KR870004509A - 리드 프레임 및 이를 사용한 반도체 장치 - Google Patents
리드 프레임 및 이를 사용한 반도체 장치 Download PDFInfo
- Publication number
- KR870004509A KR870004509A KR1019860007396A KR860007396A KR870004509A KR 870004509 A KR870004509 A KR 870004509A KR 1019860007396 A KR1019860007396 A KR 1019860007396A KR 860007396 A KR860007396 A KR 860007396A KR 870004509 A KR870004509 A KR 870004509A
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- South Korea
- Prior art keywords
- lead
- tab
- width
- inner lead
- adjacent
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- 239000004065 semiconductor Substances 0.000 title claims 16
- 241000282341 Mustela putorius furo Species 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 241000282339 Mustela Species 0.000 claims 2
- XMNVMZIXNKZAJB-UHFFFAOYSA-N iron(3+);lead(2+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Fe+3].[Fe+3].[Pb+2].[Pb+2] XMNVMZIXNKZAJB-UHFFFAOYSA-N 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Classifications
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
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- H01L23/495—Lead-frames or other flat leads
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는, 본 발명의 실시예 1인 리드 프레임에 페렛 와이어 본딩이 실시된 것을 도시한 확대부분 평면도.
제2도는, 실시예 1의 리드 프레임의 전체를 도시한 평면도.
제6도는, 본 발명의 실시예 2인 리드 프레임에 페렛 본딩 와이어 본딩이 실시된 것을 도시한 확대부분 평면도.
Claims (32)
- 틀부에서 연설된 탭 걸이 리드에 의해서, 지지된 페렛 장착용의 탭과, 상기 틀부에서 탭의 근방으로 연설된 여러개의 리드를 가진 리드 프레임으로서, 상기 탭 걸이 리드에 가까이 마련된 리드에 있어서의 내부 리드가 다른 리드에 있어서의 내부 리드보다도 적어도, 그 내부 리드의 선단의 폭이 커지도록 형성되어 있는 것을 특징으로 하는 리드 프레임.
- 상기 탭 길이 리드에 가까이 마련된 내부 리드의 각 개소의 폭이, 다른 내부 리드의 폭보다도 큰 것을 특징으로 하는 특허 청구 범위 제1항 기재의 리드 프레임.
- 상기 탭 걸이 리드에 가까이 마련된 내부 리드가 다른 내부 리드 보다도, 더욱 탭에 근접하는 위치까지 연설되어 있는 것을 특징으로 하는 특허청구의 범위 제1항 기재의 리드 프레임.
- 특허 청구의 범위 제1항에 있어서,리드 프레임은 FPP(Flat Plastic Package)형 반도체 장치에 사용되는 것이다.
- 특허 청구의 범위 제1항에 있어서,리드 프레임 PLCC(Plastic Leaded Chip Carrier)형 반도체 장치에 사용되는 것이다.
- 내부가 중공(中空)인 4각 형상이 틀부와 4각형상의 탭과, 상기 탭의 모서리와, 틀부를 연결하여 되는 적어도 1 줄 이상의 탭 걸이 리드와, 틀부의 각변에서 탭의 각변으로 향해서, 연설되어 있는 여러줄의 리드와, 상기 탭 걸이 리드 및 여러줄의 리드를 번갈아서 연결하고 있는 타이 바로 되는 리드 프레임에 있어서, 상기 탭 걸이 리드에 인접된 리드에 있어서의 내부 리드가 다른 리드에 있어서의 내부 리드 보다는 적어도 그 내부 리드의 선단의 리드 폭이 크게되도록 형성되어 있는 것을 특징으로 하는 리드 프레임.
- 특허 청구의 범위 제6항에 있어서, 상기 탭걸이 리드에 인접하여 마련된 내부리드의 각 개소의 리드 폭이 다른 내부 리드의 리드폭 보다도 크다.
- 특허 청구의 범위 제6항에 있어서, 상기 탭 걸이 리드에 인접된 내부 리드의 각 개소의 리드 폭이 다른 내부 리드의 리드 폭 보다도 크며, 또한 상기 탭걸이 리드에 인접된 내부 리드와 탭과의 이간거리가 상기 내부 리드에 인접하는 다른 내부리드와 탭과의 이간거리보다도 동일하든가, 그 이하의 길이이다.
- 특허 청구의 범위 제6항에 있어서,상기 탭 걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드 폭 보다도 크다.
- 특허 청구의 범위 제6항에 있어서,상기 탭 걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드 폭보다도 크고, 또한 상기 탭 걸이 리드에 인접된 내부 리드와 탭과의 이간거리가 상기 내부 리드에 인접하는 다른 내부 리드와 탭과의 이간 거리 보다도 동일하든가, 그 이하의 길이이다.
- 특허 청구의 범위 제6항에 있어서,리드 프레임은 FPP(Flat Plastic Package)형 반도체 장치에 사용되는 것이다.
- 특허 청구의 범위 제6항에 있어서,리드 페리임은, PLCC(Plastic Leaded Chip Carrier)형 반도체 장치에 사용되는 것이다.
- 내부가 중공인 4각형상의틀부와, 4각형상의 탭과,상기 탭의 모서리와 틀부를 연결하여 되는 적어도 1줄 이상의 탭 걸이 리드와, 틀부의 각변에서 탭의 각변으로 향해서 연결되어 있는 여러 줄의 리드와,상기 탭 걸이 리드 및 여러줄의 리드를 번갈아서 연결하고 있는 타이 바로되는 리드 프레임에 있어서,상기 탭 걸이 리드에 인접된 내부 리드와 탭과의 이간거리가, 상기 내부 리드에 인접하는 다른 내부 리드와 탭과의 이간거리보다 동일하든가, 그 이하의 길이인 것을 특징으로 하는 리드 프레임.
- 특허 청구의 범위 제13항에 있어서상기 탭 걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드 폭보다도 크다.
- 특허 청구의 범위 제13항에 있어서,리드 프레임은 FPP형 반도체 장치에 사용되는 것이다.
- 특허 청구의 범위 제13항에 있어서,리드 프레임은 PLCC형 반도체 장치에 사용되는 것이다.
- 탭 걸이 리드를 구비한 탭에 장착된 반도체 페렛에 있어서의 본딩 전극과, 상기 탭의 근방까지 연설된 내부 리드와 와이어의 장설에 의해 전기적으로 접속된 상태로 봉지되어, 팩케이지가 형성되는 반도체 장치로서, 상기 탭 걸이 리드에 가까이 마련된 내부 리드가 다른 내부 리드 보다도 적어도 그 선단의 폭이 커지도록 형성되어 있는 것을 특징으로 하는 반도체 장치.
- 상기 탭 걸이 리드에 가까이 마련된 내부 리드의 리드폭이 다른 내부 리드의 리드폭 보다도 큰 것을 특징으로 하는 특허청구의 범위 제17항의 반도체 장치.
- 상기 탭 걸이 리드에 가까이 마련된 내부 리드가 다른 내부 리드 보다도 더욱 탭에 근접하는 위치까지 연설되어 있는 것을 특징으로 하는 특허청구의 범위 제17항의 반도체 장치.
- 특허 청구의 범위 제17항에 있어서, 팩케이지는 수지 봉지된 것이다.
- 특허 청구의 범위 제17항에 있어서, 팩케이지는 기밀 봉지된 것이다.
- 제4각 형상의 탭과, 탭에 장착된 페렛과, 4각 형상의 탭의 각변의 근방까지 연설된 여러 줄의 내부 리드와, 페렛에 있어서의 여러 개의 본딩 전극과 이에 대응하는 내부 리드가 와이어 본딩되어서 전기적 도통이 이루어지는 본딩 와이어와, 상기 페렛, 본딩 와이어, 내부 리드가 적어도 봉지되어서 된 팩케이지를 가진 반도체 장치에 있어서,4각 형상의 탭의 모서리에서 바깥쪽으로 연설되어 있는 적어도 1줄 이상의 탭 걸이 리드에 인접된 내부 리드가 다른 내부 리드보다도 적어도, 그 내부 리드의 선단의 리드 폭이 크게 되도록 형성되어 있는 것을 특징으로 하는 반도체 장치.
- 특허 청구의 범위 제22항에 있어서,상기 탭 걸이 리드에 인접해서 마련된 내부 리드의 각 개소의 리드 폭이 다른 내부 리드의 리드 폭보다도 크다.
- 특허 청구의 범위 제22항에 있어서,상기 탭 걸이 리드에 인접된 리드의 각 개소의 리드 폭이 다른 내부 리드의 리드폭 보다도 크고, 또한 상기 탭 걸이 리드에 인접된 내부 리드와 탭과의 이간 거리가 상기 내부 리드에 인접하는 다른 내부 리드와 탭과의 이간거리보다도 동일하든가 그 이하의 길이이다.
- 특허 청구의 범위 제22항에 있어서,상기 탭걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드폭 보다도 크다.
- 특허 청구의 범위 제22항에 있어서,상기 탭걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드폭 보다도 크며, 또한 상기 탭걸이 리드에 인접된 내부 리드와 탭과의 이간거리가 상기 내부 리드에 인접하는 다른 내부 리드와 탭과의 이간거리보다도 동일하든가, 그 이하의 길이이다.
- 특허 청구의 범위 제22항에 있어서, 팩케이지는 수지봉지된 것이다.
- 특허 청구의 범위 제22항에 있어서, 팩케이지는 기밀봉지된 것이다.
- 제4각 형상의 탭과, 탭에 장착된 페렛과, 4각 형상의 탭의 각변의 근방까지 연설된 여러 줄의 내부 리드와, 페렛에 있어서의 여러개의 본딩 전극과, 이에 대응하는 내부 리드가 와이어 본딩되어서 전기적 도통이 되어있는 본딩 아이어와, 상기 페렛, 본딩 와이어, 내부 리드가 적어도 봉지되어서는 팩케이지를 가진 반도체 장치에 있어서, 4각형상의 탭의 모서리에서 바깥쪽에 연설되어 있는 적어도 1줄 이상의 탭 걸이 리드에 인접된 내부 리드와 탭과의 이간거리가 상기 내부 리드에 인접하는 다른 내부 리드와 탭과의 이간거리보다도 동일하든가, 그 이하의 길이인 것을 특징으로 하는 반도체 장치.
- 특허 청구의 범위 제29항에 있어서,상기 탭 걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드 폭 보다도 크다.
- 특허 청구의 범위 제29항에 있어서,팩케이지는 수지봉지된 것이다.
- 특허 청구의 범위 제29항에 있어서,케이지는 기밀봉지된 것이다.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60221832A JPS6281738A (ja) | 1985-10-07 | 1985-10-07 | リ−ドフレ−ムおよびそれを用いた半導体装置 |
JP60-221832 | 1985-10-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR870004509A true KR870004509A (ko) | 1987-05-11 |
KR950000205B1 KR950000205B1 (ko) | 1995-01-11 |
Family
ID=16772889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860007396A KR950000205B1 (ko) | 1985-10-07 | 1986-09-04 | 리이드 프레임 및 이를 사용한 반도체 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4951120A (ko) |
JP (1) | JPS6281738A (ko) |
KR (1) | KR950000205B1 (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6281738A (ja) * | 1985-10-07 | 1987-04-15 | Hitachi Micro Comput Eng Ltd | リ−ドフレ−ムおよびそれを用いた半導体装置 |
AU627076B2 (en) * | 1990-03-13 | 1992-08-13 | Sumitomo Electric Industries, Ltd. | Optical module and process of producing the same |
US5053852A (en) * | 1990-07-05 | 1991-10-01 | At&T Bell Laboratories | Molded hybrid IC package and lead frame therefore |
US5061988A (en) * | 1990-07-30 | 1991-10-29 | Mcdonnell Douglas Corporation | Integrated circuit chip interconnect |
JPH04213867A (ja) * | 1990-11-27 | 1992-08-04 | Ibiden Co Ltd | 電子部品搭載用基板フレーム |
JPH05218233A (ja) * | 1992-02-06 | 1993-08-27 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP2714335B2 (ja) * | 1992-12-16 | 1998-02-16 | 株式会社東芝 | 半導体装置 |
US5322207A (en) * | 1993-05-03 | 1994-06-21 | Micron Semiconductor Inc. | Method and apparatus for wire bonding semiconductor dice to a leadframe |
US5350106A (en) * | 1993-05-07 | 1994-09-27 | Micron Semiconductor, Inc. | Semiconductor wire bonding method |
JP2542795B2 (ja) * | 1994-09-22 | 1996-10-09 | 九州日本電気株式会社 | 樹脂封止型半導体装置 |
US5781682A (en) * | 1996-02-01 | 1998-07-14 | International Business Machines Corporation | Low-cost packaging for parallel optical computer link |
US5611478A (en) * | 1996-03-11 | 1997-03-18 | National Semiconductor Corporation | Lead frame clamp for ultrasonic bonding |
JP3638750B2 (ja) * | 1997-03-25 | 2005-04-13 | 株式会社ルネサステクノロジ | 半導体装置 |
JP2000082717A (ja) * | 1998-09-07 | 2000-03-21 | Shinkawa Ltd | ワイヤボンディング方法 |
US6847099B1 (en) * | 2003-02-05 | 2005-01-25 | Amkor Technology Inc. | Offset etched corner leads for semiconductor package |
JP2006210862A (ja) * | 2004-12-27 | 2006-08-10 | Toshiba Corp | 半導体用リードフレーム、メモリカードおよび半導体装置 |
US7466516B2 (en) * | 2005-01-28 | 2008-12-16 | Hitachi Global Storage Technologies Netherlands B.V. | Lead configuration for reduced capacitive interference in a magnetic read/write head |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7018378A (ko) * | 1970-12-17 | 1972-06-20 | ||
JPS5431470B2 (ko) * | 1971-12-15 | 1979-10-06 | ||
JPS5431470U (ko) * | 1977-08-05 | 1979-03-01 | ||
JPS5521128A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame used for semiconductor device and its assembling |
JPS5648161A (en) * | 1979-09-26 | 1981-05-01 | Nec Kyushu Ltd | Lead frame for semiconductor device |
JPS5674948A (en) * | 1979-11-22 | 1981-06-20 | Hitachi Ltd | Lead structure of semiconductor device |
JPS56116654A (en) * | 1980-02-20 | 1981-09-12 | Nec Corp | Manufacturing of lead frame for semiconductor device |
JPS5758777U (ko) * | 1980-09-24 | 1982-04-07 | ||
JPS5861654A (ja) * | 1981-10-09 | 1983-04-12 | Toshiba Corp | 半導体装置 |
JPS58142554A (ja) * | 1982-02-19 | 1983-08-24 | Hitachi Ltd | リ−ドフレ−ム |
JPS61269345A (ja) * | 1985-05-24 | 1986-11-28 | Hitachi Ltd | 半導体装置 |
JP2559364B2 (ja) * | 1985-07-12 | 1996-12-04 | 株式会社日立製作所 | 半導体装置用リ−ドフレ−ム |
JPS6281738A (ja) * | 1985-10-07 | 1987-04-15 | Hitachi Micro Comput Eng Ltd | リ−ドフレ−ムおよびそれを用いた半導体装置 |
-
1985
- 1985-10-07 JP JP60221832A patent/JPS6281738A/ja active Granted
-
1986
- 1986-09-04 KR KR1019860007396A patent/KR950000205B1/ko not_active IP Right Cessation
-
1988
- 1988-12-13 US US07/283,842 patent/US4951120A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR950000205B1 (ko) | 1995-01-11 |
JPH0455341B2 (ko) | 1992-09-03 |
US4951120A (en) | 1990-08-21 |
JPS6281738A (ja) | 1987-04-15 |
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