GB8524805D0 - Heat dissipation for electronic components - Google Patents
Heat dissipation for electronic componentsInfo
- Publication number
- GB8524805D0 GB8524805D0 GB8524805A GB8524805A GB8524805D0 GB 8524805 D0 GB8524805 D0 GB 8524805D0 GB 8524805 A GB8524805 A GB 8524805A GB 8524805 A GB8524805 A GB 8524805A GB 8524805 D0 GB8524805 D0 GB 8524805D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat dissipation
- electronic components
- electronic
- components
- dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65964884A | 1984-10-11 | 1984-10-11 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8524805D0 true GB8524805D0 (en) | 1985-11-13 |
GB2165704A GB2165704A (en) | 1986-04-16 |
GB2165704B GB2165704B (en) | 1988-05-11 |
Family
ID=24646223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8524805A Expired GB2165704B (en) | 1984-10-11 | 1985-10-08 | Heat dissipation for electronic components |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH0669119B2 (en) |
CA (1) | CA1235528A (en) |
DE (1) | DE3531729A1 (en) |
FR (1) | FR2571921B1 (en) |
GB (1) | GB2165704B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4682269A (en) * | 1984-10-11 | 1987-07-21 | Teradyne, Inc. | Heat dissipation for electronic components on a ceramic substrate |
GB2198888A (en) * | 1986-12-09 | 1988-06-22 | Lucas Ind Plc | Cooling electronic components |
DE3822890A1 (en) * | 1988-03-15 | 1989-09-28 | Siemens Ag | Cooling arrangement for an optical character generator |
US5158136A (en) * | 1991-11-12 | 1992-10-27 | At&T Laboratories | Pin fin heat sink including flow enhancement |
DE4437971C2 (en) * | 1994-10-24 | 1997-09-11 | Siemens Ag | Cooling device for electrical assemblies |
KR20150031818A (en) * | 2013-09-17 | 2015-03-25 | 삼성전자주식회사 | Portable electronic device capable of decreasing heat temperature |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2137001A1 (en) * | 1971-05-11 | 1972-12-29 | Thomson Csf | |
JPS5647962Y2 (en) * | 1976-02-03 | 1981-11-10 | ||
US4034469A (en) * | 1976-09-03 | 1977-07-12 | Ibm Corporation | Method of making conduction-cooled circuit package |
DE7821509U1 (en) * | 1978-07-18 | 1978-10-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Cooling device for LSI wafers |
US4292647A (en) * | 1979-04-06 | 1981-09-29 | Amdahl Corporation | Semiconductor package and electronic array having improved heat dissipation |
JPS56164559U (en) * | 1980-05-09 | 1981-12-07 | ||
DE3031912A1 (en) * | 1980-08-23 | 1982-04-01 | Brown, Boveri & Cie Ag, 6800 Mannheim | ARRANGEMENT FOR POTENTIAL-INDEPENDENT HEAT EXHAUST |
FR2495838A1 (en) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | REMOVABLE COOLING DEVICE FOR INTEGRATED CIRCUIT CARRIERS |
JPS57120390A (en) * | 1981-01-19 | 1982-07-27 | Mitsubishi Electric Corp | Ceramic circuit board |
JPS5832313U (en) * | 1981-08-20 | 1983-03-02 | トキコ株式会社 | vehicle height detector |
US4541004A (en) * | 1982-11-24 | 1985-09-10 | Burroughs Corporation | Aerodynamically enhanced heat sink |
US4546405A (en) * | 1983-05-25 | 1985-10-08 | International Business Machines Corporation | Heat sink for electronic package |
DE3469827D1 (en) * | 1983-08-23 | 1988-04-14 | Bbc Brown Boveri & Cie | Ceramic-metallic element |
-
1985
- 1985-08-19 CA CA000489001A patent/CA1235528A/en not_active Expired
- 1985-09-05 DE DE19853531729 patent/DE3531729A1/en active Granted
- 1985-09-26 JP JP60213621A patent/JPH0669119B2/en not_active Expired - Lifetime
- 1985-10-08 GB GB8524805A patent/GB2165704B/en not_active Expired
- 1985-10-11 FR FR8515123A patent/FR2571921B1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE3531729A1 (en) | 1986-04-17 |
GB2165704B (en) | 1988-05-11 |
JPS6195598A (en) | 1986-05-14 |
GB2165704A (en) | 1986-04-16 |
FR2571921B1 (en) | 1989-02-03 |
JPH0669119B2 (en) | 1994-08-31 |
CA1235528A (en) | 1988-04-19 |
DE3531729C2 (en) | 1987-10-29 |
FR2571921A1 (en) | 1986-04-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19951008 |