GB2198888A - Cooling electronic components - Google Patents

Cooling electronic components Download PDF

Info

Publication number
GB2198888A
GB2198888A GB08629442A GB8629442A GB2198888A GB 2198888 A GB2198888 A GB 2198888A GB 08629442 A GB08629442 A GB 08629442A GB 8629442 A GB8629442 A GB 8629442A GB 2198888 A GB2198888 A GB 2198888A
Authority
GB
United Kingdom
Prior art keywords
tile
heat sink
assembly according
platform
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB08629442A
Other versions
GB8629442D0 (en
Inventor
Alan Raymond Moore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB08629442A priority Critical patent/GB2198888A/en
Publication of GB8629442D0 publication Critical patent/GB8629442D0/en
Publication of GB2198888A publication Critical patent/GB2198888A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An electronic assembly comprises a heat sink P, a ceramic tile T located on the heat sink, a thick film circuit on the upper face of the tile, a semiconductor device D supported on a platform 6 above the tile, and leads 7 connecting the device to the circuit. The platform 6 is in thermal contact with the heat sink P through a supporting stud 5. <IMAGE>

Description

ASSEMBLY OF ELECEONIC COMPONENTS The invention relates to an assembly of electronic components.
There is a need to assemble electronic components incorporating many circuits in such a way that heat generated in use is well dissipated while at the same time the total components do not occupy too much space. This two fold need is especially acute in the case of small assemblies used in automotive vehicles such as ignition system control modules or engine management control modules.
According to one aspect of the invention there is provided a compact assembly of electronic components comprising a heat sink base, a ceramic tile located on the base, the tile having a thick film circuit on its upper face, a semiconductor device supported above the ceramic tile and in thermal contact with the heat sink base, leads extending from the semiconductor device to the thick film circuit.
It is an advantage of toe invention that because the cericonductor device Is above the tile leads may extend from any of three sides of the device to the thick film circuit tracks on the tile, and that such leads may be direct and short.
In one specific embodiment of the invention the semiconductor device is sup? ~ted on the head of a thermally conductive stud which is received a ahole in the base, the hole being located to one side of the ceramic tile so that the semiconductor device is directly above the tile. Such a stud may be connected to the base in a wide variety of ways, e.g.
press fitting, screwing, by adhesive or riveting or the like.
Alternatively, the hole may be omitted and the thermally conductive stud may be ultra sonically welded or otherwise attached to the heat sink base.
In another embodiment of the invention the base includes an upright wall fror one side of which extends a roof to overlie the base. One or more sericond#ctor device may be mounted on the roof.
In order that the invention may be well understood it will now be described, by way of example only, with reference to the accompanying diagrammatic drawings, in which. Figure 1 is a part sectional view of one assembly and Figure 2 is a perspective view of another assembly.
The same reference numerals are used whenever possible in describing the different embodiments of the invention.
The assembly of Figure 1 includes a heat sink platform P on which is mounted a ceramic tile T having thick film circuits thereon. The platform P is made of a thermally conductive material such as copper, which may be gold passivated or plated with silver. Nickel may also be used as the plating material.
The platform P has a vertical wall 1 at one side and the floor is thickened adjacent the wall. A hole 2 is present in the thickened floor portion 3. The lower end 4 of a stud of copper or like thermally conductive material 5 is knurled, and is dimensioned to be received in the hole 2. A flange 6 extends from one side of the top of the stud 5 c that when the stud is received in the hole the flange 6 overlies the tile T. A multicircuit power generating semiconductor device D is mounted on the flange 6 and leads 7 extend from three sides of the device D to the thick film circuits tracks below. Because the components are close together the leads may be short and direct connections can be made.
In the embodiment of Figure 2, the platform has no holes, and the roof is in the form of side extensions 8 from the vertical wall 1. Again, a compact assembly is formed and because of the shape of the platform, wall and roof, heat is readily dissipated from the heat generating components.
The invention is not limited to the embodiments shown. For example, the assembly may be potted in resin, an electrically insulating pad of beryllium may be present between the device and the tile, and the device or tile may sit in a recess in the roof or platform respectively.

Claims (10)

1. An assembly of electronic components comprising a heat sink base, a ceramic tile located on the base, the tile having an electronic circuit on its upper face, a semiconductor device supported on support means present above the ceramic tile and in thermal contact with the heat sink base, leads extending from the semiconductor device to the electronic circuit.
2. An assembly according to Claim 1 characterised in that, the semiconductor device is supported on a platform which at one end is connected to the heat sink base.
3. An assembly according to Claim 2 characterised in that the platform is present at or near the top of a stud which is received in a hole in the heat sink base, and the hole is present at one side of the ceramic tile so that the semiconductor device is directly above the tile.
4. An assembly according to Claim 1 or 2 characterised in that the platform is present at or near the top of a stud which is ultrasonically welded to the heat sink base.
5. An assembly according to Claim 1 or 2 characterised in that the heat sink base and the platform are joined together at one side by a vertical wall.
6. An assembly according to any preceding Claim characterised in that direct and short leads extend from any of three sides of the semiconductor device to the electronic circuit tracks on the tile.
7. An assembly according to any preceding Claim characterised in that the device or tile sit in a recess in the platform of the heat sink base.
8. An assembly according to any preceding Claim characterised in that an electrically insulating pad of beryllium or like is present between the device and the tile.
9. An assembly according to any preceding Claim characterised in that it is potted in resin or like.
10. For use in making an assembly according to any preceding Claim, a heat sink base on which is mounted a ceramic tile, the tile having an electronic circuit on its upper face characterised in that a platform is present above the base to receive a semiconductor device whereby the device may be connected to the circuit by direct and short electrical leads.
GB08629442A 1986-12-09 1986-12-09 Cooling electronic components Pending GB2198888A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08629442A GB2198888A (en) 1986-12-09 1986-12-09 Cooling electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08629442A GB2198888A (en) 1986-12-09 1986-12-09 Cooling electronic components

Publications (2)

Publication Number Publication Date
GB8629442D0 GB8629442D0 (en) 1987-01-21
GB2198888A true GB2198888A (en) 1988-06-22

Family

ID=10608722

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08629442A Pending GB2198888A (en) 1986-12-09 1986-12-09 Cooling electronic components

Country Status (1)

Country Link
GB (1) GB2198888A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0053967A1 (en) * 1980-12-05 1982-06-16 COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII - HONEYWELL BULL (dite CII-HB) Removable cooling device for an integrated-circuit mounting
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
GB2165704A (en) * 1984-10-11 1986-04-16 Teraydne Inc Heat dissipation for electronic components

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0053967A1 (en) * 1980-12-05 1982-06-16 COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII - HONEYWELL BULL (dite CII-HB) Removable cooling device for an integrated-circuit mounting
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
GB2165704A (en) * 1984-10-11 1986-04-16 Teraydne Inc Heat dissipation for electronic components

Also Published As

Publication number Publication date
GB8629442D0 (en) 1987-01-21

Similar Documents

Publication Publication Date Title
US6060772A (en) Power semiconductor module with a plurality of semiconductor chips
KR100544033B1 (en) Microelectronic component with a sandwich design
KR100307465B1 (en) Power module
US5338971A (en) Electronic device structure with studs locating lead frame on backing plate
US5646828A (en) Thin packaging of multi-chip modules with enhanced thermal/power management
US4916575A (en) Multiple circuit board module
US5159537A (en) Mounting structure for electronic apparatus
EP0468475B1 (en) Power semiconductor device suitable for automation of production
KR100488433B1 (en) Device for fixing a heat distribution cover on a printed circuit board
KR940002993A (en) Pad Array Semiconductor Device with Thermal Conductor and Manufacturing Method Thereof
US7123480B1 (en) Package structure for a semiconductor device
EP1345265B1 (en) Electronics assembly with improved heatsink configuration
KR960012455A (en) Multi-Chip Ceramic Modules Mount Electronic Components Connected to the Board and Cap Through the Connection Pins
US6741480B2 (en) Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
US4488167A (en) Current converter assembly in a flat housing
US6011692A (en) Chip supporting element
GB2198888A (en) Cooling electronic components
US6905361B2 (en) Electrical device
US20030110627A1 (en) Substrate for receiving a circuit configuration and method for producing the substrate
US5260602A (en) Hybrid integrated-circuit device having an asymmetrical thermal dissipator
JPS6231888Y2 (en)
JPH0727779B2 (en) Power module mounting board
JPH0497554A (en) High heat dissipation type semiconductor package
JPH03256351A (en) Semiconductor device
JPH08204293A (en) Board structure for electronic parts