GB2167905A - Heat sink for electronic components and/or equipment - Google Patents
Heat sink for electronic components and/or equipment Download PDFInfo
- Publication number
- GB2167905A GB2167905A GB8524344A GB8524344A GB2167905A GB 2167905 A GB2167905 A GB 2167905A GB 8524344 A GB8524344 A GB 8524344A GB 8524344 A GB8524344 A GB 8524344A GB 2167905 A GB2167905 A GB 2167905A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cooling fins
- heat sink
- basic element
- cooling
- sink according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat sink (20) for electronic components and/or equipment is composed of a pair of basic elements (22,24) which have cooling fins (26,30) projecting from them and which face one another in a staggered arrangement such that the cooling fins (26) of one basic element (22) project into the spaces (28) between the cooling fins (30) of the other basic element (24). <IMAGE>
Description
SPECIFICATION
Heat sink for electronic components and/or equipment
This invention relates to a heat sink for electronic components and/or equipment.
Because the power of electronic components and/or equipment and, thus, also the generation of heat therein increase constantly despite their external dimensions being reduced, heat sinks, having a greater cooling capacity and the same external dimensions or having an unchanged cooling capacity and a lower space requirement, are needed. However, an increase in cooling capacity is only possible if the surface of the heat sink can be enlarged within the preset external dimensions, which is only possible by increasing the number of fins while reducing the fin spacing.
However, this is impossible beyond the currently known extent in the conventional economic methods of manufacturing heat sinks of this type.
If the heat sink is produced, for example, in the form of a cast section, it is impossible to fall below a specific ratio of cooling fin spacing to cooling fin height, which ratio is conditional upon the structure of the mould and the casting technique applied in each case. If it was hitherto desired to manufacture heat sinks with a smaller ratio of cooling fin spacing/cooling fin height, the spaces between the cooling fins had to be milled out of a right parallelepiped-shaped cast part. This method of manufacturing heat sinks is highly time-and cost intensive and therefore unsuitable for industrial scale manufacture.
Also, when heat sinks are produced in the form of sheet-punched parts, the ratio of cooling fin spacing/cooling fin height cannot be reduced beyond the currently known measure since a further reduction in the size of the press tools is impossible because of the forces which occur during the punching operation.
The invention therefore seeks to provide an economical method of distinctly increasing the cooling capacity of a heat sink while the same external dimensions are retained or of distinctly reducing the external dimensions of a heat sink while retaining the same cooling capacity.
According to the invention there is provided a heat sink for electronic components and/or equipment comprising a pair of basic elements lying opposite one another in a staggered arrangement such that cooling fins projecting from one basic element project into spaces between cooling fins of the other basic element.
The achievement of the invention is that, to increase the cooling capacity of a heat sink having preset external dimensions, the average spacing between cooling fins is distinctly reduced in a simple manner because of the cooling fins of one basic element project into the spaces between the cooling fins of the other basic element. This has the advantage that the basic elements can furthermore be produced in accordance with hitherto conventional economic methods of manufacturing heat sinks. The basic elements which are manufactured in this manner need only to be assembled in pairs and joined together to form a heat sink according to the invention.
The joining of the basic elements can be effected, for example, by clamping, bolting, bonding or by a separate clamp or how which holds the basic elements together. The invention thus enables economical industrial scale manufacture of heat sinks having a cooling capacity which clearly exceeds hitherto achievable values in relation to the external dimensions.
The heat sink according to the invention may consist of, for example, two plates which are arranged parallel to one another and form the basic elements and on the sides of which, facing one another, the cooling fins are arranged, the cooling fins of one plate projecting into the spaces between the cooling fins of the other plate.
The heat sinks according to the invention may alternatively be composed of two concentric cylinders acting as basic elements. In this case the cooling fins, which are arranged radially on the circumference of the smaller cylinder, project into the spaces between the cooling fins arranged on the inner face of the larger cylinder.
In a further development of the invention the heat sink may consist of two similar basic elements. This results in the advantage that only one production tool, for example a single casting mould or a single press tool, is required to manufacture both basic elements.
In a further preferred development of the invention all the cooling fins are essentially the same in height. In addition, in each basic element between the cooling fins there is arranged a groove which lies parallel to these cooling fins and the width of which is approximately equal to the thickness of the cooling fins of each other basic element, on the free edges of these fins. This has the advantage that, when each heat sink is composed of a pair of basic elements lying opposite one another in a staggered arrangement, the cooling fins of one basic element lie with their free edges in the grooves of the other basic element whereby a good heat transmission between one basic element and the cooling fins of the other basic element in each case is ensured.
If, in the previously described form of heat sink, the grooves are tapered as the groove depth increases, the two basic elements can be clamped together when the thickness of the cooling fins on their free edges is greater than the width of the grooves at their deepest points whereby the free edges of the fins grip in the grooves. This heat sink design has the advantage that a particularly good heat transmission is ensured at the clamp engagement between the cooling fins and the side walls of the grooves. Moreover, with this arrangement it is possible to dispense with a separate connection of the two basic elements.
If the grooves are arranged centrally between the cooling fins, then all the fin spacings of the entire heat sink are equal so that all the cooling fins are supplied uniformly with cooling air.
If a specific direction of cooling air flow against the heat sink is not established, for example, if the free movement of air is used for cooling, the heat sink should be designed so as to enable air to flow through it from all directions, if possible. This is achieved in a further development of the invention in that the cooling fins have openings whereby the flow of cooling air through the heat sink can, apart from the longitudinal direction of the cooling fins, be effected at least also at right angles to the cooling fins.
The openings can in this case be arranged coincidentally one behind another at right angles to the cooling fins, whereby a particularly efficient flow of air through the heat sink at right angles to the cooling fins is ensured.
If the openings of adjacent cooling fins are in a staggered arrangement relative to one another, a good swirling action of the cooling air is created inside the heat sink.
The invention will now be described by way of example with the aid of two embodiments of a basic element for forming a heat sink and three embodiments of a heat sink according to the invention. In the drawings:
Figure 1 shows a plate-shaped basic element with cooling fins projecting from it,
Figure 2 shows the basic element of Fig. 1 in which, unlike Fig. 1, the cooling fins have openings or recesses,
Figure 3 shows a heat sink composed of two basic elements shown in Fig. 1,
Figure 4 shows a cross-section of a heat sink which is composed of two sheet metal punched parts of identical construction, and
Figure 5 shows a cross-section of a heat sink which is composed of two concentric cylinders provided with cooling fins.
A plate-shaped basic element 10, which is manufactured by the casting process and which has cooling fins 12 projecting from it, is shown in Fig. 1. These cooling fins have a rectangular design and are all the same in height. Grooves 14 are arranged centrally between the cooling fins 12 in the basic element 10. These grooves lie parallel to the cooling fins 12 and taper slightly as the groove depth increases. Their width is approximately equal to the thickness of the cooling fins 12, on the free fin edges 13.
The basic element 10 shown in Fig. 1 is particularly suitable for forming heat sinks 20 (Fig. 3) which are subjected to a stream of cooling air from a specific direction. The basic element 10 must then be arranged in the air stream in such a manner that the cooling fins 12 extend in the direction of air flow to ensure that the greatest possible quantity of cooling air can flow between the cooling fins 12.
Aluminium is particularly suitable as a material for the basic element because it is a good conductor of heat and, moreover, can also be easily processed as a casting material.
Both the injection moulding and continuous casting methods can, for example, be used advantageously as the shaping technique.
Basic elements of this type can also be punched out of sheet metal, as will also be shown with the aid of Fig. 4.
The basic element 15 shown in Fig. 2 differs from that shown in Fig. 1 only in that the cooling fins 16 are provided with recesses 18 which start from the free fin edges 17 and extend over almost the entire height of the cooling fins 16. In this type of basic element three recesses 18 are provided in each cooling fin 12, the recesses 18 of adjacent cooling fins 16 being arranged coincidentally one behind another.
The type of basic element 15, which is provided with recesses 18 in the cooling fins 16, is particularly suitable for forming heat sinks of this type (not shown) in which the free movement of air is used for cooling. Because there is no prevailing direction of air flow in this case, air must be able to flow through the heat sink from all directions, if possible. In a heat sink composed of basic elements 15, this is at least partially achieved in that a flow of cooling air through the heat sink can, apart from in the longitudinal direction of the cooling fins, also be effected at right angles to the cooling fins 16.
The basic element 15 shown in Fig. 2 can be manufactured advantageously from aluminium in a single operation by the injection moulding process. If the continuous casting method is used as the shaping technique, the recesses 18 must be milled out of the cooling fins 16 in a further operation.
Fig. 3 shows a heat sink 20 which is composed of a first basic element 22 and a second basic element 24. These elements are identical in construction to the basic element 10 shown in Fig. 1. The two basic elements 22 and 24 face one another in a staggered arrangement such that the cooling fins 26 of the first basic element 22 project into the spaces 28 between the cooling fins 30 of the second basic element 24. Both the basic element 22 and the basic element 24 are provided with grooves 34 and 36, respectively, which are arranged centrally between the cool ing fins 26 and 30, respectively. The grooves 34 in the basic element 22 have a width approximately equal to the thickness of the cooling fins 30 of the basic element 24, on the free fin edges 38.Similarly, the width of the grooves 36 of the basic element 24 is approximately equal to the thickness of the cooling fins 26 of the basic element 22, on the free fin edges 40. As can be seen from the
Figure, the cooling fins 26 of the first basic element 22 have the same height as the cooling fins 30 of the second basic element 24.
This makes it possible for both the cooling fins 26 of the basic element 22 and the cooling fins 30 of the basic element 24 to project into the grooves 36 and 34, respectively, of the other basic element 24, 22 so that an altogether stable heat sink design is obtained by clamping the two basic elements 22 and 24 together. However, as an alternative to clamping, the basic elements 22 and 24 can also be, for example, bolted together, bonded or held together by a clip (not shown).
On its outer sides the heat sink 20 can be provided with anchoring elements, for example clips or bores (not shown) for securing the electronic components or equipment which are to be cooled.
Fig. 4 shows, in cross-section, a heat sink 50 which is composed of two basic elements 52 and 54 in the form of sheet metal punched parts. Similarly to the heat sink 20 of
Fig. 3, this heat sink 50 is also composed of two basic elements 52 and 54 of identical construction which face one another in a staggered arrangement such that the cooling fins 56 of one basic element 52 project into the spaces 58 between the cooling fins 60 of the other basic element 54. Respective grooves 62, 64, which run parallel to the cooling fins 56 and 60, are provided centrally between the cooling fins 56 and 60 of the two basic elements 52 and 54.Since all the cooling fins 56 and 60 are the same in height, the cooling fins 56 of the basic element 52 project into the grooves 64 of the basic element 54 and, vice versa, the cooling fins 60 of the basic element 54 project into the grooves 62 of the basic element 52 whereby a good heat exchange between the basic elements 52 and 54 is ensured. The two basic elements 52 and 54 can, for example, be bonded together to form an altogether rigid construction to which it is possible to attach an electronic component or piece of equipment (not shown) which is to be cooled.
The arrangement of the basic elements 52 and 54 relative to one another in accordance with the innovation makes it possible for the average cooling fin spacing of the entire heat sink 50 to be distinctly reduced in comparison with that of each individual basic element 52 or 54, whereby the cooling capacity of the entire heat sink 50 is distinctly increased in comparison with that of an individual basic element 52 or 54, while the same external dimensions are retained.
Finally, Fig. 5 shows in cross-section a heat sink 70 which is composed of two concentric cylinders 72 and 74 acting as the basic elements. On its circumference 75 the inner smaller cylinder 72 is provided with radially arranged cooling fins 76 which project into the spaces 78 between the cooling fins 82 arranged on the inner face 80 of the larger cylinder 74. A groove 84 is provided centrally between each of the cooling fins 82 of the larger cylinder 74, the free edge 86 of each cooling fin 76 of the smaller cylinder 72 being embedded in each groove. Similarly, a groove 88 is provided centrally between each of the cooling fins 76, the free edge 90 of each cooling fin 82 running in each of these grooves.
The two cylindrical basic elements 72 and 74 can be manufactured as cast sections.
They need then to be only assembled to form the heat sink 70.
An electronic component or piece of equipment (not shown) which is to be cooled can be arranged, for example, in the interior 92 of the smaller cylinder 72.
Claims (10)
1. A heat sink for electronic components and/or equipment comprising a pair of basic elements lying opposite one another in a staggered arrangement such that cooling fins projecting from basic element project into spaces between cooling fins of the other basic element.
2. A heat sink according to claim 1, characterised by two similar basic elements.
3. A heat sink according to claim 1 or 2, wherein all the cooling fins are essentially the same in height, and there is arranged in each basic element, between the cooling fins, a groove lying parallel to each of these cooling fins, the width of which groove is equal approximately to the thickness of the cooling fins of the other basic element on the free fin edges.
4. A heat sink according to claim 3, wherein the grooves are tapered inwardly as the groove depth increases.
5. A heat sink according to claim 3 or 4, wherein the grooves are arranged centrally between the cooling fins.
6. A heat sink according to any one of the preceding claims, wherein the cooling fins have openings.
7. A heat sink according to claim 6, wherein the openings are formed by recesses starting from the free edges of the cooling fins.
8. A heat sink according to claim 6 or 7, wherein the openings are arranged coincidentally one behind another at right angles to the cooling fins.
9. A heat sink according to claim 6 or 7, wherein the openings of adjacent cooling fins are in a staggered arrangement relative to one another.
10. A heat sink for electronic components and/or equipment, substantially as described herein with reference to, and as illustrated in the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19848429523 DE8429523U1 (en) | 1984-10-08 | 1984-10-08 | Heat sinks for electronic components and / or devices |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8524344D0 GB8524344D0 (en) | 1985-11-06 |
| GB2167905A true GB2167905A (en) | 1986-06-04 |
| GB2167905B GB2167905B (en) | 1988-04-20 |
Family
ID=6771476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8524344A Expired GB2167905B (en) | 1984-10-08 | 1985-10-02 | Heat sink for electronic components and/or equipment |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE8429523U1 (en) |
| FR (1) | FR2571546B1 (en) |
| GB (1) | GB2167905B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2256531A (en) * | 1991-05-28 | 1992-12-09 | Greenfields Europ Limited | Heatsinking of electrical fittings |
| US5239163A (en) * | 1991-06-19 | 1993-08-24 | Texas Instruments Incorporated | Automobile air heater utilizing PTC tablets adhesively fixed to tubular heat sinks |
| US5381859A (en) * | 1990-11-09 | 1995-01-17 | Kabushiki Kaisha Toshiba | Heat sink and the producing method thereof |
| EP0718883A2 (en) * | 1994-12-22 | 1996-06-26 | Alcatel SEL Aktiengesellschaft | Apparatus dissipating heat from an electronic circuit |
| US5829514A (en) * | 1997-10-29 | 1998-11-03 | Eastman Kodak Company | Bonded cast, pin-finned heat sink and method of manufacture |
| US5912802A (en) * | 1994-06-30 | 1999-06-15 | Intel Corporation | Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system |
| US6009938A (en) * | 1997-12-11 | 2000-01-04 | Eastman Kodak Company | Extruded, tiered high fin density heat sinks and method of manufacture |
| US7819174B2 (en) * | 2005-02-18 | 2010-10-26 | Advanced Thermal Device Inc. | Heat pipe cooling system and thermal connector thereof |
| CN102548360A (en) * | 2010-11-22 | 2012-07-04 | 三星电机株式会社 | Heat sink |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3446198C2 (en) * | 1984-12-18 | 1996-06-05 | Siemens Ag | Method for producing a composite body from thin-walled elements and a supporting body |
| DE3518310A1 (en) * | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF |
| GB9301049D0 (en) * | 1993-01-20 | 1993-03-10 | The Technology Partnership Plc | Mounting assembly |
| DE4314663A1 (en) * | 1993-05-04 | 1994-11-10 | Alusuisse Lonza Services Ag | Heatsinks for semiconductor devices |
| DE29602367U1 (en) * | 1995-03-24 | 1996-05-15 | Alusuisse-Lonza Services AG, Neuhausen am Rheinfall | Heat sink for semiconductor components or the like. |
| EP0956587A2 (en) * | 1996-01-27 | 1999-11-17 | Manfred Diels | Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method |
| FI112585B (en) * | 1996-03-13 | 2003-12-15 | Nokia Alumiini Oy | Heat sink |
| DE19628548A1 (en) * | 1996-07-16 | 1998-01-22 | Abb Patent Gmbh | Heat sink profile for air cooling device for semiconductor components |
| DE10065470B4 (en) * | 2000-12-28 | 2011-02-17 | Aleris Aluminum Vogt Gmbh | Method for producing a cooling element for electrical, in particular electronic, components |
| DE10222471A1 (en) * | 2002-05-22 | 2003-12-18 | Lenze Drive Systems Gmbh | Cooler for frequency converter of speed controllable AC motor for waste heat convection of converter components, with braking resistance incorporated integrally in extruded cooler |
| DE102005007041A1 (en) * | 2005-02-15 | 2006-08-17 | Alcan Technology & Management Ag | Heat sink for semiconductor devices or the like. Facilities and method for its preparation |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3081824A (en) * | 1960-09-19 | 1963-03-19 | Behlman Engineering Company | Mounting unit for electrical components |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3313340A (en) * | 1965-03-23 | 1967-04-11 | Lambda Electronics Corp | Heat exchanger |
| FR1499462A (en) * | 1966-09-16 | 1967-10-27 | Const Aero Navales | Method of manufacturing a heat exchanger between two fluids and heat exchanger by applying |
| DE2013539A1 (en) * | 1970-03-20 | 1971-10-07 | Siemens Ag | Heat conducting bodies for dissipating the operating temperature from the interior of a house |
| JPS5993191A (en) * | 1982-11-18 | 1984-05-29 | Toshiba Corp | Heat exchanger |
-
1984
- 1984-10-08 DE DE19848429523 patent/DE8429523U1/en not_active Expired
-
1985
- 1985-10-02 GB GB8524344A patent/GB2167905B/en not_active Expired
- 1985-10-04 FR FR8514782A patent/FR2571546B1/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3081824A (en) * | 1960-09-19 | 1963-03-19 | Behlman Engineering Company | Mounting unit for electrical components |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5381859A (en) * | 1990-11-09 | 1995-01-17 | Kabushiki Kaisha Toshiba | Heat sink and the producing method thereof |
| GB2256531A (en) * | 1991-05-28 | 1992-12-09 | Greenfields Europ Limited | Heatsinking of electrical fittings |
| US5239163A (en) * | 1991-06-19 | 1993-08-24 | Texas Instruments Incorporated | Automobile air heater utilizing PTC tablets adhesively fixed to tubular heat sinks |
| US5912802A (en) * | 1994-06-30 | 1999-06-15 | Intel Corporation | Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system |
| EP0718883A2 (en) * | 1994-12-22 | 1996-06-26 | Alcatel SEL Aktiengesellschaft | Apparatus dissipating heat from an electronic circuit |
| EP0718883A3 (en) * | 1994-12-22 | 1997-02-26 | Sel Alcatel Ag | Apparatus dissipating heat from an electronic circuit |
| US5829514A (en) * | 1997-10-29 | 1998-11-03 | Eastman Kodak Company | Bonded cast, pin-finned heat sink and method of manufacture |
| US6009938A (en) * | 1997-12-11 | 2000-01-04 | Eastman Kodak Company | Extruded, tiered high fin density heat sinks and method of manufacture |
| US7819174B2 (en) * | 2005-02-18 | 2010-10-26 | Advanced Thermal Device Inc. | Heat pipe cooling system and thermal connector thereof |
| CN102548360A (en) * | 2010-11-22 | 2012-07-04 | 三星电机株式会社 | Heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2571546A1 (en) | 1986-04-11 |
| DE8429523U1 (en) | 1984-11-29 |
| GB2167905B (en) | 1988-04-20 |
| GB8524344D0 (en) | 1985-11-06 |
| FR2571546B1 (en) | 1988-10-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19931002 |