KR970051126A - 메모리카드 - Google Patents

메모리카드 Download PDF

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Publication number
KR970051126A
KR970051126A KR1019960072354A KR19960072354A KR970051126A KR 970051126 A KR970051126 A KR 970051126A KR 1019960072354 A KR1019960072354 A KR 1019960072354A KR 19960072354 A KR19960072354 A KR 19960072354A KR 970051126 A KR970051126 A KR 970051126A
Authority
KR
South Korea
Prior art keywords
wiring
power supply
memory card
board
supply voltage
Prior art date
Application number
KR1019960072354A
Other languages
English (en)
Inventor
아끼노리 세끼야마
Original Assignee
세끼자와 다다시
후지쓰 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세끼자와 다다시, 후지쓰 가부시끼가이샤 filed Critical 세끼자와 다다시
Publication of KR970051126A publication Critical patent/KR970051126A/ko

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

본 발명의 목적은 전원배선의 전압을 안정화시킬 수 있는 메모리카드를 용이하게 제조함에 있다.
프린트배선기판(32)은 다층기판이며, 그 1층에는 전면에 걸쳐 전원배선이 설비된다. 기판(32)에는 배선(37)을 형성한 면과는 별도의 면에 메모리LSI(35)가 탑재된다. 기판(32)의 변(32A, 32B)에는 복수의 신호선(36)이 레이아우트된다. 변(32A)에는 전원배선(37)에 접속된 인입배선(37A)이 인터페이스 커넥터(13)의 5V계의 전원단자에 대응하여 레이아우트된다. 변(32B)에는 전원배선(37)에 접속된 인입배선(37B)이 커넥터(13)의 3V계의 전원단자에 대응하여 레이아우트된다. 변(32A)에 커넥터(13)를 접속하면 5V계 전원용의 메모리카드(30)가 구성된다.

Description

메모리카드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 제1실시예의 메모리카드를 나타낸 평단면도.

Claims (3)

  1. 인터페이스 커넥터에 접속되고, 탑재되는 메모리장치에 전원을 공급하기 위한 전원전압을 형성한 프린트배선기판을 갖는 메모리카드에 있어서, 프린트배선기판에는 상기 전원배선에 접속되고, 또한 전원전압의 값에 대응하는 상이한 레이아우트의 인입배선을 각각 갖춘 복수의 배선군이 설치되고, 탑재되는 메모리장치의 전원전압의 값에 대응한 레이아우트의 인입배선을 갖춘 배선군에 대하여 인터페이스 커넥터를 접속한 메모리카드.
  2. 제1항에 있어서, 상기 탑재되는 메모리장치는 전원전압의 값에 대응한 레이아우트의 인입배선을 갖춘 배선군을 포함한 복수의 배선군에 대하여 개별적으로 인터페이스 커넥터를 접속한 메모리카드.
  3. 제1항 또는 제2항에 있어서, 상기 프린트배선기판은 다층기판으로 구성되고, 상기 다층기판의 1층 전체에 전원배선이 할당되어 있는 메모리카드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960072354A 1995-12-28 1996-12-26 메모리카드 KR970051126A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7342757A JPH09180430A (ja) 1995-12-28 1995-12-28 メモリカード
JP95-342757 1995-12-28

Publications (1)

Publication Number Publication Date
KR970051126A true KR970051126A (ko) 1997-07-29

Family

ID=18356265

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019960072354A KR100232553B1 (ko) 1995-12-28 1996-12-26 메모리카드
KR1019960072354A KR970051126A (ko) 1995-12-28 1996-12-26 메모리카드

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1019960072354A KR100232553B1 (ko) 1995-12-28 1996-12-26 메모리카드

Country Status (4)

Country Link
US (1) US5745426A (ko)
JP (1) JPH09180430A (ko)
KR (2) KR100232553B1 (ko)
TW (1) TW316968B (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3718008B2 (ja) * 1996-02-26 2005-11-16 株式会社日立製作所 メモリモジュールおよびその製造方法
US6028781A (en) * 1996-12-19 2000-02-22 Texas Instruments Incorporated Selectable integrated circuit assembly and method of operation
DE19724053A1 (de) * 1997-06-07 1998-12-10 Biotronik Mess & Therapieg Elektronische Speichervorrichtung, insbesondere zur Anwendung bei implantierbaren medizinischen Geräten
US6108228A (en) * 1997-12-02 2000-08-22 Micron Technology, Inc. Quad in-line memory module
US6062480A (en) * 1998-07-20 2000-05-16 Vlsi Technologies, Inc. Hot docking system and methods for detecting and managing hot docking of bus cards
US6172895B1 (en) * 1999-12-14 2001-01-09 High Connector Density, Inc. High capacity memory module with built-in-high-speed bus terminations
JP2001210921A (ja) * 2000-01-28 2001-08-03 Mitsumi Electric Co Ltd プリント基板
US6449166B1 (en) * 2000-08-24 2002-09-10 High Connection Density, Inc. High capacity memory module with higher density and improved manufacturability
US6940153B2 (en) * 2003-02-05 2005-09-06 Hewlett-Packard Development Company, L.P. Magnetic shielding for magnetic random access memory card
CN100405880C (zh) * 2004-12-24 2008-07-23 鸿富锦精密工业（深圳）有限公司 引脚连接结构及其脚位定义的修改方法
KR101177555B1 (ko) * 2006-02-01 2012-08-27 삼성전자주식회사 메모리 카드, 메모리 카드의 데이터 구동 방법, 그리고메모리 카드 시스템
DE102006018874A1 (de) * 2006-04-24 2007-10-25 Infineon Technologies Ag Schaltungsanordnung zur Koppelung einer Spannungsversorgung an ein Halbleiterbauelement, Verfahren zur Herstellung der Schaltungsanordnung sowie Datenverarbeitungsgerät umfassend die Schaltungsanordnung
KR20100041515A (ko) * 2008-10-14 2010-04-22 삼성전자주식회사 제거 가능한 보조 검사단자를 갖는 솔리드 스테이트 드라이브의 검사방법
US8753138B2 (en) 2012-10-09 2014-06-17 International Business Machines Corporation Memory module connector with auxiliary power
US8856417B2 (en) 2012-10-09 2014-10-07 International Business Machines Corporation Memory module connector with auxiliary power cable

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3082323B2 (ja) * 1991-07-30 2000-08-28 ソニー株式会社 メモリモジュール
JPH05233901A (ja) * 1992-02-18 1993-09-10 Mitsubishi Electric Corp Ｉｃカード、ｉｃカード搭載用メモリｉｃ及びｉｃカードのメモリ容量の確認方法
US5469399A (en) * 1993-03-16 1995-11-21 Kabushiki Kaisha Toshiba Semiconductor memory, memory card, and method of driving power supply for EEPROM
US5272664A (en) * 1993-04-21 1993-12-21 Silicon Graphics, Inc. High memory capacity DRAM SIMM

Also Published As

Publication number Publication date
US5745426A (en) 1998-04-28
KR100232553B1 (ko) 1999-12-01
TW316968B (ko) 1997-10-01
JPH09180430A (ja) 1997-07-11

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