FR2360174A1 - Boitier de circuit integre et son procede de fabrication - Google Patents

Boitier de circuit integre et son procede de fabrication

Info

Publication number
FR2360174A1
FR2360174A1 FR7723098A FR7723098A FR2360174A1 FR 2360174 A1 FR2360174 A1 FR 2360174A1 FR 7723098 A FR7723098 A FR 7723098A FR 7723098 A FR7723098 A FR 7723098A FR 2360174 A1 FR2360174 A1 FR 2360174A1
Authority
FR
France
Prior art keywords
integrated circuit
manufacturing process
circuit box
cavity
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7723098A
Other languages
English (en)
Other versions
FR2360174B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of FR2360174A1 publication Critical patent/FR2360174A1/fr
Application granted granted Critical
Publication of FR2360174B1 publication Critical patent/FR2360174B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Boîtier étanche de circuit intégré. Il comprend un support isolant 16 qui présente une cavité dans laquelle une plaquette 10 à circuit intégré est logée et reliée à des conducteurs 12 et 15. Cette plaquette est enrobée d'un gel 19 d'étanchéité, avant que des éléments 18 de fermeture soient emboîtés à force dans la cavité pour l'obturer hermétiquement. Domaine d'application : boîtiers pour circuits intégrés.
FR7723098A 1976-07-30 1977-07-27 Boitier de circuit integre et son procede de fabrication Granted FR2360174A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/710,043 US4079511A (en) 1976-07-30 1976-07-30 Method for packaging hermetically sealed integrated circuit chips on lead frames

Publications (2)

Publication Number Publication Date
FR2360174A1 true FR2360174A1 (fr) 1978-02-24
FR2360174B1 FR2360174B1 (fr) 1983-01-21

Family

ID=24852388

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7723098A Granted FR2360174A1 (fr) 1976-07-30 1977-07-27 Boitier de circuit integre et son procede de fabrication

Country Status (12)

Country Link
US (1) US4079511A (fr)
JP (2) JPS5317276A (fr)
BE (1) BE857125A (fr)
BR (1) BR7704965A (fr)
CA (1) CA1069220A (fr)
DE (1) DE2734439A1 (fr)
ES (2) ES461133A1 (fr)
FR (1) FR2360174A1 (fr)
GB (1) GB1524776A (fr)
IT (1) IT1080619B (fr)
NL (1) NL7707424A (fr)
SE (1) SE423846B (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0015111A1 (fr) * 1979-02-23 1980-09-03 AMP INCORPORATED (a New Jersey corporation) Cadre conducteur et boîtier pour circuit intégré
FR2456390A1 (fr) * 1979-05-11 1980-12-05 Thomson Csf Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier
FR2464560A1 (fr) * 1979-08-30 1981-03-06 Burr Brown Res Corp Boitier moule a deux rangees de broches pour module electronique et son procede de realisation
FR2476389A1 (fr) * 1980-02-12 1981-08-21 Mostek Corp Boitier de circuits electroniques a pastilles semi-conductrices alignees et superposees
EP0077276A2 (fr) * 1981-10-13 1983-04-20 FAIRCHILD CAMERA & INSTRUMENT CORPORATION Procédé de fabrication d'un module à circuit hybride
FR2521350A1 (fr) * 1982-02-05 1983-08-12 Hitachi Ltd Boitier porteur de puce semi-conductrice
EP0090608A2 (fr) * 1982-03-30 1983-10-05 Fujitsu Limited Dispositif semi-conducteur à empaquetage moulé
EP0212521A1 (fr) * 1985-08-10 1987-03-04 Fujitsu Limited Empaquetage pour circuit intégré
WO1989007835A1 (fr) * 1988-02-20 1989-08-24 Deutsche Itt Industries Gmbh Element semi-conducteur, procede de fabrication, dispositif et station de montage
EP0352183A1 (fr) * 1988-07-20 1990-01-24 Matra Marconi Space France Procédé de montage de micro-composants électroniques sur un support et produit intermédiaire
EP0473796A1 (fr) * 1990-03-15 1992-03-11 Fujitsu Limited Dispositif semiconducteur a puces multiples
US5530292A (en) * 1990-03-15 1996-06-25 Fujitsu Limited Semiconductor device having a plurality of chips

Families Citing this family (136)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4089575A (en) * 1976-09-27 1978-05-16 Amp Incorporated Connector for connecting a circuit element to the surface of a substrate
US4326214A (en) * 1976-11-01 1982-04-20 National Semiconductor Corporation Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip
US4136357A (en) * 1977-10-03 1979-01-23 National Semiconductor Corporation Integrated circuit package with optical input coupler
US4258411A (en) * 1979-05-21 1981-03-24 Bell Telephone Laboratories, Incorporated Electronic device packaging arrangement
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
US4289922A (en) * 1979-09-04 1981-09-15 Plessey Incorporated Integrated circuit package and lead frame
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
US4364620A (en) * 1980-09-05 1982-12-21 Mostek Corporation Socket for housing a plurality of integrated circuits
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
US4391531A (en) * 1980-12-19 1983-07-05 Timex Corporation Electrooptical display/lead frame subassembly and timepiece module including same
US4381602A (en) * 1980-12-29 1983-05-03 Honeywell Information Systems Inc. Method of mounting an I.C. chip on a substrate
US4527185A (en) * 1981-01-12 1985-07-02 Avx Corporation Integrated circuit device and subassembly
US4454529A (en) * 1981-01-12 1984-06-12 Avx Corporation Integrated circuit device having internal dampening for a plurality of power supplies
EP0069733A1 (fr) * 1981-01-15 1983-01-19 Mostek Corporation Enveloppe de circuit integre
FR2498814B1 (fr) * 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
JPS57181146A (en) * 1981-04-30 1982-11-08 Hitachi Ltd Resin-sealed semiconductor device
US4496965A (en) * 1981-05-18 1985-01-29 Texas Instruments Incorporated Stacked interdigitated lead frame assembly
US5055704A (en) * 1984-07-23 1991-10-08 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with battery housing
US4574297A (en) * 1981-07-15 1986-03-04 Rohm Company Limited Encapsulated semiconductor with terminals having tabs to increase solder wetting
US4445736A (en) * 1982-03-31 1984-05-01 Amp Incorporated Method and apparatus for producing a premolded packaging
JPS58153459U (ja) * 1982-04-07 1983-10-14 三菱電機株式会社 半導体装置
JPS592152U (ja) * 1982-06-28 1984-01-09 富士通株式会社 リ−ド付チツプキヤリア
US4480262A (en) * 1982-07-15 1984-10-30 Olin Corporation Semiconductor casing
US4594770A (en) * 1982-07-15 1986-06-17 Olin Corporation Method of making semiconductor casing
US5357057A (en) * 1982-10-12 1994-10-18 Raychem Corporation Protected electrical connector
US4477828A (en) * 1982-10-12 1984-10-16 Scherer Jeremy D Microcircuit package and sealing method
US4633573A (en) * 1982-10-12 1987-01-06 Aegis, Inc. Microcircuit package and sealing method
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
JPS59189662A (ja) * 1983-04-13 1984-10-27 Fujitsu Ltd 樹脂封止型半導体装置
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
US4736520A (en) * 1983-11-04 1988-04-12 Control Data Corporation Process for assembling integrated circuit packages
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
US4663650A (en) * 1984-05-02 1987-05-05 Gte Products Corporation Packaged integrated circuit chip
IT1180514B (it) * 1984-07-27 1987-09-23 Arcotroniks Italia Spa Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici
US4783697A (en) * 1985-01-07 1988-11-08 Motorola, Inc. Leadless chip carrier for RF power transistors or the like
GB2174538A (en) * 1985-04-24 1986-11-05 Stanley Bracey Semiconductor package
JPS628639U (fr) * 1985-06-28 1987-01-19
US4754317A (en) * 1986-04-28 1988-06-28 Monolithic Memories, Inc. Integrated circuit die-to-lead frame interconnection assembly and method
DE3616969A1 (de) * 1986-05-20 1987-11-26 Bosch Gmbh Robert Gehaeuse fuer integrierte schaltkreise
US4809135A (en) * 1986-08-04 1989-02-28 General Electric Company Chip carrier and method of fabrication
US4800419A (en) * 1987-01-28 1989-01-24 Lsi Logic Corporation Support assembly for integrated circuits
US4874722A (en) * 1987-04-16 1989-10-17 Texas Instruments Incorporated Process of packaging a semiconductor device with reduced stress forces
US4878108A (en) * 1987-06-15 1989-10-31 International Business Machines Corporation Heat dissipation package for integrated circuits
US4939014A (en) * 1987-12-16 1990-07-03 Ford Motor Company Composite polymer/desiccant coatings for IC encapsulation
US4977009A (en) * 1987-12-16 1990-12-11 Ford Motor Company Composite polymer/desiccant coatings for IC encapsulation
US4872260A (en) * 1988-01-19 1989-10-10 Gte Products Corporation Method of making pre-formed lead-ins for an IC package
US4852250A (en) * 1988-01-19 1989-08-01 Microelectronics And Computer Technology Corporation Hermetically sealed package having an electronic component and method of making
US5019892A (en) * 1988-02-18 1991-05-28 Amp Incorporated Chip carrier with accumulator
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ES461133A1 (es) 1978-06-01
JPS60126850A (ja) 1985-07-06
JPS5317276A (en) 1978-02-17
NL7707424A (nl) 1978-02-01
JPS6229908B2 (fr) 1987-06-29
BE857125A (fr) 1978-01-25
CA1069220A (fr) 1980-01-01
SE7708156L (sv) 1978-01-31
DE2734439C2 (fr) 1988-08-25
BR7704965A (pt) 1978-04-25
JPS6143851B2 (fr) 1986-09-30
SE423846B (sv) 1982-06-07
IT1080619B (it) 1985-05-16
GB1524776A (en) 1978-09-13
ES462978A1 (es) 1978-06-01
DE2734439A1 (de) 1978-02-02
US4079511A (en) 1978-03-21
FR2360174B1 (fr) 1983-01-21

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