KR930009036A - 반전형 IC의 제조방법 및 그것을 사용한 IC모듈(module) - Google Patents

반전형 IC의 제조방법 및 그것을 사용한 IC모듈(module) Download PDF

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Publication number
KR930009036A
KR930009036A KR1019920018980A KR920018980A KR930009036A KR 930009036 A KR930009036 A KR 930009036A KR 1019920018980 A KR1019920018980 A KR 1019920018980A KR 920018980 A KR920018980 A KR 920018980A KR 930009036 A KR930009036 A KR 930009036A
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South Korea
Prior art keywords
lead
semiconductor chip
wires
electrode pad
groups
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KR1019920018980A
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English (en)
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KR960002498B1 (ko
Inventor
가쥬나리 미찌이
히로시 세끼
Original Assignee
시기 모리야
미쓰비시 뎅끼 가부시끼가이샤
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Publication of KR930009036A publication Critical patent/KR930009036A/ko
Application granted granted Critical
Publication of KR960002498B1 publication Critical patent/KR960002498B1/ko

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Abstract

이 발명은 간단한 배선으로 고밀도실장이 가능하고 또한 신뢰의 수수한 반전형 IC를 얻는 것을 목적으로 한다. 반도체칩(21)의 제1의 전극패드군(22a)와 제2의 리드군(34b)와를 와이어(33)에 의해 접속하고 반도체칩(21)의 제2의 전극패드군(22b)와 제1의 리드군(34a)와를 와이어(33)에 의하여 접속하고 각 리드의 아우터 리드부(35)가 노출하도록 반도체칩(21), 제1 및 제2의 리드군(34a) 및 (34b) 및 와이어(33)을 패키지 본체(27)에 의하여 수지 봉지하여 각 리드의 아우터 리드부(35)를 반도체칩(21)의 리면(21b)방향으로 접어 구부린다.

Description

반전형 IC의 제조방법 및 그것을 사용한 IC 모듈(module)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 이 발명의 제1실시예에 관련된 IC 모듈을 표시하는 단면도
제2도는 이 발명의 제1실시예에 관련된 표준형 IC를 표시하는 투시 평면도
제3도는 제2도의 A-A 선 화살로본 단면도

Claims (3)

  1. 반도체칩의 표면상에 형성된 제1 및 제2의 전극패드군과 제1 및 제2의 리드군은 각각 와이어(wire)에 의해 접속됨과 동시에 각 리드(lead)의 아우터 리드(outer lead)부가 각각 반도체칩의 리면방향에 접어 구부러진 표준형의 IC와 동일한 반도체칩을 사용하여 핀접속이 반전된 반전형의 IC를 제조하는 방법이고, 반도체칩의 제1의 전극패드군과 제2의 리드군과를 와이어에 의해 접속하고, 반도체칩의 제2의 전극패드군과 제1의 리드군과를 와이어에 의해 접속하고, 각 리드의 아우터 리드부가 노출하도록 반도체칩, 제1 및 제2의 리드군 및 와이어를 수지봉지하고, 각 리드의 아우터 리드부를 반도체칩의 리면방향에 접어 구부리는 것을 특징으로 하는 반전형 IC의 제조방법.
  2. 실장기판과, 상기 실장기판의 표면상에 탑재되어 또한 반도체칩의 표면상에 형성된 제1 및 제2의 전극패드군과 제1 및 제2의 리드군은 각각 와이어에 의해 접속됨과 동시에 각 리드의 아우터 리드부가 각각 반도체칩의 리면방향에 접어 구부러진 표준형의 IC와, 상기 표준형이 IC와 동일기능을 소유한 리드끼리가 상기 실장기판을 끼어서 겹치도록 상기 실장기판의 리면상에 탑재되어 또한 반도체칩의 표면상에 형성된 제1 및 제2의 전극래드(pad)군과 제2 및 제1의 리드군은 각각 와이어에 의해 접속됨과 동시에 각 리드의 아우터 리드부가 각각 반도체칩의 리면방향에 접어 구부러진 반전형의 IC와, 상기 실장기판에 마련됨과 동시에 상기 표준형의 IC와 상기 반전형의 IC의 동일기능을 소유한 리드끼리를 전기적으로 접속하는 복수의 접속부재와를 구비한 것을 특징으로 하는 IC모듈.
  3. 실장기판과, 상기 실장기판의 표면상에 탑재되어 또한 반도체칩의 표면상에 형성된 제1 및 제2의 전극패드군과 제1 및 제2의 리드군은 각각 와이어에 의해 접속됨과 동시에 각 리드의 아우터 리드부가 각각 반도체칩의 리면방향에 접어 구부러진 표준형의 IC와, 상기 표준형이 IC와 동일기능을 소유한 리드끼리가 인접하여 전기적으로 접속되도록 상기 실장기판의 표면상에 탑재되어 또한 반도체칩의 표면상에 형성된 제1 및 제2의 전극패드군과 제2 및 제1의 리드군과의 각각 와이어에 의하여 접속됨과 동시에 각 리드의 아우터 리드부가 각각 반도체칩의 리면방향에 접어 구부러진 반전형의 IC와, 를 구비한 것을 특징으로 하는 IC모듈.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920018980A 1991-10-15 1992-10-15 반전형 IC의 제조방법 및 그것을 사용한 IC모듈(module) KR960002498B1 (ko)

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JPH05109979A (ja) 1993-04-30
USRE36077E (en) 1999-02-02
EP0538003A1 (en) 1993-04-21
DE69223906T2 (de) 1998-08-27
US5303120A (en) 1994-04-12
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SG52264A1 (en) 1998-09-28
DE69223906D1 (de) 1998-02-12

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