JPS6195598A - Heat radiator for electronic component - Google Patents

Heat radiator for electronic component

Info

Publication number
JPS6195598A
JPS6195598A JP21362185A JP21362185A JPS6195598A JP S6195598 A JPS6195598 A JP S6195598A JP 21362185 A JP21362185 A JP 21362185A JP 21362185 A JP21362185 A JP 21362185A JP S6195598 A JPS6195598 A JP S6195598A
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation device
heat
electronic component
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21362185A
Other languages
Japanese (ja)
Other versions
JPH0669119B2 (en
Inventor
マーテイン・ジヨセフ・ピタシ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of JPS6195598A publication Critical patent/JPS6195598A/en
Publication of JPH0669119B2 publication Critical patent/JPH0669119B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 ［技術分野１ 本発明は、セラミック基板上の電子部品〈構成要素）か
ら熱を放散させる装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field 1] The present invention relates to an apparatus for dissipating heat from an electronic component (component) on a ceramic substrate.

［背狽技術］ 電子部品をセラミック阜仮トに取りつ（）て、Ｊｌ板に
設けた金属化）９体によってＩｔ′１互に゛電気的に接
続することができる。ｌｅｅの米ｒｆＪ　Ｖｉ訂第４．
２９２，６４７号は、ビラミック基板上に取りつけた複
数の電子チップを含み、それらの上に直接的に取りつけ
た個別の熱伝３ｇ素子を右づる半ρ７１Ａパッケージを
開示している。[Second bonding technology] Electronic components can be mounted on a ceramic plate and electrically connected to each other by means of nine metallized bodies provided on the Jl plate. Lee's rice RFJ Vi edition 4th.
No. 292,647 discloses a semi-ρ71A package that includes a plurality of electronic chips mounted on a biramic substrate and has individual thermal conductive 3G elements mounted directly thereon.

［発明の概要〕 本発明によれば、しラミック仮を使用することによって
イの一表面の゛電子部品からの熱が非；’＋に有効に放
散される。その亡ラミック（ｋの地表面には、少数のが
間して分前される金属性の熱伝導素子が取りつ（）られ
、そこから伸びている。[Summary of the Invention] According to the present invention, heat from an electronic component on one surface of the device is effectively dissipated by using a ceramic material. A small number of metal heat-conducting elements are attached to the surface of the earth and extend from there.

好適実施例においでは、金属Ｐ１素子が取りつけられる
廿ラミック機は、°電子部品が取りつけられるしラミッ
ク基板と分離されており、金属性素子が取りつけられた
前記セラミック板は該板を電子部品が取りつけられる廿
ラミック基板に接着層るための接着剤を含み、前記金属
性素子は円筒状胴ビンぐあり、そのピンはセラミック板
にその上に設−ｙられるハンダ及び金属性パッドによっ
て結合される。In a preferred embodiment, the ceramic plate on which the metal P1 element is mounted is separate from the lamic substrate on which the electronic component is mounted, and the ceramic plate on which the metallic element is mounted is separate from the ceramic board on which the electronic component is mounted. The metallic element has a cylindrical barrel, the pins of which are bonded to the ceramic plate by solder and metallic pads placed thereon.

両方の板はセラミックから作られているので、それらの
間に１よ温度によるストレス（熱応力）が１しない。ま
た、セラミックの板は熱を良く放散し、各ビン間の温度
差を低くし、熱Ｍ敗能力を増大さける。銅製ビンは、そ
れに接づる空気に良く熱を伝達し、通り抜ける空気の１
エカ低下を少なくし、ハンダは良好な接着強度をもたら
し、それを通過号る熱に対する熱抵抗が殆んどない。Since both plates are made of ceramic, there is no temperature stress between them. In addition, the ceramic plate dissipates heat well, reduces the temperature difference between each bottle, and increases the heat loss capacity. Copper bottles transfer heat well to the air that comes into contact with them, and 1 of the air that passes through them.
With low energy loss, the solder provides good bond strength and has little thermal resistance to heat passing through it.

別の好適実施例にＪ３いては、−表面上に金属性熱伝導
ん子を右づるセラミック板は、他の表面上に電子部品が
取りつ＋ｊられる。In another preferred embodiment J3, a ceramic plate having a metallic thermal conductor on one surface has an electronic component mounted on the other surface.

［実障例の説明］ 本発明を以下実施例に従って訂細に説明する。[Explanation of actual failure case] The present invention will be described in detail below with reference to Examples.

佐−り 第１図を参照すると、セラミック基板１０が示され、該
基板は、その上面に電子部品１２を有し、その下面の熱
放散器１４に取り付けられる。電子部品１２はセラミッ
ク板１０の上面及び下面において金属化導体１６によっ
て相互に電気的に接続され、また板１０の上面の金属化
導体１６上には絶縁被膜１８が設置ノられる。放散器１
４は、上面に、セラミック板２０（純度９５％のアルミ
ナ）、熱硬化性接着剤に／ｉ２２（３Ｍ製の商品名ＹＮ
４６９又はＹＮ５６８　、厚さ５ミル）を有し、下面に
金属性熱伝導ピン２４を有づる。Referring to FIG. 1, a ceramic substrate 10 is shown having electronic components 12 on its top surface and attached to a heat spreader 14 on its bottom surface. The electronic components 12 are electrically connected to each other by metallized conductors 16 on the top and bottom surfaces of the ceramic plate 10, and an insulating coating 18 is disposed on the metalized conductors 16 on the top surface of the plate 10. Diffuser 1
4 is a ceramic plate 20 (95% pure alumina) on the top surface and a thermosetting adhesive /i22 (product name YN manufactured by 3M).
469 or YN568, 5 mils thick) and has a metallic thermal pin 24 on the underside.

第２図には、板２０の下面のピン２４の配列が示される
。ピン２４は、０．１２５ｘ　ｏ、　１２５インチ（３
，１８ｘ３．１８ｍｍ）平方の貞空被盾（蒸る）された
パラジウム／銀のパッド２６の上に取りつけられ、これ
らのパッドは幅方向で００９４インブｆ２．３９　ｒｎ
ｍ＞　、　ＩＪツノ向で０１０８インチ（２，７４，）
相互に離される。In FIG. 2, the arrangement of pins 24 on the underside of plate 20 is shown. Pin 24 is 0.125 x o, 125 inches (3
, 18x3.18mm) square blank-shielded palladium/silver pads 26, these pads are 0094 inch f2.39 rn across the width.
m>, 0108 inch (2,74,) towards IJ horn
separated from each other.

９〕３図においては、ピン２４は直径約０．１インチ（
２，５４、）　、長さ１７４インチ（６，３５Ｈｎ）で
、銅製の心２８及びすす製のコーティング３０から成る
。ピン２４はパッド２６にハンダ３２によってイ」着さ
れる。9] In Figure 3, the pin 24 has a diameter of approximately 0.1 inch (
2,54, ), 174 inches (6,35Hn) long, and consists of a copper core 28 and a soot coating 30. Pin 24 is attached to pad 26 by solder 32.

乳−Ｌ 熱放散器１４は、ピン２４を適切に配列させるジグに固
定し、そのピン２４の開放端にハンダ・ペーストを（ｊ
けることによって作られる。パッド２Ｇを有りるしラミ
ック板２０がピン２４の開放端上に置かれ、ピン２４と
セラミック板２０が相互に真空ハンダ付け（ｖａｐｏｒ
　５Ｏ１ｄＯｒｉｌ’ＩＯ）によ−）て結合される。ビ
ン／セラ４フ９組）１体が冷却された後、接着層２２が
取りつけられ、これをリリース層（図示しず〉で覆う。The milk-L heat dissipator 14 is fixed to a jig that properly aligns the pins 24, and the open ends of the pins 24 are coated with solder paste (j
It is made by Lamic plate 20 with pad 2G is placed on the open end of pin 24, and pin 24 and ceramic plate 20 are vacuum soldered together.
5O1dOril'IO). After the bottle/cella (9 sets) has cooled, an adhesive layer 22 is applied and covered with a release layer (not shown).

この層は葛根１０に接着ザる前に除去される。This layer is removed before gluing to the root 10.

熱放散器１７１ｉ、ｉ、セラミック板１０の下面を露出
した接着層２２ど）８触さけることによって基板１０１
．：容易に１とるされ、この接盾層は使用づ−るとさは
硬化りる。接着層２２は５ミル（０，１３ｍｍ）の厚さ
で、しラミック廿にの表面の゛ｌ盲ｍの凹凸を？＋Ｉｉ
ｆζｉする。Heat dissipators 171i, i, adhesive layer 22 exposed on the lower surface of ceramic plate 10, etc.) 8 are removed from the substrate 101.
．． : 1 is easily removed, and this shielding layer hardens when used. The adhesive layer 22 has a thickness of 5 mils (0.13 mm) and has a surface roughness of 5 mils (0.13 mm). +Ii
fζi.

肛−１ 電子部品１２からの熱は、セラミック１１０．２０を通
して熱伝導ビン２４に伝達され、熱はピンからそのピン
を通り過ぎる周囲の空気に移される。しラミック板２０
は熱を良く発散さけるので、各ピン２４の温度差は低く
、空気への熱の消散が４．Ｉ効に行４１われる。板２０
ど基板１０は両方ともセラミックであるので、それらの
間には熱応力がない。銅ビン２・１は、ぞれを通り抜け
る空気によく熱を伝達し、空気流の圧力降下も少ない。Heat from the electronic component 12 is transferred through the ceramic 110.20 to the heat transfer bin 24, and the heat is transferred from the pin to the surrounding air flowing past the pin. Lamic board 20
Since the pins 24 dissipate heat well, the temperature difference between each pin 24 is low, and the heat dissipation into the air is 4. 41 will be executed in effect. Board 20
Since both substrates 10 are ceramic, there is no thermal stress between them. The copper bottles 2 and 1 transfer heat well to the air passing through them and have a low pressure drop in the air flow.

ハンダ３２は接６カが強く、それを通過する熱に対づる
熱抵抗も少ない。The solder 32 has a strong bond and has little thermal resistance to heat passing through it.

且立辺差上 本発明の他の実施例が本発明の範囲内て゛可能て゛ある
。例えば、下面の金属化）９体１６がなｔプれば、電子
部品を取りつけたセラミック層の下面にピン２４を直接
取りつけることかぐきる。Additionally, other embodiments of the invention are possible within the scope of the invention. For example, if the lower surface metallization 9 body 16 is removed, the pins 24 can be directly attached to the lower surface of the ceramic layer to which the electronic components are attached.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、電子部品を実装したけラミックＨ，を仮に取
りイ・Ｈノられた本発明による熱敢改菰１１の、一部破
断した斜視［閾である。 第２図ｔよ第１図に示す熱ｔｌｉ故装置の底面図である
。 第３図は、第１図に承り熱放散ＪＩＡ置の一部の、十丁
逆にした線３−３からの縦断面図である。 （符８説明） １０・・・セラミック基板　　　１２・・・電子部品１
４・・・熱放散器　　　　　　１６・・・金属化４休１
８・・・絶縁波ｎ９２０・・・セラミック板２２・・・
接着剤層　　　　　　２４・・・ピ　ン２Ｇ・・・パッ
ド （外５名）FIG. 1 is a partially cutaway perspective view of a heat pump 11 according to the present invention in which a ramic H, on which electronic components are mounted, is temporarily removed. FIG. 2 is a bottom view of the heat treatment apparatus shown in FIG. 1; FIG. 3 is a vertical cross-sectional view taken along line 3--3 of a portion of the heat dissipating JIA device according to FIG. 1, but reversed. (Description of mark 8) 10...Ceramic board 12...Electronic component 1
4...Heat dissipator 16...Metalization 4 Rest 1
8... Insulated wave n920... Ceramic plate 22...
Adhesive layer 24...Pin 2G...Pad (5 people outside)

Claims (6)

【特許請求の範囲】[Claims] （１）電子部品からの熱を受ける第１表面及び第２表面
を有するセラミック板と、 前記セラミック板の第２表面上に取り付けられそこから
伸びる複数の離間して分離される金属性熱伝導素子と、 から構成される電子部品の熱放散装置。(1) a ceramic plate having a first surface and a second surface that receive heat from an electronic component; and a plurality of spaced apart metallic thermally conductive elements mounted on and extending from the second surface of the ceramic plate. A heat dissipation device for electronic components consisting of and. （２）前記熱放散装置が電子部品を取りつけるセラミッ
ク基板に前記第１表面上の接着層で結合される、特許請
求の範囲第１項記載の熱放散装置。(2) The heat dissipation device according to claim 1, wherein the heat dissipation device is bonded to a ceramic substrate on which electronic components are attached by an adhesive layer on the first surface. （３）前記金属性素子が前記第２表面上の金属化パッド
に結合される特許請求の範囲第１項記載の熱放散装置。3. The heat dissipation device of claim 1, wherein the metallic element is bonded to a metallized pad on the second surface. （４）前記金属性素子が銅から成る特許請求の範囲第３
項記載の熱放散装置。(4) Claim 3 in which the metallic element is made of copper
Heat dissipation device as described in section. （５）前記金属化パッドがパラジウム／銀合金から成る
特許請求の範囲第４項記載の熱放散装置。5. The heat dissipation device of claim 4, wherein said metallized pad is comprised of a palladium/silver alloy. （６）前記金属性素子が円形断面を有し、それを通りぬ
ける気体に対し圧力低下を少なくして成る特許請求の範
囲第２項記載の熱放散装置。(6) The heat dissipation device according to claim 2, wherein the metallic element has a circular cross section and reduces the pressure drop for gas passing through it.
JP60213621A 1984-10-11 1985-09-26 Heat dissipation device for electronic components Expired - Lifetime JPH0669119B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65964884A 1984-10-11 1984-10-11
US659648 1984-10-11

Publications (2)

Publication Number Publication Date
JPS6195598A true JPS6195598A (en) 1986-05-14
JPH0669119B2 JPH0669119B2 (en) 1994-08-31

Family

ID=24646223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60213621A Expired - Lifetime JPH0669119B2 (en) 1984-10-11 1985-09-26 Heat dissipation device for electronic components

Country Status (5)

Country Link
JP (1) JPH0669119B2 (en)
CA (1) CA1235528A (en)
DE (1) DE3531729A1 (en)
FR (1) FR2571921B1 (en)
GB (1) GB2165704B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52104371U (en) * 1976-02-03 1977-08-08
JPS56164559U (en) * 1980-05-09 1981-12-07
JPS57120390A (en) * 1981-01-19 1982-07-27 Mitsubishi Electric Corp Ceramic circuit board
JPS5832313U (en) * 1981-08-20 1983-03-02 トキコ株式会社 vehicle height detector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370498A (en) * 1986-09-09 1988-03-30 テラダイン・インコ−ポレ−テッド Combination of ceramic substrate and radiator

Also Published As

Publication number Publication date
FR2571921A1 (en) 1986-04-18
DE3531729A1 (en) 1986-04-17
GB2165704B (en) 1988-05-11
DE3531729C2 (en) 1987-10-29
FR2571921B1 (en) 1989-02-03
GB8524805D0 (en) 1985-11-13
JPH0669119B2 (en) 1994-08-31
GB2165704A (en) 1986-04-16
CA1235528A (en) 1988-04-19

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