GB2165704A - Heat dissipation for electronic components - Google Patents
Heat dissipation for electronic components Download PDFInfo
- Publication number
- GB2165704A GB2165704A GB8524805A GB8524805A GB2165704A GB 2165704 A GB2165704 A GB 2165704A GB 8524805 A GB8524805 A GB 8524805A GB 8524805 A GB8524805 A GB 8524805A GB 2165704 A GB2165704 A GB 2165704A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electronic components
- dissipator
- heat
- ceramic plate
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 5
- 239000000919 ceramic Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims 1
- 229910001252 Pd alloy Inorganic materials 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation for electronic components 12 comprises a ceramic plate 20 having a first surface for receiving heat from the electronic components and a plurality of separate, spaced metallic, heat- conducting elements 24 mounted on and extending from a second surface of the ceramic plate 20. The electronic components may be mounted directly on the first surface of the ceramic plate 20 or on a ceramic substrate 10 which is secured by adhesive 22 to the ceramic plate 20. <IMAGE>
Description
SPECIFICATION
Heat dissipation for electronic components on ceramic substrate
The invention relates to dissipating heat from electronic components on a ceramic substrate.
Electronic components can be mounted on a ceramic substrate and electrically connected to each other through metallized conductors carried by the substrate. Lee U.S. Patent No.
4,292,647 discloses a semiconductor package including a plurality of electronic chips mounted on a ceramic substrate and provided with individual heat conductive elements mounted directly above them.
We have discovered that heat can be very effectively dissipated from electronic components through the use of a ceramic plate that receives heat from the components at one surface and has a plurality of separate, spaced metallic heat-conducting elements mounted on and extending from the other surface of the plate.
In a preferred embodiment the ceramic plate on which the metallic elements are mounted is separate from a ceramic substrate on which the electronic components are mounted; the ceramic plate carrying the metallic elements includes adhesive for adhering it to the ceramic substrate carrying the electronic components; the metallic elements are cylindrical copper pins; and the pins are connected to the ceramic plate via solder and metallic pads deposited on the ceramic plate.
Because both plates are made of ceramic, there are no thermal stresses between them.
Also, the ceramic plate diffuses heat well, making the difference in temperature among the various pins low and promoting efficient heat dissipation. Finally, the copper pins provide good heat transfer to and low pressure drop in air passing next to them, and the solder provides good bond strength and little thermal resistance to heat passing through it.
In another preferred embodiment, the ceramic plate supporting the metallic heat-conducting elements on one surface also supports the electronic components on its other surface.
There is now described the structure, manufacture and operation of the presently preferred embodiment of the invention with reference to the drawings in which:
Figure 1 is a diagrammatic perspective view, partially broken away, of a heat dissipator shown attached to a ceramic substrate carrying electronic components according to the invention.
Figure 2 bottom plan view of the Fig. 1 dissipator.
Figure 3 is a vertical sectional view, taken at 3-3 of Fig. 1 and upside-down with respect to Fig. 1 of a portion of the Fig. 1 dissipator.
Referring to Fig. 1, there is shown ceramic substrate 10, which carries electronic components 12 on its upper surface and is secured to heat dissipator 14 at its lower surface.
Electronic components 12 are electrically connected to each other by metallization 16 on the upper and lower surfaces of ceramic plate 10, and the upper surface of plate 10 also carries insulating coating 18 over metallization 16. Dissipator 14 includes ceramic plate 20 (95% pure alumina), thermosetting adhesive layer 22 0.127mm (5 mil) thick and available from 3M under the YN469 or YN568 trade designations] and metallic heat-conducting pins 24 on its lower surface.
Referring to Fig. 2, the arrangement of pins 24 on the lower surface of plate 20 is shown.
Pins 24 are mounted on 3.175 mmX3.175 mm (0.125X0.125 inch square) palladium/silver vacuum deposited pads 26, which are spaced from each other by 3.39 mm (0.094 inch) in the width direction and 2.74 mm (0.108 inch) in the length direction. Referring to Fig. 3, pins 24 are approximately 2.54 mm (0.1 inch) in diameter and 6.35 mm (1/4 inch) long and include copper core 28 and tin coating 30. Pins 24 are attached to pads 26 by solder 32.
Heat dissipator 14 is made by securing pins 24 in a jig providing them with the proper arrangement and applying solder paste to the exposed ends of pins 24. Ceramic plate 20 with pads 26 thereon is placed on the exposed ends of pins 24, and pins 24 and ceramic plate 20 are joined to each other by vapor soldering. After the pin/ceramic assembly has cooled, adhesive layer 22 is applied, and this is covered with a release layer (not shown), which is removed prior to adhering to substrate 10. Heat dissipator 14 is easily adhered to substrate 10 by bringing the lower surface of ceramic plate 10 in contact with exposed adhesive layer 22, which cures in use. Adhesive layer 22 is 0.127 mm (5 mils) thich to compensate for irregularities in the planarity of the ceramic plate surfaces.
In operation, heat from electronic components 12 is conducted through ceramic layers 10, 20 to heat-conducting pins 24, from which the heat is transferred to the surrounding air flowing past them. Because ceramic plate 20 diffuses heat well, the difference in temperature among various pins 24 is low, and heat dissipation to the air is efficient. Because plate 20 and ceramic plate 10 are both ceramic, there are no thermal stresses between them. Copper pins 24 provide good heat transfer to and low pressure drop in air flowing past them. Solder 32 provides good bond strength and little thermal resistance to heat passing through it.
Other embodiments of the invention are within the scope of the following claims. For example, pins 24 can be provided directly on the bottom of the ceramic layer that carries the electronic components if there is no metallization 16 on the bottom surface.
Claims (9)
1. A heat dissipator for electronic components comprising:
a ceramic plate having a first surface for receiving heat from said electronic components and a second surface, and
a plurality of separate, spaced metallic, heatconducting elements mounted on and extending from said second surface of said ceramic plate.
2. The dissipator of claim 1 further comprising a layer of adhesive on said first surface for connecting said heat dissipator to a ceramic substrate carrying electronic components.
3. The dissipator of claim 1 or 2 wherein said metallic elements are soldered to metallized pads on said second surface.
4. The dissipator of claim 3 wherein said metallic elements are made of copper.
5. The dissipator of claim 3 or 4 wherein said metallic pads are made of a palladium/silver alloy.
6. The dissipator of any one of claims 1-5 wherein said pins have a circular cross-section to provide a low pressure drop to gases flowing past them.
7. The combination of the heat dissipator of any one of claims 2-6 and a ceramic substrate carrying electronic components on one surface adhered to said layer of adhesive.
8. The combination of the heat dissipator of claim 1 and electronic components mounted directly on said first surface of said ceramic plate.
9. A heat dissipator for electronic components substantially as herein described with reference to the drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65964884A | 1984-10-11 | 1984-10-11 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8524805D0 GB8524805D0 (en) | 1985-11-13 |
| GB2165704A true GB2165704A (en) | 1986-04-16 |
| GB2165704B GB2165704B (en) | 1988-05-11 |
Family
ID=24646223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8524805A Expired GB2165704B (en) | 1984-10-11 | 1985-10-08 | Heat dissipation for electronic components |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH0669119B2 (en) |
| CA (1) | CA1235528A (en) |
| DE (1) | DE3531729A1 (en) |
| FR (1) | FR2571921B1 (en) |
| GB (1) | GB2165704B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2603740A1 (en) * | 1986-09-09 | 1988-03-11 | Teradyne Inc | COMBINATION OF A CERAMIC SUBSTRATE SUPPORTING ELECTRONIC COMPONENTS AND A HEAT SINK THEREFOR |
| GB2198888A (en) * | 1986-12-09 | 1988-06-22 | Lucas Ind Plc | Cooling electronic components |
| EP0542478A1 (en) * | 1991-11-12 | 1993-05-19 | AT&T Corp. | Pin fin heat sink including flow enhancement |
| WO1996013142A1 (en) * | 1994-10-24 | 1996-05-02 | Siemens Aktiengesellschaft | Cooler for electrical subassemblies |
| EP2849545A3 (en) * | 2013-09-17 | 2015-05-06 | Samsung Electronics Co., Ltd | Portable electronic device and battery pack for the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3822890A1 (en) * | 1988-03-15 | 1989-09-28 | Siemens Ag | Cooling arrangement for an optical character generator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0046605A2 (en) * | 1980-08-23 | 1982-03-03 | BBC Aktiengesellschaft Brown, Boveri & Cie. | Arrangement for potential-independent heat dissipation |
| EP0127115A2 (en) * | 1983-05-25 | 1984-12-05 | International Business Machines Corporation | Heat sink structure for an electronic package |
| EP0135120A1 (en) * | 1983-08-23 | 1985-03-27 | BBC Brown Boveri AG | Ceramic-metallic element |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2137001A1 (en) * | 1971-05-11 | 1972-12-29 | Thomson Csf | |
| JPS5647962Y2 (en) * | 1976-02-03 | 1981-11-10 | ||
| US4034469A (en) * | 1976-09-03 | 1977-07-12 | Ibm Corporation | Method of making conduction-cooled circuit package |
| DE7821509U1 (en) * | 1978-07-18 | 1978-10-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Cooling device for LSI wafers |
| US4292647A (en) * | 1979-04-06 | 1981-09-29 | Amdahl Corporation | Semiconductor package and electronic array having improved heat dissipation |
| JPS56164559U (en) * | 1980-05-09 | 1981-12-07 | ||
| FR2495838A1 (en) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | REMOVABLE COOLING DEVICE FOR INTEGRATED CIRCUIT CARRIERS |
| JPS57120390A (en) * | 1981-01-19 | 1982-07-27 | Mitsubishi Electric Corp | Ceramic circuit board |
| JPS5832313U (en) * | 1981-08-20 | 1983-03-02 | トキコ株式会社 | vehicle height detector |
| US4541004A (en) * | 1982-11-24 | 1985-09-10 | Burroughs Corporation | Aerodynamically enhanced heat sink |
-
1985
- 1985-08-19 CA CA000489001A patent/CA1235528A/en not_active Expired
- 1985-09-05 DE DE19853531729 patent/DE3531729A1/en active Granted
- 1985-09-26 JP JP60213621A patent/JPH0669119B2/en not_active Expired - Lifetime
- 1985-10-08 GB GB8524805A patent/GB2165704B/en not_active Expired
- 1985-10-11 FR FR8515123A patent/FR2571921B1/en not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0046605A2 (en) * | 1980-08-23 | 1982-03-03 | BBC Aktiengesellschaft Brown, Boveri & Cie. | Arrangement for potential-independent heat dissipation |
| EP0127115A2 (en) * | 1983-05-25 | 1984-12-05 | International Business Machines Corporation | Heat sink structure for an electronic package |
| EP0135120A1 (en) * | 1983-08-23 | 1985-03-27 | BBC Brown Boveri AG | Ceramic-metallic element |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2603740A1 (en) * | 1986-09-09 | 1988-03-11 | Teradyne Inc | COMBINATION OF A CERAMIC SUBSTRATE SUPPORTING ELECTRONIC COMPONENTS AND A HEAT SINK THEREFOR |
| GB2195056A (en) * | 1986-09-09 | 1988-03-23 | Teradyne Inc | Heat dissipation for electronic components |
| GB2195056B (en) * | 1986-09-09 | 1990-01-10 | Teradyne Inc | Heat dissipation for electronic components |
| GB2198888A (en) * | 1986-12-09 | 1988-06-22 | Lucas Ind Plc | Cooling electronic components |
| EP0542478A1 (en) * | 1991-11-12 | 1993-05-19 | AT&T Corp. | Pin fin heat sink including flow enhancement |
| WO1996013142A1 (en) * | 1994-10-24 | 1996-05-02 | Siemens Aktiengesellschaft | Cooler for electrical subassemblies |
| US5901036A (en) * | 1994-10-24 | 1999-05-04 | Siemens Aktiengesellschaft | Cooling device for electrical assemblies |
| EP2849545A3 (en) * | 2013-09-17 | 2015-05-06 | Samsung Electronics Co., Ltd | Portable electronic device and battery pack for the same |
| US9609787B2 (en) | 2013-09-17 | 2017-03-28 | Samsung Electronics Co., Ltd. | Portable electronic device and battery pack for the same |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2571921A1 (en) | 1986-04-18 |
| GB2165704B (en) | 1988-05-11 |
| JPS6195598A (en) | 1986-05-14 |
| CA1235528A (en) | 1988-04-19 |
| DE3531729A1 (en) | 1986-04-17 |
| JPH0669119B2 (en) | 1994-08-31 |
| FR2571921B1 (en) | 1989-02-03 |
| GB8524805D0 (en) | 1985-11-13 |
| DE3531729C2 (en) | 1987-10-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19951008 |