GB2165704B - Heat dissipation for electronic components - Google Patents

Heat dissipation for electronic components

Info

Publication number
GB2165704B
GB2165704B GB8524805A GB8524805A GB2165704B GB 2165704 B GB2165704 B GB 2165704B GB 8524805 A GB8524805 A GB 8524805A GB 8524805 A GB8524805 A GB 8524805A GB 2165704 B GB2165704 B GB 2165704B
Authority
GB
United Kingdom
Prior art keywords
heat dissipation
electronic components
electronic
components
dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8524805A
Other versions
GB2165704A (en
GB8524805D0 (en
Inventor
Martin Joseph Pitasi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of GB8524805D0 publication Critical patent/GB8524805D0/en
Publication of GB2165704A publication Critical patent/GB2165704A/en
Application granted granted Critical
Publication of GB2165704B publication Critical patent/GB2165704B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB8524805A 1984-10-11 1985-10-08 Heat dissipation for electronic components Expired GB2165704B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65964884A 1984-10-11 1984-10-11

Publications (3)

Publication Number Publication Date
GB8524805D0 GB8524805D0 (en) 1985-11-13
GB2165704A GB2165704A (en) 1986-04-16
GB2165704B true GB2165704B (en) 1988-05-11

Family

ID=24646223

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8524805A Expired GB2165704B (en) 1984-10-11 1985-10-08 Heat dissipation for electronic components

Country Status (5)

Country Link
JP (1) JPH0669119B2 (en)
CA (1) CA1235528A (en)
DE (1) DE3531729A1 (en)
FR (1) FR2571921B1 (en)
GB (1) GB2165704B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4682269A (en) * 1984-10-11 1987-07-21 Teradyne, Inc. Heat dissipation for electronic components on a ceramic substrate
GB2198888A (en) * 1986-12-09 1988-06-22 Lucas Ind Plc Cooling electronic components
DE3822890A1 (en) * 1988-03-15 1989-09-28 Siemens Ag Cooling arrangement for an optical character generator
US5158136A (en) * 1991-11-12 1992-10-27 At&T Laboratories Pin fin heat sink including flow enhancement
DE4437971C2 (en) * 1994-10-24 1997-09-11 Siemens Ag Cooling device for electrical assemblies
KR20150031818A (en) * 2013-09-17 2015-03-25 삼성전자주식회사 Portable electronic device capable of decreasing heat temperature

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2137001A1 (en) * 1971-05-11 1972-12-29 Thomson Csf
JPS5647962Y2 (en) * 1976-02-03 1981-11-10
US4034469A (en) * 1976-09-03 1977-07-12 Ibm Corporation Method of making conduction-cooled circuit package
DE7821509U1 (en) * 1978-07-18 1978-10-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Cooling device for LSI wafers
US4292647A (en) * 1979-04-06 1981-09-29 Amdahl Corporation Semiconductor package and electronic array having improved heat dissipation
JPS56164559U (en) * 1980-05-09 1981-12-07
DE3031912A1 (en) * 1980-08-23 1982-04-01 Brown, Boveri & Cie Ag, 6800 Mannheim ARRANGEMENT FOR POTENTIAL-INDEPENDENT HEAT EXHAUST
FR2495838A1 (en) * 1980-12-05 1982-06-11 Cii Honeywell Bull REMOVABLE COOLING DEVICE FOR INTEGRATED CIRCUIT CARRIERS
JPS57120390A (en) * 1981-01-19 1982-07-27 Mitsubishi Electric Corp Ceramic circuit board
JPS5832313U (en) * 1981-08-20 1983-03-02 トキコ株式会社 vehicle height detector
US4541004A (en) * 1982-11-24 1985-09-10 Burroughs Corporation Aerodynamically enhanced heat sink
US4546405A (en) * 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
EP0135120B1 (en) * 1983-08-23 1988-03-09 BBC Brown Boveri AG Ceramic-metallic element

Also Published As

Publication number Publication date
DE3531729C2 (en) 1987-10-29
CA1235528A (en) 1988-04-19
GB2165704A (en) 1986-04-16
FR2571921B1 (en) 1989-02-03
JPS6195598A (en) 1986-05-14
GB8524805D0 (en) 1985-11-13
DE3531729A1 (en) 1986-04-17
JPH0669119B2 (en) 1994-08-31
FR2571921A1 (en) 1986-04-18

Similar Documents

Publication Publication Date Title
GB2195056B (en) Heat dissipation for electronic components
DE3663614D1 (en) Cooling system for electronic circuit components
DE3475142D1 (en) Heat sink structure for an electronic package
DE3572909D1 (en) Cooling system for electronic circuit device
IL68563A0 (en) Cooling assembly for circuit boards
EP0130279A3 (en) Heat radiator assembly for cooling electronic parts
GB8520790D0 (en) Electronic components series
EP0297894A3 (en) Thermal package for electronic components
GB2158625B (en) Predistortion circuit
GB2167905B (en) Heat sink for electronic components and/or equipment
GB2125557B (en) Electronic thermometer
GB2163287B (en) Electronic chip-carrier heat sinks
GB8519745D0 (en) Heat sink
GB2199650B (en) Heat dissipating mounting for electronic components
DE3463719D1 (en) Device for the heat dissipation of printed circuit boards
GB2153152B (en) Case for electronic devices
GB2165704B (en) Heat dissipation for electronic components
GB8331434D0 (en) Electronic components
HK47292A (en) Battery-feed circuit for exchange
DE3480140D1 (en) Electronic component
DE3569648D1 (en) Heat dissipation device for an electrical component
JPS57156760A (en) Electronic cooling pillow
GB2132030B (en) Electronic chip components
GB8431960D0 (en) Tape-mounted electronic components assembly
JPS57148388A (en) Heat sink printed circuit board

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19951008