250A KR850001658A KR 850001658 A KR850001658 A KR 850001658A KR 1019840005250 A KR1019840005250 A KR 1019840005250A KR 840005250 A KR840005250 A KR 840005250A KR 850001658 A KR850001658 A KR 850001658A
Authority
KR
South Korea
Prior art keywords
wiring board
printed wiring
pattern
printed
host
Prior art date
Application number
KR1019840005250A
Other languages
English (en)
Other versions
KR890004824B1 (en
Inventor
유따까 이가라시
Original Assignee
사바 쇼오이찌
가부시기 가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15708315&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR850001658(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 사바 쇼오이찌, 가부시기 가이샤 도시바 filed Critical 사바 쇼오이찌
Publication of KR850001658A publication Critical patent/KR850001658A/ko
Application granted granted Critical
Publication of KR890004824B1 publication Critical patent/KR890004824B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

내용 없음

Description

인쇄 배선판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명의 한 실시예의 PW판을 확대도시한 저면도, 제5도는 제4도의 Ⅳ-Ⅳ선 단면도, 제7도는 제5도의 Ⅱ-Ⅱ선에 따른 확대도시한 단면도.

Claims (1)

  1. 주인쇄배선판에 주인쇄판이 형성된 제1의 배선패턴을 수식하는 제2의 배선패턴을 형성한 부인쇄배선판을 장착한 인쇄배선판에 있어서, 상기 부인쇄배선판을 플렉시블기판으로 구성하고, 이 프렉시블기판과 상기 주인쇄배선판을 접착시킨 후 상기 제1의 배선패턴과 제2의 재선패턴과의 전기적 접속을 납땜으로 형성한 인쇄배선판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR8405250A 1983-08-31 1984-08-28 Printed circuit board KR890004824B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58-160121 1983-08-31
JP58160121A JPS6052084A (ja) 1983-08-31 1983-08-31 印刷配線基板

Publications (2)

Publication Number Publication Date
KR850001658A true KR850001658A (ko) 1985-03-30
KR890004824B1 KR890004824B1 (en) 1989-11-27

Family

ID=15708315

Family Applications (2)

Application Number Title Priority Date Filing Date
KR8405250A KR890004824B1 (en) 1983-08-31 1984-08-28 Printed circuit board
KR1019890010315A KR890004825B1 (ko) 1983-08-31 1989-07-19 인쇄배선판

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1019890010315A KR890004825B1 (ko) 1983-08-31 1989-07-19 인쇄배선판

Country Status (5)

Country Link
US (2) US4742431A (ko)
EP (1) EP0137279B1 (ko)
JP (1) JPS6052084A (ko)
KR (2) KR890004824B1 (ko)
DE (2) DE3485957T2 (ko)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60144262U (ja) * 1984-03-01 1985-09-25 東京プリント工業株式会社 ジヤンパ−用の配線パタ−ンを備えたプリント配線板
DE3432360A1 (de) * 1984-09-03 1986-03-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum aendern einer elektrischen flachbaugruppe
US4977441A (en) * 1985-12-25 1990-12-11 Hitachi, Ltd. Semiconductor device and tape carrier
JPH02117196A (ja) * 1988-10-26 1990-05-01 Canon Inc プリント基板
EP0430842A3 (en) * 1989-11-27 1991-07-17 International Business Machines Corporation Apparatus and method for reworking printed wire circuit boards
US5018005A (en) * 1989-12-27 1991-05-21 Motorola Inc. Thin, molded, surface mount electronic device
US5053357A (en) * 1989-12-27 1991-10-01 Motorola, Inc. Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon
US5335553A (en) * 1990-11-15 1994-08-09 Tokyo Gas Co. Ltd. Fluidic gas meter provided with a printed wiring board
US5184284A (en) * 1991-09-03 1993-02-02 International Business Machines Corporation Method and apparatus for implementing engineering changes for integrated circuit module
US5276590A (en) * 1991-10-24 1994-01-04 International Business Machines Corporation Flex circuit electronic cards
US5264664A (en) * 1992-04-20 1993-11-23 International Business Machines Corporation Programmable chip to circuit board connection
JP2856240B2 (ja) * 1992-10-30 1999-02-10 インターナショナル・ビジネス・マシーンズ・コーポレイション プリント回路基板を再加工する方法
US5314346A (en) * 1992-12-18 1994-05-24 International Business Machines Corporation Flexible circuit applique patch customization for generic programmable cable assemblies
US5423684A (en) * 1993-03-02 1995-06-13 Mitsubishi Denki Kabushiki Kaisha Apparatus and method for forming a switchboard unit circuit
US5307241A (en) * 1993-03-25 1994-04-26 Northern Telecom Limited Electronic circuit board arrangements including main auxiliary circuit boards
JP3396541B2 (ja) * 1993-08-30 2003-04-14 株式会社東芝 混成集積回路装置を搭載した回路基板
US5371326A (en) * 1993-08-31 1994-12-06 Clearwaters-Dreager; Cindy Non-toxic fabric conductors and method for making same
US5386343A (en) * 1993-11-12 1995-01-31 Ford Motor Company Double surface mount technology for electronic packaging
US5471163A (en) * 1993-11-16 1995-11-28 Hewlett-Packard Company Tab circuit fusible links for disconnection or encoding information
US5459081A (en) * 1993-12-21 1995-10-17 Nec Corporation Process for transferring a device to a substrate by viewing a registration pattern
US5639323A (en) * 1995-02-17 1997-06-17 Aiwa Research And Development, Inc. Method for aligning miniature device components
JP3202525B2 (ja) * 1995-03-27 2001-08-27 キヤノン株式会社 電気回路基板及びそれを備えた表示装置
DE19752938C2 (de) * 1997-11-28 2000-05-31 Pelikan Produktions Ag Egg Umkodierung von Tintendruckköpfen
JPH11307886A (ja) * 1998-04-21 1999-11-05 Matsushita Electric Ind Co Ltd フリップチップ接合ランドうねり防止パターン
US6161915A (en) * 1998-06-19 2000-12-19 Lexmark International, Inc Identification of thermal inkjet printer cartridges
US6291776B1 (en) 1998-11-03 2001-09-18 International Business Machines Corporation Thermal deformation management for chip carriers
US6379772B1 (en) 1999-06-24 2002-04-30 International Business Machines Corporation Avoiding polymer fill of alignment sites
JP4485460B2 (ja) * 2004-12-16 2010-06-23 三井金属鉱業株式会社 フレキシブルプリント配線板
US7234944B2 (en) * 2005-08-26 2007-06-26 Panduit Corp. Patch field documentation and revision systems
JP2007067244A (ja) * 2005-08-31 2007-03-15 Sony Corp 回路基板
JP4723431B2 (ja) * 2006-07-28 2011-07-13 シャープ株式会社 回路基板の製造方法
TWI402566B (zh) * 2008-12-18 2013-07-21 Chunghwa Picture Tubes Ltd 具有導線圖案之接墊區以及監控膜材貼附偏差之方法
TWI547216B (zh) * 2012-11-23 2016-08-21 Flexible circuit board and connector welding structure
US9265155B2 (en) 2013-03-15 2016-02-16 International Business Machines Corporation Flexible rework device
AU2016405035B2 (en) * 2016-04-27 2019-07-18 Mitsubishi Electric Corporation Motor driving device and air conditioner

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179913A (en) * 1962-01-25 1965-04-20 Ind Electronic Hardware Corp Rack with multilayer matrix boards
DE1952273A1 (de) * 1969-10-17 1971-04-29 Licentia Gmbh Verfahren zum automatischen Ausrichten
DE1919991C3 (de) * 1969-04-19 1973-11-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Anordnung zur automatischen Aus richtung von zwei aufeinander einzu justierenden Objekten
US3683105A (en) * 1970-10-13 1972-08-08 Westinghouse Electric Corp Microcircuit modular package
US3795047A (en) * 1972-06-15 1974-03-05 Ibm Electrical interconnect structuring for laminate assemblies and fabricating methods therefor
US3912852A (en) * 1974-05-31 1975-10-14 Westinghouse Electric Corp Thin-film electrical circuit lead connection arrangement
US4049903A (en) * 1974-10-23 1977-09-20 Amp Incorporated Circuit film strip and manufacturing method
US3968563A (en) * 1975-03-27 1976-07-13 E. I. Du Pont De Nemours And Company Precision registration system for leads
US4234666A (en) * 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
DE2836092A1 (de) * 1978-08-17 1980-02-28 Siemens Ag Elektrische baugruppe mit einer flexiblen gefalteten leiterfolie
GB2034527B (en) * 1978-10-11 1983-03-02 Matsushita Electric Ind Co Ltd Method of manufacturing flexible printed circuit sheets
GB2034127B (en) * 1978-10-13 1983-05-18 Matsushita Electric Ind Co Ltd Printed circuits and methods their manufacture
JPS55138291A (en) * 1979-04-11 1980-10-28 Alps Electric Co Ltd Substrate for mounting electric parts
DE2946726C2 (de) * 1979-11-20 1982-05-19 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
FR2515917B3 (fr) * 1981-10-29 1986-05-23 Hewlett Packard France Sa Liaison electrique de circuits imprimes et son procede d'etablissement
US4621278A (en) * 1981-12-30 1986-11-04 Sanyo Electric Co., Ltd. Composite film, semiconductor device employing the same and method of manufacturing

Also Published As

Publication number Publication date
EP0137279A2 (en) 1985-04-17
DE3485957D1 (de) 1992-11-19
DE3484700D1 (de) 1991-07-18
KR890004825B1 (ko) 1989-11-27
KR890004824B1 (en) 1989-11-27
JPS6052084A (ja) 1985-03-23
DE3485957T2 (de) 1993-03-04
US4742431A (en) 1988-05-03
EP0137279A3 (en) 1986-06-11
EP0137279B1 (en) 1991-06-12
US4674182A (en) 1987-06-23

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