FR2137001A1 - - Google Patents
Info
- Publication number
- FR2137001A1 FR2137001A1 FR7116971A FR7116971A FR2137001A1 FR 2137001 A1 FR2137001 A1 FR 2137001A1 FR 7116971 A FR7116971 A FR 7116971A FR 7116971 A FR7116971 A FR 7116971A FR 2137001 A1 FR2137001 A1 FR 2137001A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7116971A FR2137001A1 (en) | 1971-05-11 | 1971-05-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7116971A FR2137001A1 (en) | 1971-05-11 | 1971-05-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2137001A1 true FR2137001A1 (en) | 1972-12-29 |
Family
ID=9076821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7116971A Withdrawn FR2137001A1 (en) | 1971-05-11 | 1971-05-11 |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2137001A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2524247A1 (en) * | 1982-03-23 | 1983-09-30 | Thomson Csf | METHOD FOR MANUFACTURING PRINTED CIRCUITS WITH INDIVIDUAL CONDUCTIVE RIGID METAL SUPPORT |
FR2571921A1 (en) * | 1984-10-11 | 1986-04-18 | Teradyne Inc | HEAT DISSIPATOR FOR ELECTRONIC COMPONENTS WITH CERAMIC SUBSTRATE |
EP0368133A2 (en) * | 1988-11-05 | 1990-05-16 | Semikron Elektronik Gmbh | Support body for the electrically insulated arrangement of components |
-
1971
- 1971-05-11 FR FR7116971A patent/FR2137001A1/fr not_active Withdrawn
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2524247A1 (en) * | 1982-03-23 | 1983-09-30 | Thomson Csf | METHOD FOR MANUFACTURING PRINTED CIRCUITS WITH INDIVIDUAL CONDUCTIVE RIGID METAL SUPPORT |
EP0090696A1 (en) * | 1982-03-23 | 1983-10-05 | Thomson-Csf | Process for making printed circuit boards with a conductive rigid individual metallic support |
US4616413A (en) * | 1982-03-23 | 1986-10-14 | Thomson-Csf | Process for manufacturing printed circuits with an individual rigid conductive metallic support |
FR2571921A1 (en) * | 1984-10-11 | 1986-04-18 | Teradyne Inc | HEAT DISSIPATOR FOR ELECTRONIC COMPONENTS WITH CERAMIC SUBSTRATE |
EP0368133A2 (en) * | 1988-11-05 | 1990-05-16 | Semikron Elektronik Gmbh | Support body for the electrically insulated arrangement of components |
EP0368133A3 (en) * | 1988-11-05 | 1990-11-22 | Semikron Elektronik Gmbh | Support body for the electrically insulated arrangement of components |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |