JP2007067244A - 回路基板 - Google Patents
回路基板 Download PDFInfo
- Publication number
- JP2007067244A JP2007067244A JP2005252888A JP2005252888A JP2007067244A JP 2007067244 A JP2007067244 A JP 2007067244A JP 2005252888 A JP2005252888 A JP 2005252888A JP 2005252888 A JP2005252888 A JP 2005252888A JP 2007067244 A JP2007067244 A JP 2007067244A
- Authority
- JP
- Japan
- Prior art keywords
- rigid
- substrate
- land
- wiring board
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/137—Stamp from multiple row sheet type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】複数の第1のランド部60を一面に有する第1のリジッド基板3と、複数の第2のランド部61を一面に有する第2のリジッド基板6と、それらに挟持されると共に第1のランド部に対応する第3のランド部10を一面に有し且つ第2のランド部に対応する第4のランド部11を他面に有するフレキシブル配線板2と、を備えて構成されている。第1のランド部及び第3のランド部に対して第2のランド部及び第4のランド部を、互いの位置をずらして配置すると共に、第1のランド部と第3のランド部の少なくとも一部、及び第2のランド部と第4のランド部の少なくとも一部をそれぞれ電気的に接続した。
【選択図】 図8
Description
Claims (3)
- 所定間隔に配置された複数の第1のランド部を一面に有する第1のリジッド基板と、
所定間隔に配置された複数の第2のランド部を一面に有する第2のリジッド基板と、
前記第1のリジッド基板と前記第2のリジッド基板とで挟持されると共に前記複数の第1のランド部に対応する複数の第3のランド部を一面に有し且つ前記複数の第2のランド部に対応する複数の第4のランド部を他面に有するフレキシブル配線板と、を備え、
前記複数の第1のランド部及び前記複数の第3のランド部に対して前記複数の第2のランド部及び前記複数の第4のランド部を、互いの位置をずらして配置すると共に、複数の第1のランド部と複数の第3のランド部の少なくとも一部、及び複数の第2のランド部と複数の第4のランド部の少なくとも一部をそれぞれ電気的に接続した
ことを特徴とする回路基板。 - 前記第1のリジッド基板と前記第2のリジッド基板と前記フレキシブル配線板には、前記複数の第1のランド部と前記複数の第3のランド部を位置合わせすると共に前記複数の第2のランド部と前記複数の第4のランド部を位置合わせするための位置決め穴をそれぞれ設けたことを特徴とする請求項1記載の回路基板。
- 前記第1のリジッド基板の前記複数の第1のランド部と反対側の面及び前記第2のリジッド基板の前記複数の第2のランド部と反対側の面の少なくとも一方には電子部品を実装したことを特徴とする請求項1記載の回路基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005252888A JP2007067244A (ja) | 2005-08-31 | 2005-08-31 | 回路基板 |
US11/508,939 US7292448B2 (en) | 2005-08-31 | 2006-08-24 | Circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005252888A JP2007067244A (ja) | 2005-08-31 | 2005-08-31 | 回路基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007067244A true JP2007067244A (ja) | 2007-03-15 |
Family
ID=37910902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005252888A Abandoned JP2007067244A (ja) | 2005-08-31 | 2005-08-31 | 回路基板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7292448B2 (ja) |
JP (1) | JP2007067244A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6100976B1 (ja) * | 2015-06-24 | 2017-03-22 | 株式会社メイコー | 立体配線基板、及び立体配線基板の製造方法 |
WO2024172410A1 (ko) * | 2023-02-14 | 2024-08-22 | 삼성전자 주식회사 | 연성 인쇄 회로 기판 및 이를 포함하는 전자 장치 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101406112B (zh) * | 2006-03-20 | 2011-03-02 | 住友电木株式会社 | 电路板和连接基板 |
US7881064B2 (en) * | 2008-03-24 | 2011-02-01 | International Business Machines Corporation | Flexible paddle card for installation on a motherboard of a computing system |
CN101562952B (zh) * | 2008-04-18 | 2012-04-11 | 富葵精密组件(深圳)有限公司 | 线路基板、线路基板的制作方法及电路板的制作方法 |
JPWO2010007704A1 (ja) * | 2008-07-16 | 2012-01-05 | イビデン株式会社 | フレックスリジッド配線板及び電子デバイス |
EP2301065A4 (en) * | 2008-07-17 | 2013-06-12 | Autoliv Asp Inc | METHOD FOR MANUFACTURING ELECTRONIC ASSEMBLY |
WO2010013366A1 (ja) | 2008-07-30 | 2010-02-04 | イビデン株式会社 | フレックスリジッド配線板及びその製造方法 |
EP2446808A4 (en) * | 2009-06-25 | 2013-01-02 | Olympus Medical Systems Corp | IMAGE CAPTURE UNIT |
US7995334B2 (en) * | 2010-01-06 | 2011-08-09 | Apple Inc. | Printed circuit board |
TW201130405A (en) * | 2010-02-23 | 2011-09-01 | Ibiden Co Ltd | Flex-rigid wiring board and method for manufacturing the same |
US20120325524A1 (en) * | 2011-06-23 | 2012-12-27 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
US9266717B2 (en) * | 2013-03-15 | 2016-02-23 | Versana Micro Inc | Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor |
CN204859733U (zh) * | 2013-04-19 | 2015-12-09 | 株式会社村田制作所 | 柔性基板 |
KR102415361B1 (ko) * | 2015-07-30 | 2022-07-01 | 엘지이노텍 주식회사 | 기판 유닛과 기판 어셈블리 및 그것을 이용한 카메라 모듈 |
US11021892B2 (en) * | 2016-08-17 | 2021-06-01 | Amesbury Group, Inc. | Locking system having an electronic keeper |
US11248396B2 (en) | 2017-07-24 | 2022-02-15 | Amesbury Group, Inc. | Sealed keeper sensors |
US10912204B2 (en) * | 2018-03-30 | 2021-02-02 | Samsung Electro-Mechanics Co., Ltd. | Electronic device and rigid-flexible substrate module |
CN111212520A (zh) * | 2018-11-22 | 2020-05-29 | 宁波舜宇光电信息有限公司 | 线路板、潜望式摄像模组及其应用 |
CN109831872A (zh) * | 2019-03-19 | 2019-05-31 | 北京遥感设备研究所 | 一种可侧向连接多层电路组合的刚柔电路板 |
CN113498248B (zh) * | 2020-04-03 | 2022-10-21 | 扬智科技股份有限公司 | 电路板组件及应用其的电子装置 |
KR20210154520A (ko) * | 2020-06-12 | 2021-12-21 | 엘지이노텍 주식회사 | 카메라 모듈 |
CN114222419A (zh) * | 2021-12-22 | 2022-03-22 | 维沃移动通信有限公司 | 电路板组件和电子设备 |
Family Cites Families (16)
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JPS6052084A (ja) * | 1983-08-31 | 1985-03-23 | 株式会社東芝 | 印刷配線基板 |
US5121297A (en) * | 1990-12-31 | 1992-06-09 | Compaq Computer Corporation | Flexible printed circuits |
US5144742A (en) * | 1991-02-27 | 1992-09-08 | Zycon Corporation | Method of making rigid-flex printed circuit boards |
JPH0575270A (ja) | 1991-09-11 | 1993-03-26 | Sony Chem Corp | 複合多層配線板の製造方法 |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
US5499444A (en) * | 1994-08-02 | 1996-03-19 | Coesen, Inc. | Method of manufacturing a rigid flex printed circuit board |
JPH08136990A (ja) | 1994-11-02 | 1996-05-31 | Nikon Corp | カメラの回路実装構造 |
JPH11289141A (ja) | 1998-04-02 | 1999-10-19 | Toshiba Corp | 回路基板及びその製造方法 |
US6099745A (en) * | 1998-06-05 | 2000-08-08 | Parlex Corporation | Rigid/flex printed circuit board and manufacturing method therefor |
EP1085788A3 (en) * | 1999-09-14 | 2003-01-02 | Seiko Epson Corporation | Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment |
JP2004031682A (ja) | 2002-06-26 | 2004-01-29 | Sony Corp | プリント配線基板の製造方法 |
US7371970B2 (en) * | 2002-12-06 | 2008-05-13 | Flammer Jeffrey D | Rigid-flex circuit board system |
US20060180344A1 (en) * | 2003-01-20 | 2006-08-17 | Shoji Ito | Multilayer printed wiring board and process for producing the same |
US20070013041A1 (en) * | 2003-06-02 | 2007-01-18 | Satoru Ishigaki | Flexible wiring board and flex-rigid wiring board |
JP2005045150A (ja) * | 2003-07-25 | 2005-02-17 | Matsushita Electric Ind Co Ltd | 中間接続用配線基材および多層配線基板、ならびにこれらの製造方法 |
JP2006005040A (ja) * | 2004-06-16 | 2006-01-05 | Toshiba Corp | 配線基板、磁気ディスク装置、配線基板の製造方法 |
-
2005
- 2005-08-31 JP JP2005252888A patent/JP2007067244A/ja not_active Abandoned
-
2006
- 2006-08-24 US US11/508,939 patent/US7292448B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6100976B1 (ja) * | 2015-06-24 | 2017-03-22 | 株式会社メイコー | 立体配線基板、及び立体配線基板の製造方法 |
WO2024172410A1 (ko) * | 2023-02-14 | 2024-08-22 | 삼성전자 주식회사 | 연성 인쇄 회로 기판 및 이를 포함하는 전자 장치 |
Also Published As
Publication number | Publication date |
---|---|
US7292448B2 (en) | 2007-11-06 |
US20070081309A1 (en) | 2007-04-12 |
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