KR870004509A - 리드 프레임 및 이를 사용한 반도체 장치 - Google Patents

리드 프레임 및 이를 사용한 반도체 장치 Download PDF

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KR870004509A
KR870004509A KR1019860007396A KR860007396A KR870004509A KR 870004509 A KR870004509 A KR 870004509A KR 1019860007396 A KR1019860007396 A KR 1019860007396A KR 860007396 A KR860007396 A KR 860007396A KR 870004509 A KR870004509 A KR 870004509A
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lead
tab
width
inner lead
adjacent
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KR1019860007396A
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KR950000205B1 (ko
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야스히사 하기와라
마사지가 마스다
Original Assignee
미쓰다 가쓰시게
가부시기가이샤 히다찌 세이사꾸쇼
가모시다 겐이찌
히다찌 마이크로 컴퓨터 엔지니어링 가부시기가이샤
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Publication of KR870004509A publication Critical patent/KR870004509A/ko
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Publication of KR950000205B1 publication Critical patent/KR950000205B1/ko

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    • HELECTRICITY
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports
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Abstract

내용 없음

Description

리드 프레임 및 이를 사용한 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는, 본 발명의 실시예 1인 리드 프레임에 페렛 와이어 본딩이 실시된 것을 도시한 확대부분 평면도.
제2도는, 실시예 1의 리드 프레임의 전체를 도시한 평면도.
제6도는, 본 발명의 실시예 2인 리드 프레임에 페렛 본딩 와이어 본딩이 실시된 것을 도시한 확대부분 평면도.

Claims (32)

  1. 틀부에서 연설된 탭 걸이 리드에 의해서, 지지된 페렛 장착용의 탭과, 상기 틀부에서 탭의 근방으로 연설된 여러개의 리드를 가진 리드 프레임으로서, 상기 탭 걸이 리드에 가까이 마련된 리드에 있어서의 내부 리드가 다른 리드에 있어서의 내부 리드보다도 적어도, 그 내부 리드의 선단의 폭이 커지도록 형성되어 있는 것을 특징으로 하는 리드 프레임.
  2. 상기 탭 길이 리드에 가까이 마련된 내부 리드의 각 개소의 폭이, 다른 내부 리드의 폭보다도 큰 것을 특징으로 하는 특허 청구 범위 제1항 기재의 리드 프레임.
  3. 상기 탭 걸이 리드에 가까이 마련된 내부 리드가 다른 내부 리드 보다도, 더욱 탭에 근접하는 위치까지 연설되어 있는 것을 특징으로 하는 특허청구의 범위 제1항 기재의 리드 프레임.
  4. 특허 청구의 범위 제1항에 있어서,
    리드 프레임은 FPP(Flat Plastic Package)형 반도체 장치에 사용되는 것이다.
  5. 특허 청구의 범위 제1항에 있어서,
    리드 프레임 PLCC(Plastic Leaded Chip Carrier)형 반도체 장치에 사용되는 것이다.
  6. 내부가 중공(中空)인 4각 형상이 틀부와 4각형상의 탭과, 상기 탭의 모서리와, 틀부를 연결하여 되는 적어도 1 줄 이상의 탭 걸이 리드와, 틀부의 각변에서 탭의 각변으로 향해서, 연설되어 있는 여러줄의 리드와, 상기 탭 걸이 리드 및 여러줄의 리드를 번갈아서 연결하고 있는 타이 바로 되는 리드 프레임에 있어서, 상기 탭 걸이 리드에 인접된 리드에 있어서의 내부 리드가 다른 리드에 있어서의 내부 리드 보다는 적어도 그 내부 리드의 선단의 리드 폭이 크게되도록 형성되어 있는 것을 특징으로 하는 리드 프레임.
  7. 특허 청구의 범위 제6항에 있어서, 상기 탭걸이 리드에 인접하여 마련된 내부리드의 각 개소의 리드 폭이 다른 내부 리드의 리드폭 보다도 크다.
  8. 특허 청구의 범위 제6항에 있어서, 상기 탭 걸이 리드에 인접된 내부 리드의 각 개소의 리드 폭이 다른 내부 리드의 리드 폭 보다도 크며, 또한 상기 탭걸이 리드에 인접된 내부 리드와 탭과의 이간거리가 상기 내부 리드에 인접하는 다른 내부리드와 탭과의 이간거리보다도 동일하든가, 그 이하의 길이이다.
  9. 특허 청구의 범위 제6항에 있어서,
    상기 탭 걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드 폭 보다도 크다.
  10. 특허 청구의 범위 제6항에 있어서,
    상기 탭 걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드 폭보다도 크고, 또한 상기 탭 걸이 리드에 인접된 내부 리드와 탭과의 이간거리가 상기 내부 리드에 인접하는 다른 내부 리드와 탭과의 이간 거리 보다도 동일하든가, 그 이하의 길이이다.
  11. 특허 청구의 범위 제6항에 있어서,
    리드 프레임은 FPP(Flat Plastic Package)형 반도체 장치에 사용되는 것이다.
  12. 특허 청구의 범위 제6항에 있어서,
    리드 페리임은, PLCC(Plastic Leaded Chip Carrier)형 반도체 장치에 사용되는 것이다.
  13. 내부가 중공인 4각형상의틀부와, 4각형상의 탭과,
    상기 탭의 모서리와 틀부를 연결하여 되는 적어도 1줄 이상의 탭 걸이 리드와, 틀부의 각변에서 탭의 각변으로 향해서 연결되어 있는 여러 줄의 리드와,
    상기 탭 걸이 리드 및 여러줄의 리드를 번갈아서 연결하고 있는 타이 바로되는 리드 프레임에 있어서,
    상기 탭 걸이 리드에 인접된 내부 리드와 탭과의 이간거리가, 상기 내부 리드에 인접하는 다른 내부 리드와 탭과의 이간거리보다 동일하든가, 그 이하의 길이인 것을 특징으로 하는 리드 프레임.
  14. 특허 청구의 범위 제13항에 있어서
    상기 탭 걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드 폭보다도 크다.
  15. 특허 청구의 범위 제13항에 있어서,
    리드 프레임은 FPP형 반도체 장치에 사용되는 것이다.
  16. 특허 청구의 범위 제13항에 있어서,
    리드 프레임은 PLCC형 반도체 장치에 사용되는 것이다.
  17. 탭 걸이 리드를 구비한 탭에 장착된 반도체 페렛에 있어서의 본딩 전극과, 상기 탭의 근방까지 연설된 내부 리드와 와이어의 장설에 의해 전기적으로 접속된 상태로 봉지되어, 팩케이지가 형성되는 반도체 장치로서, 상기 탭 걸이 리드에 가까이 마련된 내부 리드가 다른 내부 리드 보다도 적어도 그 선단의 폭이 커지도록 형성되어 있는 것을 특징으로 하는 반도체 장치.
  18. 상기 탭 걸이 리드에 가까이 마련된 내부 리드의 리드폭이 다른 내부 리드의 리드폭 보다도 큰 것을 특징으로 하는 특허청구의 범위 제17항의 반도체 장치.
  19. 상기 탭 걸이 리드에 가까이 마련된 내부 리드가 다른 내부 리드 보다도 더욱 탭에 근접하는 위치까지 연설되어 있는 것을 특징으로 하는 특허청구의 범위 제17항의 반도체 장치.
  20. 특허 청구의 범위 제17항에 있어서, 팩케이지는 수지 봉지된 것이다.
  21. 특허 청구의 범위 제17항에 있어서, 팩케이지는 기밀 봉지된 것이다.
  22. 제4각 형상의 탭과, 탭에 장착된 페렛과, 4각 형상의 탭의 각변의 근방까지 연설된 여러 줄의 내부 리드와, 페렛에 있어서의 여러 개의 본딩 전극과 이에 대응하는 내부 리드가 와이어 본딩되어서 전기적 도통이 이루어지는 본딩 와이어와, 상기 페렛, 본딩 와이어, 내부 리드가 적어도 봉지되어서 된 팩케이지를 가진 반도체 장치에 있어서,
    4각 형상의 탭의 모서리에서 바깥쪽으로 연설되어 있는 적어도 1줄 이상의 탭 걸이 리드에 인접된 내부 리드가 다른 내부 리드보다도 적어도, 그 내부 리드의 선단의 리드 폭이 크게 되도록 형성되어 있는 것을 특징으로 하는 반도체 장치.
  23. 특허 청구의 범위 제22항에 있어서,
    상기 탭 걸이 리드에 인접해서 마련된 내부 리드의 각 개소의 리드 폭이 다른 내부 리드의 리드 폭보다도 크다.
  24. 특허 청구의 범위 제22항에 있어서,
    상기 탭 걸이 리드에 인접된 리드의 각 개소의 리드 폭이 다른 내부 리드의 리드폭 보다도 크고, 또한 상기 탭 걸이 리드에 인접된 내부 리드와 탭과의 이간 거리가 상기 내부 리드에 인접하는 다른 내부 리드와 탭과의 이간거리보다도 동일하든가 그 이하의 길이이다.
  25. 특허 청구의 범위 제22항에 있어서,
    상기 탭걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드폭 보다도 크다.
  26. 특허 청구의 범위 제22항에 있어서,
    상기 탭걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드폭 보다도 크며, 또한 상기 탭걸이 리드에 인접된 내부 리드와 탭과의 이간거리가 상기 내부 리드에 인접하는 다른 내부 리드와 탭과의 이간거리보다도 동일하든가, 그 이하의 길이이다.
  27. 특허 청구의 범위 제22항에 있어서, 팩케이지는 수지봉지된 것이다.
  28. 특허 청구의 범위 제22항에 있어서, 팩케이지는 기밀봉지된 것이다.
  29. 제4각 형상의 탭과, 탭에 장착된 페렛과, 4각 형상의 탭의 각변의 근방까지 연설된 여러 줄의 내부 리드와, 페렛에 있어서의 여러개의 본딩 전극과, 이에 대응하는 내부 리드가 와이어 본딩되어서 전기적 도통이 되어있는 본딩 아이어와, 상기 페렛, 본딩 와이어, 내부 리드가 적어도 봉지되어서는 팩케이지를 가진 반도체 장치에 있어서, 4각형상의 탭의 모서리에서 바깥쪽에 연설되어 있는 적어도 1줄 이상의 탭 걸이 리드에 인접된 내부 리드와 탭과의 이간거리가 상기 내부 리드에 인접하는 다른 내부 리드와 탭과의 이간거리보다도 동일하든가, 그 이하의 길이인 것을 특징으로 하는 반도체 장치.
  30. 특허 청구의 범위 제29항에 있어서,
    상기 탭 걸이 리드에 인접된 내부 리드의 와이어 본딩 개소에서의 리드 폭이 다른 내부 리드의 와이어 본딩 개소에서의 리드 폭 보다도 크다.
  31. 특허 청구의 범위 제29항에 있어서,
    팩케이지는 수지봉지된 것이다.
  32. 특허 청구의 범위 제29항에 있어서,
    케이지는 기밀봉지된 것이다.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860007396A 1985-10-07 1986-09-04 리이드 프레임 및 이를 사용한 반도체 장치 KR950000205B1 (ko)

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JP60221832A JPS6281738A (ja) 1985-10-07 1985-10-07 リ−ドフレ−ムおよびそれを用いた半導体装置
JP60-221832 1985-10-07

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JPS6281738A (ja) 1987-04-15

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