GB2167905B - Heat sink for electronic components and/or equipment - Google Patents

Heat sink for electronic components and/or equipment

Info

Publication number
GB2167905B
GB2167905B GB8524344A GB8524344A GB2167905B GB 2167905 B GB2167905 B GB 2167905B GB 8524344 A GB8524344 A GB 8524344A GB 8524344 A GB8524344 A GB 8524344A GB 2167905 B GB2167905 B GB 2167905B
Authority
GB
United Kingdom
Prior art keywords
equipment
heat sink
electronic components
electronic
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8524344A
Other versions
GB8524344D0 (en
GB2167905A (en
Inventor
Franz Werner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nixdorf Computer AG
Nixdorf Computer Corp
Original Assignee
Nixdorf Computer AG
Nixdorf Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nixdorf Computer AG, Nixdorf Computer Corp filed Critical Nixdorf Computer AG
Publication of GB8524344D0 publication Critical patent/GB8524344D0/en
Publication of GB2167905A publication Critical patent/GB2167905A/en
Application granted granted Critical
Publication of GB2167905B publication Critical patent/GB2167905B/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB8524344A 1984-10-08 1985-10-02 Heat sink for electronic components and/or equipment Expired GB2167905B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19848429523 DE8429523U1 (en) 1984-10-08 1984-10-08 Heat sinks for electronic components and / or devices

Publications (3)

Publication Number Publication Date
GB8524344D0 GB8524344D0 (en) 1985-11-06
GB2167905A GB2167905A (en) 1986-06-04
GB2167905B true GB2167905B (en) 1988-04-20

Family

ID=6771476

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8524344A Expired GB2167905B (en) 1984-10-08 1985-10-02 Heat sink for electronic components and/or equipment

Country Status (3)

Country Link
DE (1) DE8429523U1 (en)
FR (1) FR2571546B1 (en)
GB (1) GB2167905B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446198C2 (en) * 1984-12-18 1996-06-05 Siemens Ag Method for producing a composite body from thin-walled elements and a supporting body
DE3518310A1 (en) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
JP3122173B2 (en) * 1990-11-09 2001-01-09 株式会社東芝 Heatsink, heatsink, and method of manufacturing heatsink
GB2256531A (en) * 1991-05-28 1992-12-09 Greenfields Europ Limited Heatsinking of electrical fittings
US5239163A (en) * 1991-06-19 1993-08-24 Texas Instruments Incorporated Automobile air heater utilizing PTC tablets adhesively fixed to tubular heat sinks
GB9301049D0 (en) * 1993-01-20 1993-03-10 The Technology Partnership Plc Mounting assembly
DE4314663A1 (en) * 1993-05-04 1994-11-10 Alusuisse Lonza Services Ag Heatsinks for semiconductor devices
TW265430B (en) * 1994-06-30 1995-12-11 Intel Corp Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
DE4445849A1 (en) * 1994-12-22 1996-06-27 Sel Alcatel Ag Device for dissipating heat from an electronic component
DE29602367U1 (en) * 1995-03-24 1996-05-15 Alusuisse Lonza Services Ag Heat sink for semiconductor components or the like.
AU1923397A (en) * 1996-01-27 1997-08-20 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
FI112585B (en) * 1996-03-13 2003-12-15 Nokia Alumiini Oy Heat sink
DE19628548A1 (en) * 1996-07-16 1998-01-22 Abb Patent Gmbh Heat sink profile for air cooling device for semiconductor components
US5829514A (en) * 1997-10-29 1998-11-03 Eastman Kodak Company Bonded cast, pin-finned heat sink and method of manufacture
US6009938A (en) * 1997-12-11 2000-01-04 Eastman Kodak Company Extruded, tiered high fin density heat sinks and method of manufacture
DE10065470B4 (en) * 2000-12-28 2011-02-17 Aleris Aluminum Vogt Gmbh Method for producing a cooling element for electrical, in particular electronic, components
DE10222471A1 (en) * 2002-05-22 2003-12-18 Lenze Drive Systems Gmbh Cooler for frequency converter of speed controllable AC motor for waste heat convection of converter components, with braking resistance incorporated integrally in extruded cooler
DE102005007041A1 (en) * 2005-02-15 2006-08-17 Alcan Technology & Management Ag Heat sink for semiconductor devices or the like. Facilities and method for its preparation
CN100590377C (en) * 2005-02-18 2010-02-17 阳傑科技股份有限公司 Heat pipe cooling system and its heat transfer connector
KR101287755B1 (en) * 2010-11-22 2013-07-18 삼성전기주식회사 Heat sink

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3081824A (en) * 1960-09-19 1963-03-19 Behlman Engineering Company Mounting unit for electrical components
US3313340A (en) * 1965-03-23 1967-04-11 Lambda Electronics Corp Heat exchanger
FR1499462A (en) * 1966-09-16 1967-10-27 Const Aero Navales Method of manufacturing a heat exchanger between two fluids and heat exchanger by applying
DE2013539A1 (en) * 1970-03-20 1971-10-07 Siemens Ag Heat conducting bodies for dissipating the operating temperature from the interior of a house
JPS5993191A (en) * 1982-11-18 1984-05-29 Toshiba Corp Heat exchanger

Also Published As

Publication number Publication date
FR2571546B1 (en) 1988-10-14
GB8524344D0 (en) 1985-11-06
DE8429523U1 (en) 1984-11-29
FR2571546A1 (en) 1986-04-11
GB2167905A (en) 1986-06-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19931002