KR980007895A - 플라스틱 볼 그리드 어레이 모듈 - Google Patents

플라스틱 볼 그리드 어레이 모듈 Download PDF

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KR980007895A
KR980007895A KR1019970015783A KR19970015783A KR980007895A KR 980007895 A KR980007895 A KR 980007895A KR 1019970015783 A KR1019970015783 A KR 1019970015783A KR 19970015783 A KR19970015783 A KR 19970015783A KR 980007895 A KR980007895 A KR 980007895A
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circuit board
printed circuit
pads
pcb
grid array
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KR1019970015783A
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KR100294602B1 (ko
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프란시스코 가르베리
스테파노 오기오니
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제프리 엘. 포맨
인터내셔널 비지네스 머신즈 코포레이션
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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

본 발명은 가변 영역의 도전성 금속 패드를 가진 플라스틱 볼 그리드 어레이 전자 패키지에 관한 것이다. 중앙 패드는 최종 패키지에 미치는 워페이지 효과를 보상하기 위해서 가장자리에 가까운 패드보다 넓게 되어 있다.

Description

플라스틱 볼 그리드 어레이 모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도 5는 본 발명의 바람직한 실시예의 단면도.
도 6은 본 발며의 바람직한 실시예에 다른 플라스틱 BGA 모듈의 금속 패드의 달라진 구조의 평면도.

Claims (9)

  1. 볼 그리드 어레이 전자 모듈 제작용의 인쇄 회로 기판(PCB)로서, 제1 면에 실직적으로 구형인 다수의 땜납 합금 부분과 접속 가능한 다수의 도전성 금속 패드를 가진 인쇄 회로 기판(PCB)에 있어서, 상기 다수의 패드들이 가변성(variable) 표면 영역을 갖는 인쇄 회로 기판.
  2. 제1항에 있어서, 상기 다수의 도전성 금속 패드들은 제1 표면 영역을 가진 적에도 제1 세트의 패드와 제2 표면 영역을 갖는 적어도 제2 세트의 패드를 포함하는 인쇄 회로 기판.
  3. 제2항에 있어서, 상기 제1 세트의 패드는 상기 PCB의 제1 부분에 배치되고 상기 제2 세트의 패드는 상기 PCB의 제2 부분에 배치되는 인쇄 회로 기판.
  4. 제3항에 있어서, 상기 제1 부분은 상기 PCB의 중앙에 위치해 있고 상기 제2 부분은 상기 제1 부분 주위에 위치해 있는 인쇄 회로 기판.
  5. 제2항, 제3항 또는 제4항에 있어서, 상기 제1 표면 영역은 상기 제2 표면 영역보다 큰 인쇄 회로 기판.
  6. 제5항에 있어서, 상기 제1 표면 영역은 상기 제2 표면 영역보다 25% 더 큰 인쇄 회로 기판.
  7. 제1항 내지 제6항 중 어느 한 항에 있어서, 유기 기판(organic substrate)을 가진 인쇄 회로 기판.
  8. 제1항 내지 제7항 중 어느 한 항에 따른 PCB를 포함하며, 상기 PCB는 제2면에 다수의 패드에 접속된 적어도 하나의 전자 소자에 접속 가능한 도전성 층을 갖는 플라스틱 볼 그리드 어레이 모듈.
  9. 제8항에 있어서, 상기 제1 영역은 적어도 하나의 전자 소자와 연통하여 (incorrespondence with) 위치되어 있는 플라스틱 볼 그리드 어레이 모듈.
KR1019970015783A 1996-06-19 1997-04-26 상이한크기의땜납장착패드를갖는전자볼그리드어레이모듈 KR100294602B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9612769A GB2314463A (en) 1996-06-19 1996-06-19 PCB mounting pad arrangement for plastic ball grid array module
GB9612769.1 1996-06-19

Publications (2)

Publication Number Publication Date
KR980007895A true KR980007895A (ko) 1998-03-30
KR100294602B1 KR100294602B1 (ko) 2001-09-17

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EP (1) EP0814511A3 (ko)
JP (1) JPH1056102A (ko)
KR (1) KR100294602B1 (ko)
CN (1) CN1168617A (ko)
GB (1) GB2314463A (ko)
TW (1) TW345797B (ko)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
KR20200111520A (ko) 2019-03-19 2020-09-29 현대자동차주식회사 자동차용 대시 판넬 어셈블리 및 대시 판넬용 더스트 커버 판넬

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US7074049B2 (en) * 2004-03-22 2006-07-11 Johnstech International Corporation Kelvin contact module for a microcircuit test system
JP2006190902A (ja) * 2005-01-07 2006-07-20 Denso Corp 半導体電子部品の実装方法及び半導体電子部品の配線基板
JP4595823B2 (ja) 2006-01-24 2010-12-08 株式会社デンソー ボールグリッドアレイ
KR100818109B1 (ko) * 2007-03-15 2008-03-31 주식회사 하이닉스반도체 볼 그리드 어레이 패키지 제조용 볼 어태치 장치
US8766453B2 (en) * 2012-10-25 2014-07-01 Freescale Semiconductor, Inc. Packaged integrated circuit having large solder pads and method for forming
CN111755339B (zh) * 2020-06-30 2022-03-25 青岛歌尔微电子研究院有限公司 基于变形基板的锡膏植球方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200111520A (ko) 2019-03-19 2020-09-29 현대자동차주식회사 자동차용 대시 판넬 어셈블리 및 대시 판넬용 더스트 커버 판넬

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CN1168617A (zh) 1997-12-24
GB2314463A (en) 1997-12-24
EP0814511A2 (en) 1997-12-29
EP0814511A3 (en) 1998-11-18
JPH1056102A (ja) 1998-02-24
KR100294602B1 (ko) 2001-09-17
GB9612769D0 (en) 1996-08-21
TW345797B (en) 1998-11-21

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