KR880010641A - 양면메모리 보드 - Google Patents
양면메모리 보드 Download PDFInfo
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- KR880010641A KR880010641A KR1019880001839A KR880001839A KR880010641A KR 880010641 A KR880010641 A KR 880010641A KR 1019880001839 A KR1019880001839 A KR 1019880001839A KR 880001839 A KR880001839 A KR 880001839A KR 880010641 A KR880010641 A KR 880010641A
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제 1 실시예를 도시한 중요부분 단면도,
제 2 도는 본 발명의 제 1 실시예를 도시한 중요부분 평면도,
제 3 도는 본 발명의 제 2 실시예를 도시한 메모리 모듈에 사용하는 프린트 배서니판의 윗면(면 내장부품의 주요부착면)만의 배선 패턴을 도시한 평면도.
Claims (9)
- (a) 장방형의 절연기판, (b) 상기 기판으리 제 1 주면에 땜납에 의해 면 내장된 적어도 8개의 메모리 IC몰드체, 여기에서 상기 메모리 IC의 각각은 윗면이 장방형의 상자형 몰드체이고 그 한쌍의 긴쪽면에서 다수의 리드가 돌출하여 그들을 거쳐서 상기 기판에 납땜되어 있고, 또, 상기 다수의 몰드체는 서로 그 긴쪽면이 접근하도록 또한 상기 기판의 전 표면을 덮도록 1열로 배열되어 있고, (C) 상기 기판의 제 1 주면에 마련된 상기 다수의 몰드체를 내장하기 위한 다수의 납땜용 구리 패드, ((d) 상기 기판의 제 1 주면에 마련된 다수의 어드레스 라인을 구성하는 제 1 구리 가는선군, 상기 제 1 구리 가는선군은 상기 다수의 납땜 패드 사이를 통하여 상기 기판의 긴쪽 방향에 동일기판을 종단하도록 배치되어 있고, (e) 상기 기판의 제 2 주면에 마련된 Vcc플레이트용 구리 섬형상 패턴과 Vss용 구리 섬형상 패턴, 이 두 패턴은 상기 제 2 주면의 전면을 덮도록 배치되어 있고, (f) 상기 기판의 제 1 긴변측 끝부분의 적어도 제 2 주면에 마련된 외부접촉용 다수의 패트, (g) 상기 기판의 제 2 주면에 마련된 데이터 입출력 라인을 구성하는 제 2 구리 가는선군, 이 제 2 구리 가는선군은 상기 VcC 및 Vss패턴 사이를 통해서 상기 기판의 짧은변 방향으로 상기 제 2 주면을 횡단해서 다수의 상기 외부 접속용 패드와 접속되어 있는 것을 포함하여 되는 메모리 IC내장체.
- 특허청구의 범위 제 1 항에 있어서, 상기 기판의 제 1 및 제 2 의 주면 사이에는 다른 배선층이 없는 메모리 IC내장체.
- 특허청구의 범위 제 1 항에 있어서 또, (h) 상기 기판의 납땜용 패드, 외부 접속용 패드 및 스루홀이외의 제 1 주면의 전면을 카바하도록 형성된 땜납 레지스트 필름을 포함하여 되는 메모리 IC내장체.
- 특허청구의 범위 제 3 항에 있어서 또, (i) 적어도 상기 납땜용 패드위에 형성된 구리 패드 산화방지용 땜납코드층을 포함하여 되는 메모리 IC내장체.
- 특허청구의 범위 제 1 항에 있어서, 상기 제 2 주면의 Vcc 또는 Vss플레이트는 그 전면에 다수의 열린 구멍 부분을 가지는 메모리 IC내장체.
- 그 위에 다수의 메모리 IC몰드체를 면 내장한 프린트 기판에 있어서, 이 프린트 기판의 한쪽 주면에는 그 전체를 덮은 Vcc 또는 Vss플레이트가 형성되고 다른쪽 주면에는 그 외의 배선이 형성되어 상기 제1과 제2의 주면 사이에 다른 배선층이 없는 것을 특징으로 하는 메모리 IC내장체.
- 특허청구의 범위 제 6 항에 있어서 또, (j) 상기 기판의 납땜용 패드, 외부 접속용 패드 및 스루홀 이외의 제 1 주면의 전면을 카바하도록 형성된 땜납레지스트 필름을 포함하여 되는 다수의 메모리 IC내장체.
- 특허청구의 범위 제 7항에 있어서 또, (k)적어도 상기 납땜용 패드위에 형성된 구리 패드산화방지용 땜납코드층을 포함하여 되는 메모리 IC내장체.
- 상기 특허청구의 범위 제 6 항에 있어서, 상기 제 2 주면의 Vcc 또는 Vss플레이트는 그 전면에 다수의 열린 구멍부분을 가지는 메모리 IC내장체.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-42677 | 1987-02-27 | ||
JP62042677A JPS63211692A (ja) | 1987-02-27 | 1987-02-27 | 両面配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880010641A true KR880010641A (ko) | 1988-10-10 |
KR970003991B1 KR970003991B1 (ko) | 1997-03-24 |
Family
ID=12642661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880001839A KR970003991B1 (ko) | 1987-02-27 | 1988-02-23 | 양면 메모리보드 및 그것을 사용한 메모리 모듈 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5095407A (ko) |
JP (1) | JPS63211692A (ko) |
KR (1) | KR970003991B1 (ko) |
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ES2080392T3 (es) * | 1991-08-01 | 1996-02-01 | Siemens Ag | Conexion de enchufe para redes de ordenadores en el area domestica. |
US6413410B1 (en) * | 1996-06-19 | 2002-07-02 | Lifescan, Inc. | Electrochemical cell |
AUPN661995A0 (en) | 1995-11-16 | 1995-12-07 | Memtec America Corporation | Electrochemical cell 2 |
US6863801B2 (en) | 1995-11-16 | 2005-03-08 | Lifescan, Inc. | Electrochemical cell |
DE19639369A1 (de) * | 1996-09-25 | 1998-03-26 | Philips Patentverwaltung | Leiterplatte |
US6310782B1 (en) * | 1996-10-31 | 2001-10-30 | Compaq Computer Corporation | Apparatus for maximizing memory density within existing computer system form factors |
ATE227844T1 (de) * | 1997-02-06 | 2002-11-15 | Therasense Inc | Kleinvolumiger sensor zur in-vitro bestimmung |
US6338790B1 (en) * | 1998-10-08 | 2002-01-15 | Therasense, Inc. | Small volume in vitro analyte sensor with diffusible or non-leachable redox mediator |
DE19854271A1 (de) * | 1998-11-25 | 2000-05-31 | Ilfa Industrieelektronik Und L | Leiterplatte |
JP2001212631A (ja) * | 2000-02-01 | 2001-08-07 | Tokai Rika Co Ltd | 回路素子接続方法 |
US6417462B1 (en) * | 2000-06-19 | 2002-07-09 | Intel Corporation | Low cost and high speed 3-load printed wiring board bus topology |
US6815621B2 (en) * | 2000-10-02 | 2004-11-09 | Samsung Electronics Co., Ltd. | Chip scale package, printed circuit board, and method of designing a printed circuit board |
DE10130592C1 (de) | 2001-06-27 | 2002-10-24 | Infineon Technologies Ag | Modulbaugruppe für Speicher-Module und Verfahren zu ihrer Herstellung |
US6944694B2 (en) * | 2001-07-11 | 2005-09-13 | Micron Technology, Inc. | Routability for memory devices |
CN1232818C (zh) * | 2001-10-10 | 2005-12-21 | 生命扫描有限公司 | 电化学电池 |
US6965170B2 (en) * | 2003-11-18 | 2005-11-15 | International Business Machines Corporation | High wireability microvia substrate |
US7161088B2 (en) * | 2003-12-04 | 2007-01-09 | Dell Products L.P. | System, method and apparatus for optimizing power delivery and signal routing in printed circuit board design |
FI117234B (fi) * | 2004-05-17 | 2006-07-31 | Aspocomp Technology Oy | Piirilevy, valmistusmenetelmä ja elektroninen laite |
JP2006100716A (ja) * | 2004-09-30 | 2006-04-13 | Orion Denki Kk | 電子部品の取付方向を表示した電子機器 |
US20060139983A1 (en) * | 2004-12-23 | 2006-06-29 | Sprietsma John T | Memory module routing |
KR100660889B1 (ko) * | 2005-11-14 | 2006-12-26 | 삼성전자주식회사 | 반도체 패키지의 위스커 결함을 억제하는 인쇄회로기판 및이를 이용한 반도체 패키지 탑재방법 |
JP4650453B2 (ja) * | 2007-05-21 | 2011-03-16 | 株式会社デンソー | 高電圧機器モジュール |
KR101356143B1 (ko) * | 2012-05-15 | 2014-01-27 | 크루셜텍 (주) | 지문센서 패키지 및 그 제조방법 |
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US3564114A (en) * | 1967-09-28 | 1971-02-16 | Loral Corp | Universal multilayer printed circuit board |
US3546539A (en) * | 1968-05-28 | 1970-12-08 | Texas Instruments Inc | Integrated circuit mounting panel |
US3917984A (en) * | 1974-10-01 | 1975-11-04 | Microsystems Int Ltd | Printed circuit board for mounting and connecting a plurality of semiconductor devices |
US4190901A (en) * | 1977-12-01 | 1980-02-26 | Honeywell Information Systems Inc. | Printed circuit board apparatus which facilitates fabrication of units comprising a data processing system |
US4255852A (en) * | 1977-12-01 | 1981-03-17 | Honeywell Information Systems Inc. | Method of constructing a number of different memory systems |
JPS5724775U (ko) * | 1980-07-17 | 1982-02-08 | ||
DE3172643D1 (en) * | 1981-12-23 | 1985-11-14 | Ibm Deutschland | Multilayer ceramic substrate for semiconductor integrated circuits with a multilevel metallic structure |
JPS58159360A (ja) * | 1982-03-17 | 1983-09-21 | Fujitsu Ltd | 半導体装置 |
US4490775A (en) * | 1982-05-24 | 1984-12-25 | Westinghouse Electric Corp. | Universal programmable interface |
US4672421A (en) * | 1984-04-02 | 1987-06-09 | Motorola, Inc. | Semiconductor packaging and method |
US4580193A (en) * | 1985-01-14 | 1986-04-01 | International Business Machines Corporation | Chip to board bus connection |
-
1987
- 1987-02-27 JP JP62042677A patent/JPS63211692A/ja active Pending
-
1988
- 1988-02-23 KR KR1019880001839A patent/KR970003991B1/ko not_active IP Right Cessation
-
1989
- 1989-08-23 US US07/397,352 patent/US5095407A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR970003991B1 (ko) | 1997-03-24 |
US5095407A (en) | 1992-03-10 |
JPS63211692A (ja) | 1988-09-02 |
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