FR2571546B1 - COOLING BLOCK FOR ELECTRONIC COMPONENTS AND / OR DEVICES - Google Patents

COOLING BLOCK FOR ELECTRONIC COMPONENTS AND / OR DEVICES

Info

Publication number
FR2571546B1
FR2571546B1 FR8514782A FR8514782A FR2571546B1 FR 2571546 B1 FR2571546 B1 FR 2571546B1 FR 8514782 A FR8514782 A FR 8514782A FR 8514782 A FR8514782 A FR 8514782A FR 2571546 B1 FR2571546 B1 FR 2571546B1
Authority
FR
France
Prior art keywords
devices
electronic components
cooling block
cooling
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8514782A
Other languages
French (fr)
Other versions
FR2571546A1 (en
Inventor
Franz Werner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nixdorf Computer AG
Original Assignee
Nixdorf Computer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nixdorf Computer AG filed Critical Nixdorf Computer AG
Publication of FR2571546A1 publication Critical patent/FR2571546A1/en
Application granted granted Critical
Publication of FR2571546B1 publication Critical patent/FR2571546B1/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8514782A 1984-10-08 1985-10-04 COOLING BLOCK FOR ELECTRONIC COMPONENTS AND / OR DEVICES Expired FR2571546B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19848429523 DE8429523U1 (en) 1984-10-08 1984-10-08 Heat sinks for electronic components and / or devices

Publications (2)

Publication Number Publication Date
FR2571546A1 FR2571546A1 (en) 1986-04-11
FR2571546B1 true FR2571546B1 (en) 1988-10-14

Family

ID=6771476

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8514782A Expired FR2571546B1 (en) 1984-10-08 1985-10-04 COOLING BLOCK FOR ELECTRONIC COMPONENTS AND / OR DEVICES

Country Status (3)

Country Link
DE (1) DE8429523U1 (en)
FR (1) FR2571546B1 (en)
GB (1) GB2167905B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446198C2 (en) * 1984-12-18 1996-06-05 Siemens Ag Method for producing a composite body from thin-walled elements and a supporting body
DE3518310A1 (en) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
JP3122173B2 (en) * 1990-11-09 2001-01-09 株式会社東芝 Heatsink, heatsink, and method of manufacturing heatsink
GB2256531A (en) * 1991-05-28 1992-12-09 Greenfields Europ Limited Heatsinking of electrical fittings
US5239163A (en) * 1991-06-19 1993-08-24 Texas Instruments Incorporated Automobile air heater utilizing PTC tablets adhesively fixed to tubular heat sinks
GB9301049D0 (en) * 1993-01-20 1993-03-10 The Technology Partnership Plc Mounting assembly
DE4314663A1 (en) * 1993-05-04 1994-11-10 Alusuisse Lonza Services Ag Heatsinks for semiconductor devices
TW265430B (en) * 1994-06-30 1995-12-11 Intel Corp Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
DE4445849A1 (en) * 1994-12-22 1996-06-27 Sel Alcatel Ag Device for dissipating heat from an electronic component
DE29602367U1 (en) * 1995-03-24 1996-05-15 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Heat sink for semiconductor components or the like.
EP0956587A2 (en) * 1996-01-27 1999-11-17 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
FI112585B (en) * 1996-03-13 2003-12-15 Nokia Alumiini Oy Heat sink
DE19628548A1 (en) * 1996-07-16 1998-01-22 Abb Patent Gmbh Heat sink profile for air cooling device for semiconductor components
US5829514A (en) * 1997-10-29 1998-11-03 Eastman Kodak Company Bonded cast, pin-finned heat sink and method of manufacture
US6009938A (en) * 1997-12-11 2000-01-04 Eastman Kodak Company Extruded, tiered high fin density heat sinks and method of manufacture
DE10065470B4 (en) * 2000-12-28 2011-02-17 Aleris Aluminum Vogt Gmbh Method for producing a cooling element for electrical, in particular electronic, components
DE10222471A1 (en) * 2002-05-22 2003-12-18 Lenze Drive Systems Gmbh Cooler for frequency converter of speed controllable AC motor for waste heat convection of converter components, with braking resistance incorporated integrally in extruded cooler
DE102005007041A1 (en) * 2005-02-15 2006-08-17 Alcan Technology & Management Ag Heat sink for semiconductor devices or the like. Facilities and method for its preparation
CN100590377C (en) * 2005-02-18 2010-02-17 阳傑科技股份有限公司 Heat pipe cooling system and its heat transfer connector
KR101287755B1 (en) * 2010-11-22 2013-07-18 삼성전기주식회사 Heat sink

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3081824A (en) * 1960-09-19 1963-03-19 Behlman Engineering Company Mounting unit for electrical components
US3313340A (en) * 1965-03-23 1967-04-11 Lambda Electronics Corp Heat exchanger
FR1499462A (en) * 1966-09-16 1967-10-27 Const Aero Navales Method of manufacturing a heat exchanger between two fluids and heat exchanger by applying
DE2013539A1 (en) * 1970-03-20 1971-10-07 Siemens Ag Heat conducting bodies for dissipating the operating temperature from the interior of a house
JPS5993191A (en) * 1982-11-18 1984-05-29 Toshiba Corp Heat exchanger

Also Published As

Publication number Publication date
GB2167905A (en) 1986-06-04
FR2571546A1 (en) 1986-04-11
DE8429523U1 (en) 1984-11-29
GB2167905B (en) 1988-04-20
GB8524344D0 (en) 1985-11-06

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Legal Events

Date Code Title Description
CD Change of name or company name
ST Notification of lapse