IT1180514B - Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici - Google Patents

Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici

Info

Publication number
IT1180514B
IT1180514B IT03538/84A IT353884A IT1180514B IT 1180514 B IT1180514 B IT 1180514B IT 03538/84 A IT03538/84 A IT 03538/84A IT 353884 A IT353884 A IT 353884A IT 1180514 B IT1180514 B IT 1180514B
Authority
IT
Italy
Prior art keywords
annexed
creation
procedure
electronic
protective enclosures
Prior art date
Application number
IT03538/84A
Other languages
English (en)
Other versions
IT8403538A0 (it
Inventor
Giorgio Ventura
Original Assignee
Arcotroniks Italia Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arcotroniks Italia Spa filed Critical Arcotroniks Italia Spa
Publication of IT8403538A0 publication Critical patent/IT8403538A0/it
Priority to IT03538/84A priority Critical patent/IT1180514B/it
Priority to FI852577A priority patent/FI852577L/fi
Priority to GR851658A priority patent/GR851658B/el
Priority to EP85830181A priority patent/EP0169820A3/en
Priority to KR1019850005146A priority patent/KR900001116B1/ko
Priority to JP60165619A priority patent/JPS6147602A/ja
Priority to ES545564A priority patent/ES8609872A1/es
Priority to PT80874A priority patent/PT80874B/pt
Priority to US06/915,877 priority patent/US4720916A/en
Application granted granted Critical
Publication of IT1180514B publication Critical patent/IT1180514B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/22—End caps, i.e. of insulating or conductive material for covering or maintaining connections between wires entering the cap from the same end
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/048—Welding with other step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Insulating Of Coils (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
IT03538/84A 1984-07-27 1984-07-27 Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici IT1180514B (it)

Priority Applications (9)

Application Number Priority Date Filing Date Title
IT03538/84A IT1180514B (it) 1984-07-27 1984-07-27 Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici
FI852577A FI852577L (fi) 1984-07-27 1985-06-28 Foerfarande foer framstaellning av skyddande kuvert.
GR851658A GR851658B (it) 1984-07-27 1985-07-04
EP85830181A EP0169820A3 (en) 1984-07-27 1985-07-12 Process for producing protective envelopes in which corresponding electric-electronic circuit components are dipped
KR1019850005146A KR900001116B1 (ko) 1984-07-27 1985-07-19 회로소자의 피복방법
JP60165619A JPS6147602A (ja) 1984-07-27 1985-07-26 回路部品を収容する保護容器の製造方法
ES545564A ES8609872A1 (es) 1984-07-27 1985-07-26 Procedimiento para la realizacion de envoltura protectora enel que se anegan componentes circuitarios electricoelectro- nicos correspondientes
PT80874A PT80874B (en) 1984-07-27 1985-07-26 Process for producting protective envelopes in which corresponding electric/electronic circuit components are dipped
US06/915,877 US4720916A (en) 1984-07-27 1986-10-08 Process for producing protective envelopes in which corresponding electric-electronic circuit components are dipped

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT03538/84A IT1180514B (it) 1984-07-27 1984-07-27 Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici

Publications (2)

Publication Number Publication Date
IT8403538A0 IT8403538A0 (it) 1984-07-27
IT1180514B true IT1180514B (it) 1987-09-23

Family

ID=11109286

Family Applications (1)

Application Number Title Priority Date Filing Date
IT03538/84A IT1180514B (it) 1984-07-27 1984-07-27 Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici

Country Status (9)

Country Link
US (1) US4720916A (it)
EP (1) EP0169820A3 (it)
JP (1) JPS6147602A (it)
KR (1) KR900001116B1 (it)
ES (1) ES8609872A1 (it)
FI (1) FI852577L (it)
GR (1) GR851658B (it)
IT (1) IT1180514B (it)
PT (1) PT80874B (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS631109A (ja) * 1986-06-19 1988-01-06 Murata Mfg Co Ltd 電子部品およびその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3076051A (en) * 1959-03-05 1963-01-29 Rca Corp Thermoelectric devices and methods of making same
US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
US3364567A (en) * 1965-09-14 1968-01-23 Bell Telephone Labor Inc Encapsulated electrical device and method of fabricating same
US3530541A (en) * 1968-06-13 1970-09-29 Trw Inc Mold for encapsulating electrical components
FR2076686A5 (it) * 1970-01-23 1971-10-15 Sovcor Electronique
US3838316A (en) * 1973-10-09 1974-09-24 Western Electric Co Encapsulated electrical component assembly and method of fabrication
SE389991B (sv) * 1974-09-19 1976-11-29 Ericsson Telefon Ab L M Metod for kapsling av elektriska komponenter samt anordning herfor
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
US4268942A (en) * 1979-09-04 1981-05-26 Western Electric Company, Inc. Method and apparatus for manufacturing boxed encapsulated capacitors
DE2952297A1 (de) * 1979-12-24 1981-07-02 Werner Dipl.-Ing. 6840 Lampertheim Schaller Verfahren und vorrichtung zur herstellung von elektronischen geraeten, insbesondere beruehrungslosen sensoren und modulen
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
US4374080A (en) * 1981-01-13 1983-02-15 Indy Electronics, Inc. Method and apparatus for encapsulation casting
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor

Also Published As

Publication number Publication date
FI852577L (fi) 1986-01-28
EP0169820A3 (en) 1987-08-26
FI852577A0 (fi) 1985-06-28
KR900001116B1 (ko) 1990-02-26
ES8609872A1 (es) 1986-09-01
PT80874B (en) 1986-11-24
ES545564A0 (es) 1986-09-01
KR860001499A (ko) 1986-02-26
GR851658B (it) 1985-11-26
JPS6147602A (ja) 1986-03-08
IT8403538A0 (it) 1984-07-27
EP0169820A2 (en) 1986-01-29
US4720916A (en) 1988-01-26
PT80874A (en) 1985-08-01

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