FR2456390A1 - Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier - Google Patents

Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier

Info

Publication number
FR2456390A1
FR2456390A1 FR7911989A FR7911989A FR2456390A1 FR 2456390 A1 FR2456390 A1 FR 2456390A1 FR 7911989 A FR7911989 A FR 7911989A FR 7911989 A FR7911989 A FR 7911989A FR 2456390 A1 FR2456390 A1 FR 2456390A1
Authority
FR
France
Prior art keywords
integrated circuit
single piece
external contacts
piece component
grid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7911989A
Other languages
English (en)
Other versions
FR2456390B1 (fr
Inventor
Christian Val
Claude Vergnolle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR7911989A priority Critical patent/FR2456390A1/fr
Publication of FR2456390A1 publication Critical patent/FR2456390A1/fr
Application granted granted Critical
Publication of FR2456390B1 publication Critical patent/FR2456390B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01057—Lanthanum [La]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)

Abstract

L'INVENTION SE RAPPORTE A UN PROCEDE DE MONTAGE DE CIRCUITS ELECTRONIQUES EN MICROBOITIERS. POUR REDUIRE LES DIMENSIONS EXTERIEURES DES MICROBOITIERS, LA GRILLE COMPORTANT LES CONNEXIONS EXTERIEURES, LES CONNEXIONS INTERMEDIAIRES ET LES CONNEXIONS INTERIEURES SUR LE CIRCUIT ELECTRONIQUE EST DECOUPEE D'UNE SEULE PIECE, DANS UN FILM METALLIQUE RIGIDE: LES CONNEXIONS INTERIEURES SONT RENDUES FLEXIBLES PAR AMINCISSEMENT. LA GRILLE EST DIRECTEMENT SOUDEE SUR LE CIRCUIT ELECTRONIQUE, PUIS SURMOULEE POUR FORMER UN MICROBOITIER. APPLICATION AUX CIRCUITS HYBRIDES.
FR7911989A 1979-05-11 1979-05-11 Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier Granted FR2456390A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7911989A FR2456390A1 (fr) 1979-05-11 1979-05-11 Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7911989A FR2456390A1 (fr) 1979-05-11 1979-05-11 Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier

Publications (2)

Publication Number Publication Date
FR2456390A1 true FR2456390A1 (fr) 1980-12-05
FR2456390B1 FR2456390B1 (fr) 1983-01-21

Family

ID=9225343

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7911989A Granted FR2456390A1 (fr) 1979-05-11 1979-05-11 Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier

Country Status (1)

Country Link
FR (1) FR2456390A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495377A1 (fr) * 1980-11-28 1982-06-04 Western Electric Co Encapsulation pour un circuit integre
DE3046192A1 (de) * 1980-12-08 1982-07-15 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer ic-bausteine
EP0090608A2 (fr) * 1982-03-30 1983-10-05 Fujitsu Limited Dispositif semi-conducteur à empaquetage moulé
EP0204102A2 (fr) * 1985-06-03 1986-12-10 Motorola, Inc. Connexion directe d'un cadre de connexion à conducteurs flexibles en pointe et un support mécanique de dé
FR2584241A1 (fr) * 1985-06-26 1987-01-02 Nat Semiconductor Corp Bande revetue de nickel
EP0232108A2 (fr) * 1986-01-27 1987-08-12 Olin Corporation Procédé pour la fabrication d'une bande à protubérance pour le montage automatique sur bande et le produit ainsi obtenu
US4812949A (en) * 1986-03-28 1989-03-14 Bull, S.A. Method of and apparatus for mounting an IC chip
EP0366386A2 (fr) * 1988-10-24 1990-05-02 Motorola, Inc. Empaquetage semi-conducteur sans plot de montage
US5041902A (en) * 1989-12-14 1991-08-20 Motorola, Inc. Molded electronic package with compression structures
EP0539095A2 (fr) * 1991-10-23 1993-04-28 Fujitsu Limited Dispositif semi-conducteur comprenant une structure de radiateur et procédé de fabrication associé
US5216283A (en) * 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4026008A (en) * 1972-10-02 1977-05-31 Signetics Corporation Semiconductor lead structure and assembly and method for fabricating same
FR2360174A1 (fr) * 1976-07-30 1978-02-24 Amp Inc Boitier de circuit integre et son procede de fabrication
FR2375721A1 (fr) * 1976-12-23 1978-07-21 Siemens Ag Support intermediaire prevu pour le soutien et le contactage d'un corps semiconducteur

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4026008A (en) * 1972-10-02 1977-05-31 Signetics Corporation Semiconductor lead structure and assembly and method for fabricating same
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
FR2360174A1 (fr) * 1976-07-30 1978-02-24 Amp Inc Boitier de circuit integre et son procede de fabrication
FR2375721A1 (fr) * 1976-12-23 1978-07-21 Siemens Ag Support intermediaire prevu pour le soutien et le contactage d'un corps semiconducteur

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495377A1 (fr) * 1980-11-28 1982-06-04 Western Electric Co Encapsulation pour un circuit integre
DE3046192A1 (de) * 1980-12-08 1982-07-15 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer ic-bausteine
US4698660A (en) * 1982-03-30 1987-10-06 Fujitsu Limited Resin-molded semiconductor device
EP0090608A2 (fr) * 1982-03-30 1983-10-05 Fujitsu Limited Dispositif semi-conducteur à empaquetage moulé
EP0090608A3 (en) * 1982-03-30 1985-05-22 Fujitsu Limited Semiconductor device with moulded package
EP0204102A3 (fr) * 1985-06-03 1987-11-19 Motorola, Inc. Connexion directe d'un cadre de connexion à conducteurs flexibles en pointe et un support mécanique de dé
EP0204102A2 (fr) * 1985-06-03 1986-12-10 Motorola, Inc. Connexion directe d'un cadre de connexion à conducteurs flexibles en pointe et un support mécanique de dé
FR2584241A1 (fr) * 1985-06-26 1987-01-02 Nat Semiconductor Corp Bande revetue de nickel
EP0232108A2 (fr) * 1986-01-27 1987-08-12 Olin Corporation Procédé pour la fabrication d'une bande à protubérance pour le montage automatique sur bande et le produit ainsi obtenu
EP0232108A3 (en) * 1986-01-27 1988-07-20 Olin Corporation Process for manufacturing bumped tape for tape automated bonding and the product produced thereby.
US4812949A (en) * 1986-03-28 1989-03-14 Bull, S.A. Method of and apparatus for mounting an IC chip
EP0366386A3 (fr) * 1988-10-24 1991-02-06 Motorola, Inc. Empaquetage semi-conducteur sans plot de montage
EP0366386A2 (fr) * 1988-10-24 1990-05-02 Motorola, Inc. Empaquetage semi-conducteur sans plot de montage
US5041902A (en) * 1989-12-14 1991-08-20 Motorola, Inc. Molded electronic package with compression structures
US5216283A (en) * 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
EP0539095A2 (fr) * 1991-10-23 1993-04-28 Fujitsu Limited Dispositif semi-conducteur comprenant une structure de radiateur et procédé de fabrication associé
EP0539095A3 (fr) * 1991-10-23 1994-02-16 Fujitsu Ltd
US5659200A (en) * 1991-10-23 1997-08-19 Fujitsu, Ltd. Semiconductor device having radiator structure
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Also Published As

Publication number Publication date
FR2456390B1 (fr) 1983-01-21

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