KR960026505A - 반도체 장치 및 그 제조방법 - Google Patents
반도체 장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR960026505A KR960026505A KR1019950044247A KR19950044247A KR960026505A KR 960026505 A KR960026505 A KR 960026505A KR 1019950044247 A KR1019950044247 A KR 1019950044247A KR 19950044247 A KR19950044247 A KR 19950044247A KR 960026505 A KR960026505 A KR 960026505A
- Authority
- KR
- South Korea
- Prior art keywords
- main surface
- semiconductor
- pellet
- base substrate
- semiconductor device
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract 27
- 238000004519 manufacturing process Methods 0.000 title claims 4
- 239000000758 substrate Substances 0.000 claims abstract 22
- 239000008188 pellet Substances 0.000 claims abstract 21
- 238000005538 encapsulation Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Classifications
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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Abstract
베이스 기판의 주면 펠레트 탑재 영역상에 반도체 펠레트가 탑재되고, 상기 반도체 펠레트의 주면에 배치된 외부단자에 베이스 기판의 이면에 배치된 제1전극 패드가 전기적으로 접속되는 반도체 장치에 있어서, 상기 베이스 기판은 리지드 기판으로 구성하고, 상기 베이스 기판의 제1전극패드를 그의 이면에 배치된 제2전극패턴에 전기적으로 접속하며, 상기 반도체 펠레트를 그의 주면을 밑으로해서 베이스 기판의 주면 펠레트 탑재영역상에 탑재하고, 상기 반도체 펠레트의 외부단자와 베이스 기판의 제2전극패드를 베이스 기판에 형성된 슬리트를 통해서 본딩와이어로 전기적으로 접속한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 제1도에 나타낸 A-A선의 위치에서 절단한 단면도.
Claims (9)
- (a) 제1주면과, 상기 제1주면과 대향하는 제2주면을 가진 리지드 기판과, (b) 복수의 반도체 회로소자 및 복수의 외부단자를 가지고, 상기 리지드 기판의 상기 제1주면상에 탑재된 반도체 펠레트와, (c) 상기 리지드 기판의 상기 제2주면상에 형성된 복수의 전극패드 및, (d) 상기 반도체 펠레트의 복수의 외부단자와 상기 전극패드를 전기적으로 접속하는 복수의 본딩 와이어를 구비하고, 상기 반도체 펠레트는, 상기 리지드 기판상 에서 페이스 다운으로 탑재되고, 상기 리지드 기판은, 상기 제1주면에서 상기 제2주면으로 연장하고, 상기 반도체 펠레트의 복수의 외부단자를 노출하는 슬리트를 가지며, 상기 복수의 본딩와이어는, 상기 리지드 기판의 상기 슬리트를 통하여 상기 복수의 외부단자와 상기 복수의 전극패드를 접속하는 반도체 장치.
- 제1항에 있어서, 상기 복수의 외부단자는, 상기 반도체 펠레트의 주변에 배치되고, 상기 슬리트는, 상기 외부단자의 배열방향을 따라 형성되는 것을 특징으로 하는 반도체 장치.
- 제2항에 있어서, 상기 복수의 전극패드는, 상기 슬리트의 양측에 위치하는 것을 특징으로 하는 반도체 장치.
- 제3항에 있어서, 상기 슬리트의 일측에 위치하고, 또 상기 반도체 펠레트의 하부측에 위치하는 상기 전극 패드는, 전원패드이고, 상기 슬리트의 타측에 위치하고, 또 상기 반도체 펠레트의 외측에 위치 전극패드는, 신호패드인 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 상기 반도체 펠레트를 덮는 제1수지봉지체를 더 구비하는 것을 특징으로 하는 반도체 장치.
- 제5항에 있어서, 상기 슬리트내에 형성되고, 또 상기 본딩와이어를 덮는 제2수지봉지체를 더 구비하는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 상기 범프전극은 상기 전극패드상에 형성되어 있는 것을 특징으로 하는 반도체 장치.
- 베이스 기판의 주면 펠레트 탑재영역상에 반도체 펠레트가 탑재되고, 상기 반도체 펠레트의 주면에 배치된 외부단자에 상기 베이스 기판의 이면에 배치된 제1전극패드가 전기적으로 접속되는 반도체 장치의 제조방법에 있어서, 리지드 기판으로 구성된 베이스 기판의 주면 펠레트 탑재영역상에 상기 반도체 펠레트의 주면을 밑으로해서 상기 반도체 펠레트를 탑재하는 공정과, 상기 반도체 펠레트의 외부단자와 상기 베이스 기판의 제1전극패드에 전기적으로 접속되고, 또 상기 베이스 기판의 이면에 배치된 제2전극패드를 상기 베이스 기판상에 형성된 슬리트를 통하여 본딩와이어로 전기적으로 접속하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 제조방법.
- 제8항에 있어서, 상기 본딩와이어로 전기적으로 접속하는 상기 공정뒤에, 상기 베이스 기판의 주면 주변 영역을 덮고, 또 상기 본딩와이어를 봉지하는 수지봉지체를 트랜스퍼 모울드법으로 형성하는 공정을 더 구비하는 것을 특징으로 하는 반도체 장치의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
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JP12640595A JP3487524B2 (ja) | 1994-12-20 | 1995-05-25 | 半導体装置及びその製造方法 |
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-
1995
- 1995-05-25 JP JP12640595A patent/JP3487524B2/ja not_active Expired - Lifetime
- 1995-11-28 KR KR1019950044247A patent/KR100365586B1/ko not_active IP Right Cessation
- 1995-12-11 US US08/570,646 patent/US5777391A/en not_active Ceased
-
2000
- 2000-07-07 US US09/613,541 patent/USRE41721E1/en not_active Expired - Lifetime
-
2002
- 2002-03-26 US US10/105,236 patent/USRE41722E1/en not_active Expired - Lifetime
-
2005
- 2005-07-15 US US11/182,039 patent/USRE42972E1/en not_active Expired - Lifetime
- 2005-07-15 US US11/182,040 patent/USRE41478E1/en not_active Expired - Lifetime
- 2005-11-23 US US11/285,730 patent/USRE43444E1/en not_active Expired - Lifetime
-
2010
- 2010-07-30 US US12/805,447 patent/USRE44148E1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
USRE41722E1 (en) | 2010-09-21 |
USRE43444E1 (en) | 2012-06-05 |
JPH08227908A (ja) | 1996-09-03 |
USRE41478E1 (en) | 2010-08-10 |
USRE42972E1 (en) | 2011-11-29 |
USRE44148E1 (en) | 2013-04-16 |
KR100365586B1 (ko) | 2003-03-15 |
USRE41721E1 (en) | 2010-09-21 |
JP3487524B2 (ja) | 2004-01-19 |
US5777391A (en) | 1998-07-07 |
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