KR900007094A - 성형 반도체 팩케지 - Google Patents

성형 반도체 팩케지 Download PDF

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Publication number
KR900007094A
KR900007094A KR1019890015174A KR890015174A KR900007094A KR 900007094 A KR900007094 A KR 900007094A KR 1019890015174 A KR1019890015174 A KR 1019890015174A KR 890015174 A KR890015174 A KR 890015174A KR 900007094 A KR900007094 A KR 900007094A
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KR
South Korea
Prior art keywords
semiconductor
semiconductor die
die
flagless
lead frame
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Application number
KR1019890015174A
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English (en)
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KR100194848B1 (ko
Inventor
아놀드 레스크 이스라엘
웨인 하킨스 죠지
이.토마스 로날드
레즐리 헌터 윌리암
비.맥섀인 마이클
Original Assignee
빈센트 죠셉.로너
모토로라 인코포레이티드
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Application filed by 빈센트 죠셉.로너, 모토로라 인코포레이티드 filed Critical 빈센트 죠셉.로너
Publication of KR900007094A publication Critical patent/KR900007094A/ko
Application granted granted Critical
Publication of KR100194848B1 publication Critical patent/KR100194848B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

내용 없음

Description

성형 반도체 팩케지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 제 1 실시예에 대한 확대 평면도.
제 2 도는 제 1 도 도면에서 2-2선을 취하여 절단한면을 도시한 확대 단면도.
제 3 도는 본 발명의 제 2 실시예의 확대 평면도.

Claims (3)

  1. 플래그 없는 리드프레임을 갖는 성형 반도체 팩케지에 있어서, 제 1 면, 제 2 면 및 여러개의 변과 모서리를 갖는 반도체다이와 ; 다이 개구와, 상기 반도체 다이에 선별적인 방식으로 접속된 리드를 가지며, 상기 반도체 다이에 물리적으로 접속된 플래그 없는 리드프레임과; 상기 반도체 다이와, 돌출한 상기 리드를 제외한 리드프레임 근방에 고정된 봉입체를 구비한 것을 특징으로하는 성형 반도체 팩케지.
  2. 플래그 없는 리드프레임을 갖는 대칭적 성형 반도체에 있어서, 제 1 면, 제 2 면 및 여러개의 변과 모서리를 갖는 반도체 다이와, 리드와 다이 개구를 갖고, 상기 반도체 다이에 고정 접속되며, 또한 상기 반도체 다이와 동일 평면상에 있으며 선택적인 방식으로 상기 반도체 다이와 전기적으로 접속된 플래그 없는 리드 프레임과 ; 상기 반도체 다이와 돌출한 리드를 제외한 리드프레임 근방에 놓인 봉입체를 구비한 것을 특징으로 하는 대칭적 성형 반도체 팩케지.
  3. 플래그 없는 리드프레임을 갖는 성형 반도체 팩케지에 있어서, 제 1 면, 제 2 면 및 여러개의 변과 모서리를 갖는 반도체 다이와 ; 리드와, 상기 반도체 다이보다 작은 다이 개구를 갖는 플래그 없는 리드프레임을 가지며, 상기 반도체의 제 2 면은 상기 다이 개구위에서 상기 프레임과 접속되며, 상기 반도체 다이와, 돌출한 리드를 제외한 리드프레임 근방에 고정된 봉입체를 구비한 것을 특징으로하는 성형 반도체 팩케지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890015174A 1988-10-24 1989-10-23 성형 반도체 팩케지 KR100194848B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/261,439 US4924291A (en) 1988-10-24 1988-10-24 Flagless semiconductor package
US261,439 1988-10-24

Publications (2)

Publication Number Publication Date
KR900007094A true KR900007094A (ko) 1990-05-09
KR100194848B1 KR100194848B1 (ko) 1999-06-15

Family

ID=22993303

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890015174A KR100194848B1 (ko) 1988-10-24 1989-10-23 성형 반도체 팩케지

Country Status (7)

Country Link
US (1) US4924291A (ko)
EP (1) EP0366386B1 (ko)
JP (1) JP2756597B2 (ko)
KR (1) KR100194848B1 (ko)
DE (1) DE68926652T2 (ko)
HK (1) HK1003814A1 (ko)
SG (1) SG47798A1 (ko)

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JP2890662B2 (ja) * 1990-04-25 1999-05-17 ソニー株式会社 樹脂封止型半導体装置の製造方法とそれに用いるリードフレーム
DE4021871C2 (de) * 1990-07-09 1994-07-28 Lsi Logic Products Gmbh Hochintegriertes elektronisches Bauteil
US5140404A (en) * 1990-10-24 1992-08-18 Micron Technology, Inc. Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
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US5214846A (en) * 1991-04-24 1993-06-01 Sony Corporation Packaging of semiconductor chips
US5278442A (en) * 1991-07-15 1994-01-11 Prinz Fritz B Electronic packages and smart structures formed by thermal spray deposition
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US6465890B1 (en) * 2000-11-28 2002-10-15 National Semiconductor Corporation Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packages
EP1473763A1 (en) * 2003-04-30 2004-11-03 STMicroelectronics S.r.l. Manufacturing method of a lead frame for power semiconductor electronic devices, separating the leads and downsetting the die pad in one step
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Also Published As

Publication number Publication date
EP0366386A3 (en) 1991-02-06
JPH02130865A (ja) 1990-05-18
SG47798A1 (en) 1998-04-17
DE68926652D1 (de) 1996-07-18
HK1003814A1 (en) 1998-11-06
EP0366386A2 (en) 1990-05-02
JP2756597B2 (ja) 1998-05-25
DE68926652T2 (de) 1997-01-02
KR100194848B1 (ko) 1999-06-15
US4924291A (en) 1990-05-08
EP0366386B1 (en) 1996-06-12

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