KR860001478A - 리이드 프레임과 이것을 사용한 전자장치 - Google Patents
리이드 프레임과 이것을 사용한 전자장치 Download PDFInfo
- Publication number
- KR860001478A KR860001478A KR1019850004405A KR850004405A KR860001478A KR 860001478 A KR860001478 A KR 860001478A KR 1019850004405 A KR1019850004405 A KR 1019850004405A KR 850004405 A KR850004405 A KR 850004405A KR 860001478 A KR860001478 A KR 860001478A
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- South Korea
- Prior art keywords
- lead
- tab
- lead portion
- leads
- dam
- Prior art date
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- 238000007789 sealing Methods 0.000 claims 3
- 230000007423 decrease Effects 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H01F7/06—Electromagnets; Actuators including electromagnets
- H01F7/08—Electromagnets; Actuators including electromagnets with armatures
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1 실시예를 도시한 리이드 프레임의 부분 확대 평면도.
제2도는, 리이드 프레임의 1예를 도시한 전체 평면도.
제6도는, 본 발명에 의한 리이드 프레임 사용한 수지 봉지 반도체 장치의 일부 절결 전체 사시도.
Claims (22)
- 칩을 지지하는 탭과, 탭의 주위에 배치되고, 또한 그 탭에 그 한끝이 근접하는 것과 같이 배치된 다수개의 리이드에 있어서, 상기 다수개의 리이드의 적어도 일부에 있어서의 상기 한끝은 탭으로 향해서 뻗는 제1리이드 부분과, 이 제1부분에 인접하고, 상기 탭에서 멀어지는 방향으로 굴곡해서 마련된 제2리이드 부분을 갖고 있는 것을 특징으로 하는 리이드 프레임.
- 특허청구의 범위 제1항에 있어서, 리이드에 있어서의 상기 제2리이드 부분은, 상기 칩에 있어서의 와이어 본딩 영역과 상기 제2의 리이드 부분과를 연결하는 직선상에, 그 중요부가 위치하는 것과 같이 굴곡해서 마련되여 있다.
- 특허청구의 범위 제1항에 있어서, 제2리이드 부분은, 그 평면 형상이 탭에서 멀어질수록 그 가로 폭이 축소하는 역대형 형상을 갖고 있다.
- 특허청구의 범위 제1항에 있어서, 제2리이드 부분은, 그 평면 형상이 탭에서 멀어질수록 그 가로 폭이 증가하는 역대형 형상을 갖고 있다.
- 특허청구의 범위 제1항에 있어서, 제1리이드 부분은, 쌍 갈래로 분기해서 마련되고, 상기 제2리이드 부분은, 그 분기한 각각에 연접하고, 또한 쌍갈래로 분기된 제1리이드 부분으로 둘러싸인 영역에 있어서, 탭에서 멀어지는 방향으로 되돌려져서 형성되여 있다.
- 특허청구의 범위 제1항에 있어서, 다수개의 리이드의 적어도 일부에 있어서의 한끝은, 탭으로 향한 제1의 리이드 부분과, 그 제1부분에 접속되고, 상기 제1부분이 대향하는 탭의 주벽과 평행인 방향으로 어떤 일정 거리만큼 끌어내어져서 형성된 제1부분과 제2부분과의 접속부로 된 제3의 리이드 부분과, 이 제3의 리이드 부분에 접속되고, 상기 탭에서 멀어지는 방향으로 뻗는 제2의 리이드 부분과를 갖고 있다.
- 특허청구의 범위 제1항에 있어서, 리이드 프레임은, 또, 상기 다수개의 리이드를 서로 연결하는 댐부분을 갖고, 상기 다수개의 리이드의 한끝은, 상기 댐부분과, 탭과의 사이에 위치하여 있고, 상기 댐 부분과 리이드와의 접속영역에서 상기 탭에 도달할 때까지의 거리가 적은, 그 리이드의 한끝은, 상기 제1리이드 부분과, 제2리이드 부분과를 가진 형상으로 되여 있다.
- 특허청구의 범위 제7항에 있어서, 댐부분과 리이드와의 접속영역에서 상기 탭에 도달할 때까지의 거리가 긴 그 리이드의 한끝은, 제2리이드 부분을 갖지 않은 형상으로 되여 있다.
- 특허청구의 범위 제1항에 있어서, 제1리이드 부분이 붙어 있는 부분에, 양측으로 돌출하는 돌기(突起)가 마련되여 있다.
- 리이드 프레임와, 칩을 지지하는 탭과, 탭의 주위에 배치되고, 또, 그 탭에 그 한쪽이 급접하는 것과 같이 배치된 다수개의 리이드와, 상기 탭 위에 고정된 칩과 상기 리이드와 칩을 전기적으로 접속하는 와이어와, 상기 리이드 프레임, 탭 및 와이어를 봉지하는 봉지체에 있어서, 상기, 다수개의 리이드의 적어도 일부에 있어서의 상기 한 쪽은, 탭으로 향해서 뻗는 제1리이드 부분과, 그 제1리이드 부분에 연접하고, 상기 탭에서 멀어지는 방향으로 굴곡해서 마련된 제2리이드 부분을 갖고있는 전자장치.
- 특허청구의 범위 제10항에 있어서, 상기 봉지체의 바깥벽에서 상기 탭에 도달할 때까지의 거리가 적은 부분에 위치하는 상기 리이드의 한끝은, 상기 제2리이드 부분을 가진 형상으로 되여 있다.
- 특허청구의 범위 제10항에 있어서, 상기 와이어는, 칩에 마련된 와이어 본딩 영역과, 상기 제2리이드 부분과를 전기적으로 접속하고, 상기 제2리이드 부분에 있어서의 와이어 접속점은, 상기 제2리이드 부분에 있어서의 종단(終端) 부근에 위치하고 있다.
- 특허청구의 범위 제10항에 있어서, 봉지체는, 수지로 된다.
- 특허청구의 범위 제10항에 있어서, 봉지체는 기밀봉지 구조를 갖는다.
- 특허청구의 범위 제10항에 있어서, 리이드에 있어서의 상기 제2리이드 부분은, 상기 칩에 있어서의 와이어 본딩 영역과 상기 제2리이드 부분과를 연결하는 직선상으로, 그 주요부가 위치하는 것과 같이 굴곡해서 마련되어 있다.
- 특허청구의 범위 제10항에 있어서, 제2리이드 부분은 그 평면형상이 탭에서 멀어질수록 그 가로폭이 축소하는 역대형 형상을 갖고 있다.
- 특허청구의 범위 제10항에 있어서, 제2리이드 부분은 그 평면형상이 탭에서 멀어질수록 그 가로폭이 증가하는 역대형 형상을 갖고 있다.
- 특허청구의 범위 제10항에 있어서, 제1리이드 부분은, 쌍 갈래로 분기해서 마련되고, 상기 제2리이드 부분은, 그 분기한 각각에 일체로 접속되고, 또한 쌍 갈래로 분기된 제1리이드 부분에 끼워져 있는 영역에 있어서, 탭에 멀어지는 방향으로 되돌려져 형성되여 있다.
- 특허청구의 범위 제10항에 있어서, 다수개의 리이드의 적어도 일부에 있어서의 한 끝은, 탭으로 향한 제1리이드 부분과, 그 제1부분에 접속되고, 상기 제1부분에 대향하는 탭의 주벽(周壁)과 평행인 방향으로 어떤 일정 거리만큼 끌어내어서 형성된 제1부분과 제2부분과의 접속부로 된 제3의 리이드 부분과 이 제3의 리이드 부분에 접속되고, 상기 탭에서 멀어지는 방향으로 뻗는 제2의 리이드 부분과를 갖고 있다.
- 특허청구의 범위 제10항에 있어서, 리이드 프레임은, 또, 상기 다수개의 리이드를 서로 연결하는 댐 부분을 갖고, 상기 다수개의 리이드의 한 끝은, 상기 댐부분과 탭과의 사이에 위치하고 있고, 상기 댐부분과 리이드와의 접속영역에서 상기 탭에 달할 때까지의 거리가 적은 그 리이드의 한 끝은, 상기 제1리이드 부분과 제2리이드 부분과를 가진 형상으로 되여 있다.
- 특허청구의 범위 제20항에 있어서, 댐 부분과 리이드와의 접속영역에서 상기 탭에 도달할 때까지의 거리가 긴 그 리이드의 한끝은, 제2리이드부분을 갖지 않는 형상으로 되여 있다.
- 특허청구의 범위 제10항에 있어서, 제1리이드 부분이 붙어 있는 부분에 양측으로 돌출하는 돌기가 마련되여 있다.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59-152884 | 1984-07-25 | ||
JP84-152884 | 1984-07-25 | ||
JP15288484A JPS6132452A (ja) | 1984-07-25 | 1984-07-25 | リ−ドフレ−ムとそれを用いた電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860001478A true KR860001478A (ko) | 1986-02-26 |
KR930011455B1 KR930011455B1 (ko) | 1993-12-08 |
Family
ID=15550224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019850004405A KR930011455B1 (ko) | 1984-07-25 | 1985-06-21 | 리이드 프레임과 이것을 사용한 전자장치 |
Country Status (8)
Country | Link |
---|---|
US (3) | US4797787A (ko) |
EP (1) | EP0173847B1 (ko) |
JP (1) | JPS6132452A (ko) |
KR (1) | KR930011455B1 (ko) |
DE (1) | DE3575239D1 (ko) |
HK (1) | HK107291A (ko) |
MY (1) | MY101858A (ko) |
SG (1) | SG97491G (ko) |
Families Citing this family (19)
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JPS6132452A (ja) * | 1984-07-25 | 1986-02-15 | Hitachi Ltd | リ−ドフレ−ムとそれを用いた電子装置 |
US4743956A (en) * | 1986-12-15 | 1988-05-10 | Thomson Components-Moster Corporation | Offset bending of curvaceously planar radiating leadframe leads in semiconductor chip packaging |
US5592130A (en) * | 1987-02-27 | 1997-01-07 | Seiko Epson Corporation | Piezoelectric oscillator including a piezoelectric resonator with outer lead |
JP2522524B2 (ja) * | 1988-08-06 | 1996-08-07 | 株式会社東芝 | 半導体装置の製造方法 |
US5255156A (en) * | 1989-02-22 | 1993-10-19 | The Boeing Company | Bonding pad interconnection on a multiple chip module having minimum channel width |
JP2515406B2 (ja) * | 1989-09-05 | 1996-07-10 | 株式会社東芝 | 樹脂封止型半導体装置 |
US5012213A (en) * | 1989-12-19 | 1991-04-30 | Motorola, Inc. | Providing a PGA package with a low reflection line |
US5233133A (en) * | 1990-07-25 | 1993-08-03 | Hitachi Chemical Company Ltd. | Coaxial conductor interconnection wiring board |
JP2741281B2 (ja) * | 1990-08-08 | 1998-04-15 | ローム株式会社 | リードフレームおよびこれを使用して製造された半導体装置 |
JP2745933B2 (ja) * | 1992-02-17 | 1998-04-28 | 日本電気株式会社 | Tab−集積回路 |
US5970607A (en) * | 1993-09-30 | 1999-10-26 | Illinois Tool Works Inc. | Method of making an electrical subassembly |
JP2820645B2 (ja) * | 1994-08-30 | 1998-11-05 | アナム インダストリアル カンパニー インコーポレーティド | 半導体リードフレーム |
KR0156622B1 (ko) * | 1995-04-27 | 1998-10-15 | 문정환 | 반도체 패키지,리드프레임 및 제조방법 |
US5781682A (en) * | 1996-02-01 | 1998-07-14 | International Business Machines Corporation | Low-cost packaging for parallel optical computer link |
SG157957A1 (en) * | 2003-01-29 | 2010-01-29 | Interplex Qlp Inc | Package for integrated circuit die |
JP2009141080A (ja) * | 2007-12-05 | 2009-06-25 | Toshiba Corp | リードフレームおよび半導体装置 |
JP2009200253A (ja) * | 2008-02-21 | 2009-09-03 | Powertech Technology Inc | 半導体装置 |
US20110012240A1 (en) * | 2009-07-15 | 2011-01-20 | Chenglin Liu | Multi-Connect Lead |
US9978669B2 (en) * | 2016-06-30 | 2018-05-22 | Nxp Usa, Inc. | Packaged semiconductor device having a lead frame and inner and outer leads and method for forming |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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GB1288983A (ko) * | 1968-11-06 | 1972-09-13 | ||
BE757101A (fr) * | 1969-10-06 | 1971-03-16 | Grisby Barton Inc | Assemblage de relais |
NL7018378A (ko) * | 1970-12-17 | 1972-06-20 | ||
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US3793474A (en) * | 1971-12-09 | 1974-02-19 | Motorola Inc | Lead configurations for plastic encapsulated semiconductor devices |
JPS5132264A (ko) * | 1974-09-13 | 1976-03-18 | Hitachi Ltd | |
JPS55120152A (en) * | 1979-03-09 | 1980-09-16 | Fujitsu Ltd | Semiconductor device |
US4303934A (en) * | 1979-08-30 | 1981-12-01 | Burr-Brown Research Corp. | Molded lead frame dual in line package including a hybrid circuit |
US4514750A (en) * | 1982-01-11 | 1985-04-30 | Texas Instruments Incorporated | Integrated circuit package having interconnected leads adjacent the package ends |
EP0102988B1 (en) * | 1982-03-08 | 1988-09-21 | Motorola, Inc. | Integrated circuit lead frame |
EP0090503A3 (en) * | 1982-03-25 | 1985-05-22 | Texas Instruments Incorporated | Apparatus and method of packaging a semiconductor device |
US4600971A (en) * | 1984-05-11 | 1986-07-15 | Amp Incorporated | Lead frames with dielectric housings molded thereon |
JPS6132452A (ja) * | 1984-07-25 | 1986-02-15 | Hitachi Ltd | リ−ドフレ−ムとそれを用いた電子装置 |
-
1984
- 1984-07-25 JP JP15288484A patent/JPS6132452A/ja active Pending
-
1985
- 1985-06-21 KR KR1019850004405A patent/KR930011455B1/ko not_active IP Right Cessation
- 1985-07-23 US US06/758,030 patent/US4797787A/en not_active Expired - Lifetime
- 1985-07-24 DE DE8585109305T patent/DE3575239D1/de not_active Expired - Lifetime
- 1985-07-24 EP EP85109305A patent/EP0173847B1/en not_active Expired - Lifetime
-
1987
- 1987-09-23 MY MYPI87001900A patent/MY101858A/en unknown
-
1988
- 1988-12-20 US US07/286,849 patent/US4907129A/en not_active Expired - Lifetime
-
1990
- 1990-01-25 US US07/470,792 patent/US5121300A/en not_active Expired - Lifetime
-
1991
- 1991-11-20 SG SG974/91A patent/SG97491G/en unknown
- 1991-12-23 HK HK1072/91A patent/HK107291A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3575239D1 (de) | 1990-02-08 |
KR930011455B1 (ko) | 1993-12-08 |
US4797787A (en) | 1989-01-10 |
JPS6132452A (ja) | 1986-02-15 |
HK107291A (en) | 1992-01-03 |
US5121300A (en) | 1992-06-09 |
US4907129A (en) | 1990-03-06 |
EP0173847B1 (en) | 1990-01-03 |
EP0173847A1 (en) | 1986-03-12 |
SG97491G (en) | 1992-01-17 |
MY101858A (en) | 1992-01-31 |
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