DK165272B - PROCEDURE FOR THE PREPARATION OF REFRIGERATORS - Google Patents
PROCEDURE FOR THE PREPARATION OF REFRIGERATORS Download PDFInfo
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- DK165272B DK165272B DK235786A DK235786A DK165272B DK 165272 B DK165272 B DK 165272B DK 235786 A DK235786 A DK 235786A DK 235786 A DK235786 A DK 235786A DK 165272 B DK165272 B DK 165272B
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- Prior art keywords
- ribs
- base plate
- cooling ribs
- main
- heat sink
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 21
- 238000001816 cooling Methods 0.000 claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000001125 extrusion Methods 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 238000003780 insertion Methods 0.000 claims abstract 2
- 230000037431 insertion Effects 0.000 claims abstract 2
- 239000004065 semiconductor Substances 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 239000011324 bead Substances 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 4
- 210000001331 nose Anatomy 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 210000002257 embryonic structure Anatomy 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
- B21K25/00—Uniting components to form integral members, e.g. turbine wheels and shafts, caulks with inserts, with or without shaping of the components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P11/00—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/10—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Medicinal Preparation (AREA)
- Glass Compositions (AREA)
- Bipolar Transistors (AREA)
- Separation By Low-Temperature Treatments (AREA)
Abstract
Description
- i -- i -
DK 165272BDK 165272B
Opfindelsen angår en fremgangsmåde til fremstilling af et kølelegeme til hal vi ederkomponenter ifølge indledningen til krav 1.The invention relates to a method for producing a heat sink for halide components according to the preamble of claim 1.
En fremgangsmåde af denne art er kendt fra DE-offentliggørelsesskrift 25 02 472. Grundpladen fremstilles med noter, hvis vægge i læng-5 deretningen er forsynet med udpressede vægribber. I disse noter presses køleribber med lodret rifling ind ligesom ved koldpresningssvejsning.A method of this kind is known from DE Publication 25 02 472. The base plate is made with notes whose longitudinal walls are provided with extruded wall ribs. In these notes, heat sinks with vertical rifling are pressed in as with cold pressing welding.
Som følge af de store kræfter, som skal anvendes ved koldpresningssvejsningen, er længden af de opståede kølelegemer stærkt begrænset. Desuden er en mindstetykkelse af køleribberne nødvendig, for at forhin-10 dre disses knækning ved koldpresningssvejsningen.Due to the great forces to be used in the cold-pressing welding, the length of the heat sinks that are formed is greatly limited. In addition, a minimum thickness of the cooling ribs is necessary to prevent their cracking during the cold pressing welding.
Det er dog ikke kun de opståede kræfter, som begrænser køl el egerne-længden. Som følge af den lodrette rifling af køleribberne er disses langs grundpladen målte længde begrænset af strengpresseværktøjets mål, då presseretningen er lig med riflingsretningen.However, it is not only the forces created that limit the cooling or spokes length. Due to the vertical grooving of the cooling ribs, their length measured along the base plate is limited by the dimensions of the extruder tool, since the pressing direction is equal to the grooving direction.
15 Fra JP-offentliggørelsesskrift 57 196 552 er det desuden principi elt kendt at presse køleribber ind i noterne i et grundlegeme.15 In addition, from JP Publication 57 57 552 it is in principle known to push cooling ribs into the notes in a basic body.
DE-brugsmønster 84 29 523 angiver en fremgangsmåde, hvor køleribberne fra et andet kølelegeme presses ind i mel!emnoter i et kølelegeme med udformede køleribber.DE usage pattern 84 29 523 discloses a method in which the heat sinks of another heat sink are pressed into flour nodes in a heat sink with designed heat sinks.
20 Fra US-patentskrift 2 984 774 er det yderligere kendt at forsyne køleribber med sidevendte ribber med henblik på overfladeforøgelse.It is further known from US Pat. No. 2,984,774 to provide cooling ribs with lateral ribs for surface enhancement.
På baggrund af denne kendte teknik har opfinderen sat sig det mål at tilvejebringe en fremgangsmåde til fremstilling af et kølelegeme med hvilket der opnås et stort ribbeforhold og således at det bliver muligt 25 at fremstille et såkaldt højeffektkølelegerne af vilkårlig længde. Ved ribbeforhold forstås forholdet mellem ribbehøjden og den mindste ribbeafstand i nærheden af ribbespidserne.In view of this prior art, the inventor has set himself the object of providing a method of producing a heat sink with which a large rib ratio is obtained and so that it is possible to produce a so-called high power heat sink of any length. Rib ratio is understood to be the ratio of the rib height to the smallest rib spacing near the rib tips.
Denne opgave løses ved hjælp af de kendetegnende træk i krav 1. Yderligere træk fremgår af de afhængige krav.This task is solved by the characteristic features of claim 1. Further features are set forth in the dependent claims.
30 Ved forbindelsen af de i vilkårlig længde præfabrikerede enkeltdele opstår der ingen store pressetryk. Køleribberne kan endda anbringes i noterne med et slup og forskydes problemfrit i noternes retning.30 No large compressive pressures arise when connecting the individual parts prefabricated at any length. The heat sinks can even be placed in the grooves with a gap and shifted seamlessly in the grooves direction.
Som følge af kombinationen mellem grundplade og ribber kan der fremstilles et antal kølelegemer af forskellig udformning med få værk-35 tøjer. Dette fører til en mindskelse af omkostningerne samt af værktø- - 2 -Due to the combination of base plate and ribs, a number of heat sinks of various designs can be produced with few tools. This leads to a reduction in costs as well as tools - 2 -
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jerne og lagerbeholdningen.the irons and inventory.
Grundpladen kan være forsynet med sidevendte ribbevægge, som let kan fremstilles ved strengpresning. Mellem disse vægge og parallelt med dem forløber så de indsatte køleribber.The base plate may be provided with sidewall ribs which can be easily manufactured by string pressing. Between these walls and parallel to them, then the inserted heat sinks.
5 Ved en anden udformning, set i kølelegemets tværsnit, skifter sær skilt indsatte køleribber med andre køleribber, som er blevet tildannet i ét stykke sammen med grundpladen. En sådan kølelegemeform muliggør anvendelse både ved tvangsventilation og ved konvektionskøling. Medens der ved tvangskøling principielt tilstræbes en størst mulig overflade 10 ved en mindre ribbeafstand, er dette ved konvektionskøling næppe virksomt i det mindste ved længere kølelegemer på grund af den mindre lufthastighed - og derved luftmængde (produkt af hastighed og kanal tværsnit). Denne variable anvendelsesmulighed forstørres yderligere ved, at fx. de indsatte køleribber kan være forsynet med i og for sig kendte 15 tværribber, som ved en relativt bred strømningskanal fører til en væsentlig overfladeforøgelse. Det ses, at dette kølelegeme ikke blot er egnet til tvangsventilation, men også til konvektionskøling.5 In another embodiment, seen in the cross-section of the heat sink, specially inserted heat sinks alternate with other heat sinks which have been formed in one piece together with the base plate. Such a heat sink shape enables use both in forced ventilation and in convection cooling. While forcible cooling, in principle, aims to achieve the largest possible surface 10 at a smaller rib spacing, this is hardly effective at least for longer heat sinks due to the smaller air velocity - and thereby air flow (product of velocity and duct cross section). This variable application is further enlarged by the fact that e.g. the inserted heat sinks may be provided with 15 known ribs known per se, which at a relatively wide flow channel lead to a significant increase in surface area. It is seen that this heat sink is not only suitable for forced ventilation but also for convection cooling.
Hver hovednot er på begge sider er flankeret af mellemnoter, hvor· hovednoten fortrinsvis har et firkantet tværsnit og mellemnoten et i 20 det væsentlige trekantformet tværsnit. Ligeledes er dybden af hovednoten større end dybden af mellemnoten, idet sidstnævnte tjener som hjælpeindretning til formningen af grundpladen. Hoved- og mellemnot frembringer mellem sig en ribbe på grundpladen, som ved anvendelsen af et deformerende værktøj i mellemnoten kan skubbes ind i hovednotens lys-25 målstværsnit. Inden denne plastiske deformering af hver ribbe i grundpladen er der i hovednoten i soklen indsat en særskilt fremstillet køleribbe, som på siden er forsynet med retentioner, fx. parallelnoter med savtandprofil, i hvilke en del af den deformerede grundpiadematrix griber ind under fastholdelse. Der opstår således en meget fast og al-30 ligevel problemfrit fremstillelig forskudsforbindelse mellem dels grundpladen og dels køleribben.Each main note is flanked on either side by intermediate notes, wherein the main note preferably has a square cross section and the middle note a substantially triangular cross section. Also, the depth of the main note is greater than the depth of the middle note, the latter serving as an auxiliary device for forming the base plate. The main and intermediate groove create between them a rib on the base plate which, by the use of a deforming tool in the intermediate groove, can be pushed into the light gauge cross-section of the main groove. Prior to this plastic deformation of each rib in the base plate, a separately manufactured cooling rib is inserted in the main groove, which is provided with retention on the side, e.g. parallel grooves with sawtooth profile in which a portion of the deformed base matrix mates during retention. Thus, a very firm and yet seamlessly fabricated advance connection is formed between the base plate and the heat sink.
Som regel vil varmefordelingen i grundpladen selv være tilstrækkelig ved et rent aluminium-køl el egerne med passende grundpiadetykkelse.As a rule, the heat distribution in the baseplate itself will be sufficient by a clean aluminum-cooled or the spokes with the appropriate base pad thickness.
Da ribbeoverfladen imidlertid ved samme kølelegemehøjde reduceres med 35 voksende grundpiadetykkelse, kan det blive nødvendigt at forbedre var- - 3 -However, as the rib surface at the same heat sink height is reduced by 35 increasing base pad thickness, it may be necessary to improve the
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mefordelingen i grundpladen selv. Dette opnås ifølge opfindelsen ved, at grundpladen er forsynet med mindst ét bånd, en tråd eller lignende ind- eller pålæg af materiale med stor varmeledningsevne, fortrinsvis med et kobberbånd eller en kobbertråd. Fordelen ved den særskilte frem-5 stilling af grundpladen viser sig også her, da denne kan fremstilles problemfrit ved en valsningsstrengpresning af et aluminiumslegeme og et kobberpålæg eller kobberindlæg, nemlig under metallisk forbindelse mellem de to profil komponenter. De beskrevne udformninger af kølelegemerne ifølge opfindelsen tillader et ribbeforhold på mere end 9:1, endda mere 10 end 12:1, hvilket ikke kan opnås ved kølelegemer fremstillet i ét stykke.the co-distribution in the baseplate itself. This is achieved according to the invention in that the base plate is provided with at least one strip, a wire or similar insert or coating of material with high thermal conductivity, preferably with a copper strip or a copper wire. The advantage of the separate fabrication of the base plate is also evident here, since it can be produced seamlessly by a rolling strand pressing of an aluminum body and a copper or copper insert, namely under metallic connection between the two profile components. The described embodiments of the heat sinks according to the invention allow a rib ratio of more than 9: 1, even more than 10: 12: 1, which cannot be achieved with one-piece heat sinks.
I denne sammenhæng skal der for fuldstændighedens skyld henvises til DE-offentliggørelsesskrift 30.24.748, med hvilket det til et kølel egerne i ét stykke foreslås at færdiggøre dettes køleribber med et 15 lavt ribbeforhold ved hjælp af parentesformede profil indsatse.For the sake of completeness, reference should be made to DE disclosure specification 30.24.748, which proposes to complete in one piece the spokes of its cooling ribs with a low rib ratio using bracket profile inserts.
Ved fremgangsmåden ifølge opfindelsen til fremstilling af kølelegemer af den indledningsvis nævnte art, hvor grundpladen med hovednoter strengpresses, i hovednoterne indsættes særskilt fremstillede køleribber, og disse forbindes med grundpladen ved hjælp af en presning. Til 20 dette formål fremstilles der sammen med hovednoterne fortrinsvis ribber, som flankerer disse og adskilles af mellemnoter, og ribberne deformeres plastisk efter monteringen af hver køleribbe.In the method according to the invention for the production of heat sinks of the type mentioned above, in which the base plate with main notes is extruded, separately manufactured cooling ribs are inserted into the main notes and these are connected to the base plate by means of a pressing. For this purpose, together with the main notes, preferably ribs are flanked which are flanked and separated by intermediate notes, and the ribs are deformed plastically after the mounting of each heat sink.
En deformering af hver ribbe kan ske ved en enkel anvendelse af mejsler, hvilket imidlertid forårsager forholdsvis store bearbejdnings-25 Omkostninger. Til denne deformeringsproces foreslås derfor et værktøj, som er kendetegnet ved trykskiver, som holdes i afstand af afstandsindlæg, med radialt tilspidsende trykkanter, hvorhos den frie radiale længde af trykskiverne er større end den frie højde af køleribberne og middelafstanden mellem trykskiverne indbyrdes svarer til afstanden mel-30 lem et par frie mellemribber på grundpladen. Som følge af dette værktøj kan deformationsprocessen automatiseres, og derudover kan rullelegemet ifølge opfindelsen indstilles til det til enhver tid ønskede raster for mel!emribberne.Deformation of each rib can be effected by a simple use of chisels, which, however, causes relatively high machining costs. Therefore, for this deformation process, a tool characterized by pressure discs spaced apart by spacers is proposed with radially tapering pressure edges, the free radial length of the pressure discs being greater than the free height of the cooling ribs and the mean distance between the spacers corresponding to the distance between them. -30 Hook a couple of free middle ribs on the base plate. As a result of this tool, the deformation process can be automated, and in addition, the roller body according to the invention can be adjusted to the desired time frame for the flour embryos.
Det ses, at fremstillingen af kølelegemer med stort ribbeforhold 35 nu bliver mulig på enkel måde uden risiko for et værktøjsbrud.It will be seen that the manufacture of heat sinks with large rib ratio 35 now becomes possible in a simple manner without the risk of a tool break.
- 4 -- 4 -
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Yderligere fordele, ejendommeligheder og enkeltheder ved opfindelsen fremgår af den følgende beskrivelse af foretrukne udførelseseksempler samt ved hjælp af tegningen. På tegningen viser: 5 fig. .1 en perspektivisk gengivelse af en del af et kølelegeme, fig. 2 et deludsnit gennem et kølelegeme, fig. 3 en forstørret detalje på fig. 2, fig. 4 en skitse til en fremsti11 ingsfremgangsmåde til kølelegeme ifølge fig. 1, 2 i skematiseret tværsnit, 10 fig. 5 et forstørret udsnit af fig. 4, fig. 6 et tværsnit gennem et andet kølelegeme, fig. 7 et forstørret udsnit af fig. 6 ved dennes felt VII, fig. 8 et tværsnit gennem en yderligere udformning af kølelege met,.Further advantages, peculiarities and details of the invention will become apparent from the following description of preferred embodiments and with the aid of the drawing. In the drawing: FIG. .1 is a perspective view of a portion of a heat sink; FIG. 2 is a partial section through a heat sink; FIG. 3 is an enlarged detail of FIG. 2, FIG. 4 is a sketch of a heat sink manufacturing method of FIG. 1, 2 in schematic cross-section, FIG. 5 is an enlarged sectional view of FIG. 4, FIG. 6 is a cross-section through another heat sink; FIG. 7 is an enlarged section of FIG. 6 by field VII thereof, fig. 8 is a cross-section through a further embodiment of the heat sink.
15 fig. 9-11 tværsnit gennem forskellige udformninger af en del af et kølelegeme.FIG. 9-11 cross-section through various designs of a portion of a heat sink.
Et i tværsnit kamlignende kølelegeme 10 af letmetal til hal vi ederkomponenter, som af hensyn til overskueligheden ikke er vist yderligere 20 på tegningen, har ifølge fig. 1 en grundplade 11 med tykkelsen i på fx.A cross-sectional cam-like heat sink 10 of light metal to halide components, which for the sake of clarity is not shown further 20 in the drawing, has according to FIG. 1 shows a base plate 11 having a thickness i of e.g.
15 mm med fra dennes overflade 12 opragende køleribber 20. Disses frie længde, nemlig afstanden h mellem afrundede frie ribbekanter 21 til overfladen 12 på grundpladen 11, andrager i det udvalgte udførelseseksempel omtrent 56 mm, med en indbyrdes middel afstand e på omtrent 7 25 mm.15 mm with cooling ribs projecting from the surface 12 thereof. Their free length, namely the distance h between rounded free rib edges 21 to the surface 12 of the base plate 11, is approximately 56 mm in the selected embodiment, with a mutual distance e of about 7 25 mm. .
Især fig. 2 anskueliggør, at grundpladen 11 fremstilles adskilt fra køleribberne 20, nemlig - som også senere - ved strengpresning af letmetal profil er. I grundpladen 11 er der udformet fra dennes overflade 12 udgående hovednoter 14 med en dybde a på omtrent 5 mm og med en 30 bredde b på omtrent den halve dybde a.In particular, FIG. 2 illustrates that the base plate 11 is manufactured separately from the cooling ribs 20, namely - as also later - by the extrusion of light metal profile. In the baseplate 11, main notes 14 projecting from its surface 12 are formed having a depth a of about 5 mm and a width b of about half the depth a.
I de mellem to nabohovednoter 14 resterende overfladestrimler i grundpladen 11 er der anbragt en såkaldt mellemnot 15 med trekantformet tværsnit, hvis dybde f er mindre end dybden af hovednoten 14.In the surface strips remaining between two neighboring headnotes 14 in the base plate 11, a so-called intermediate note 15 of triangular cross-section is arranged, the depth of which is less than the depth of the main note 14.
I den smalle køleribbe 20 er der på dens fra den frie ribbekant 21 35 fjerne tværsnitsende tildannet en sokkel 22, hvis bredde m svarer til - 5 -In the narrow heat sink 20, a base 22 is formed on its distant cross-cutting edge away from the free rib edge 21 35, the width of which corresponds to -
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bredden b i hovednoten 14 og er større end bredden n af den egentlige køleribbe 20. Højden q af soklen 22 er lig med eller noget større end dybden a af den pågældende hovednot 14. I sidefladerne 23 i soklen 22 ses sokkel noter 24 til dannelsen af til siden udragende tænder 25.the width b of the main groove 14 and is greater than the width n of the actual cooling rib 20. The height q of the socket 22 is equal to or slightly greater than the depth a of the respective main groove 14. In the side surfaces 23 of the socket 22, socket grooves 24 for the formation of since protruding teeth 25.
5 Efter strengpresningen af grundpladen 11 af en AlMgSi-1 egering monteres i dennes hovednoter 14 køleribber 20 med deres sokler 22 og fastgøres deri ved en plastisk deformering af notvæggene 16. Ved denne formningsproces føres der fra notvæggen 16 materialevulster 17 mod notaksen A, der griber ind i sokkelnoterne 24 i den indsatte køleribbe 10 20, således som dette fortrinsvis fremgår af fig. 5. Efter denne ind-klemning hærdes det således opståede kølelegeme 10.5 After the extrusion of the base plate 11 by an AlMgSi-1 spreader, cooling ribs 20 with their sockets 22 are mounted in its main grooves 14 and secured therein by a plastic deformation of the groove walls 16. In this forming process, material beads 17 are guided against the groove A which engages into the base notes 24 of the inserted heat sink 10 20, as is preferably shown in FIG. 5. After this squeeze, the heat sink 10 thus formed is cured.
Klemningsprocessen bliver lettet af mellemnoterne 15, i hvilke der anvendes mejsel spidser 28 eller tilspidsede trykkanter 29 på skiver 30 i et rullelegeme 31. Ifølge fig. 4 udgøres det om en ikke tegnet akse 15 roterbare rullelegeme 31 af skiverne 30, distanceindlæg 32, som holder disse i afstand t, og endeplader 33, som med sine skrå omkredskanter 34 føres ved grundpladen 11.The squeezing process is facilitated by the middle grooves 15, in which chisel tips 28 or tapered pressure edges 29 of discs 30 are used in a roller body 31. According to FIG. 4, it is constituted by a non-drawn axis 15 rotatable roller body 31 of the discs 30, spacer inserts 32 which hold them at a distance t, and end plates 33, which with their inclined circumferential edges 34 are guided at the base plate 11.
Da den maksimale bredde u af den efterhånden udvidede mejsel spids 28 eller trykkant 29 er større end bredden s af mellemnoten 15 - eller 20 spidsvinklen w i klemningsværktøjet 28, 29 er større end den for nottværsnittet - deformeres de mellem hoved- og mellemnoter 14 henholdsvis 15 stående ribber 19 (fig. 5) på ønsket måde.Since the maximum width u of the gradually expanded chisel tip 28 or pressure edge 29 is greater than the width s of the middle groove 15 - or the 20 sloping angle wi the clamping tool 28, 29 is larger than that of the groove cross section - they are deformed between the main and middle grooves 14 and 15 respectively. ribs 19 (Fig. 5) in the desired manner.
Ved udførelseseksemplet på fig. 6, 7 er der på grundpladen lla på begge sider af kølelégemeaksen M tildannet en ribbevæg 36, som begræn-25 ser grundpladen lla til siden, med mod kølelegemeaksen M vendende næser 37. Sidstnævnte bliver bestemt af en afstand d på omtrent 5 mm. Her anvendes i hovednoterne 14 soklen 22 på køleribberne 20a, som spidser til mod deres ribbekanter 21 og tværribber 38, som fastlægger afstanden d. Tværribberne 38 på den ene side af køleribben 20a er højdeforskudt i 30 forhold til dem på den anden køleribbeside med en halv afstand d (altså d/2). Næserne 37 og tværribberne 38 på en fælles ret linie H peger i en enkelt retning. Således opnås der ved en relativt bred strømningskanal en væsentlig overfladeforstørrelse ved hjælp af næserne 37 og tværribberne 38, hvorfor især dette udførelseseksempel både anvendes ved ven-35 tilation under tvang og ved konvektion.In the embodiment of FIG. 6, 7, on both sides of the heat sink axis M, a rib wall 36 is formed, which limits the base plate 11a to the side, with the nose 37 facing the heat sink axis M. The latter is determined by a distance d of about 5 mm. Here, in the main notes 14, the base 22 is used on the cooling ribs 20a, which point towards their ribs 21 and transverse ribs 38, which determine the distance d. The cross-ribs 38 on one side of the cooling rib 20a are height offset in relation to those on the other cooling rib side by a half. distance d (ie d / 2). The noses 37 and the transverse ribs 38 on a common straight line H point in a single direction. Thus, with a relatively wide flow channel, a substantial surface magnification is obtained by the noses 37 and the transverse ribs 38, which is why especially this embodiment is used both for forced ventilation and for convection.
- 6 -- 6 -
DK 165272BDK 165272B
På grundpladen llb på fig. 8 er der ved strengpresningen tildannet flere køleribber 40 parallelt med hinanden i afstanden g ved siden af hver sin mellemnot 15. To mellemnoter 15 flankerer en fælles hovednot 14. Dette kølelegeme 10b byder på et enkelt ribbeforhold og kan anven-5 des som en lang udformning til konvektionskøling. Ønskes en kort udformning eller er der mulighed for tvangsventilation, bliver der i hovednoterne 14 indklemt særlige køleribber 20a.On the base plate 11b of FIG. 8, several cooling ribs 40 are formed parallel to each other in the spacing of g in the distance g next to each of their middle grooves 15. Two middle grooves 15 flank a common main groove 14. This heat sink 10b offers a single rib ratio and can be used as a long design. for convection cooling. If a short design is desired or if forced ventilation is possible, special cooling ribs 20a are inserted in the main notes 14.
Da ribbeoverfladen ved samme kølelegemehøjde (i + h) reduceres med voksende tykkelse i for grundpladen 11, er der i grundpladen llc på 10 fig. 9 indført et bånd 43 af kobber. Grundpladen llc på fig. 10 hhv. 11 har rundtråd eller fladtråd 44 af kobber, som indlejres ved strengpresningen i metallisk forbindelse i letmetalmatricen.Since the rib surface at the same heat sink height (i + h) is reduced with increasing thickness in for the base plate 11, in the base plate 11c of 10 fig. 9 introduced a band 43 of copper. The base plate lc of FIG. 10 and 10 respectively. 11 has round wire or flat wire 44 of copper which is embedded in the metallic compound extrusion in the light metal matrix.
15 *15 *
Claims (12)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19853518310 DE3518310A1 (en) | 1985-05-22 | 1985-05-22 | REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF |
| DE3518310 | 1985-05-22 |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| DK235786D0 DK235786D0 (en) | 1986-05-21 |
| DK235786A DK235786A (en) | 1986-11-23 |
| DK165272B true DK165272B (en) | 1992-10-26 |
| DK165272C DK165272C (en) | 1993-03-15 |
Family
ID=6271297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK235786A DK165272C (en) | 1985-05-22 | 1986-05-21 | PROCEDURE FOR THE PREPARATION OF REFRIGERATORS |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0206980B1 (en) |
| AT (1) | ATE53708T1 (en) |
| DE (2) | DE3518310A1 (en) |
| DK (1) | DK165272C (en) |
| NO (1) | NO170958C (en) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2204181B (en) * | 1987-04-27 | 1990-03-21 | Thermalloy Inc | Heat sink apparatus and method of manufacture |
| GB2229571B (en) * | 1988-11-14 | 1992-12-23 | Johnson Electric Ind Mfg | Varistor for an electric motor |
| ATE127276T1 (en) | 1990-10-24 | 1995-09-15 | Alusuisse Lonza Services Ag | HEAT SINK FOR SEMICONDUCTOR COMPONENTS. |
| DE4314663A1 (en) * | 1993-05-04 | 1994-11-10 | Alusuisse Lonza Services Ag | Heatsinks for semiconductor devices |
| CA2211562C (en) * | 1993-10-06 | 2002-02-26 | R-Theta Inc. | De-warping apparatus for straightening a plate |
| DE9319259U1 (en) * | 1993-12-15 | 1994-03-24 | Siemens AG, 80333 München | Heatsink |
| DE9412460U1 (en) | 1994-08-02 | 1995-12-14 | Hoogovens Aluminium Profiltechnik Gmbh, 88267 Vogt | Cooling device for electrical or electronic components with a base plate and with cooling elements |
| US5791406A (en) * | 1994-08-02 | 1998-08-11 | Hoogovens Aluminium Profiltechnik, Gmbh | Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same |
| DE29602367U1 (en) * | 1995-03-24 | 1996-05-15 | Alusuisse-Lonza Services AG, Neuhausen am Rheinfall | Heat sink for semiconductor components or the like. |
| US5819407A (en) * | 1995-04-19 | 1998-10-13 | Tousui, Ltd. | Method of joining together a pair of members each having a high thermal conductivity |
| DE29507286U1 (en) * | 1995-05-04 | 1995-07-20 | Alusuisse Lonza Services Ag | Heat sink for semiconductor components or the like. equipment |
| EP0744241B1 (en) * | 1995-05-16 | 2001-11-14 | TOUSUI, Ltd. | Method of joining together a pair of members each having a high thermal conductivity |
| WO1997021887A1 (en) * | 1995-12-14 | 1997-06-19 | Attlington Investments Limited | Metal section |
| ES2145506T3 (en) * | 1995-12-14 | 2000-07-01 | Attlington Invest Ltd | PROCEDURE FOR THE MANUFACTURE OF A METAL PROFILE. |
| DE29712058U1 (en) | 1996-01-27 | 1998-04-02 | Bayer, Joachim, 51503 Rösrath | Heat sinks for mounting on semiconductor components and partial profiles for the production of such heat sinks |
| ATE330329T1 (en) | 1996-01-31 | 2006-07-15 | Alcan Tech & Man Ag | HEAT SINK FOR SEMICONDUCTOR COMPONENTS OR. DGL. |
| DE29602212U1 (en) * | 1996-02-09 | 1996-05-02 | Alusuisse-Lonza Services AG, Neuhausen am Rheinfall | Heat sink for semiconductor components or the like. Facilities |
| WO2000003574A2 (en) * | 1998-07-09 | 2000-01-20 | Glueck Joachim | Heat sink with transverse ribs |
| DE19836314A1 (en) * | 1998-08-11 | 2000-02-24 | Joachim Bayer | Heatsink attachment for semiconductor components, with cooler profiles extruded from special aluminum alloy has a bent semicircular shape |
| JP3431004B2 (en) | 2000-01-14 | 2003-07-28 | 松下電器産業株式会社 | Heat sink and cooling device using the same |
| JP4355412B2 (en) * | 1999-11-26 | 2009-11-04 | 昭和電工株式会社 | Heat sink and manufacturing method thereof |
| DE10053240A1 (en) * | 2000-08-28 | 2002-04-04 | Alusuisse Tech & Man Ag | Heat sinks for semiconductor elements, processes for their production and molds therefor |
| DE20016316U1 (en) * | 2000-09-19 | 2001-04-05 | Boston Cooltec Corp., Wilmington | Heatsinks for cooling electronic components in particular |
| DE10056387B4 (en) * | 2000-11-14 | 2008-11-13 | Corus Aluminium Profiltechnik Gmbh | Cooling device and method for its production and apparatus for carrying out the method |
| JP3529358B2 (en) * | 2001-02-07 | 2004-05-24 | 古河電気工業株式会社 | Finned heat sink |
| DE10141988C1 (en) | 2001-08-28 | 2003-01-09 | Manfred Diels | Modular heat sink manufacturing method uses transverse pressure for clamping projection of one extruded profile in channel of adjacent extruded profile by plastic deformation of Al wire |
| DE10200019B4 (en) * | 2002-01-02 | 2006-07-06 | Alcan Technology & Management Ag | Heat sink for semiconductor devices, method for its production and tool for carrying out the method |
| DE10229532B4 (en) * | 2002-07-01 | 2008-06-19 | Alcan Technology & Management Ag | Cooling device for semiconductor devices |
| DE102005007041A1 (en) | 2005-02-15 | 2006-08-17 | Alcan Technology & Management Ag | Heat sink for semiconductor devices or the like. Facilities and method for its preparation |
| CN100456914C (en) * | 2005-09-22 | 2009-01-28 | 黄崇贤 | Radiator module |
| DE102006038980B4 (en) * | 2006-08-21 | 2009-02-19 | Alcan Technology & Management Ag | Heat sink for semiconductor devices and method for its production |
| DE502007001066D1 (en) | 2006-11-22 | 2009-08-27 | Alcan Tech & Man Ag | Heat sink for semiconductor devices or the like heat sources and method for its production |
| DE102007046684B3 (en) * | 2007-08-20 | 2009-02-26 | Alcan Technology & Management Ag | Metallic flat section i.e. cooling body, producing method for semiconductor device, involves crushing connecting regions of respective wall together after extrusion molding process and before application of cooling fin |
| EP2027948A1 (en) | 2007-08-20 | 2009-02-25 | Alcan Technology & Management AG | Method for producing a flat section, in particular a cooling body for semiconductor elements or similar components, and section for same |
| DE102008030110A1 (en) | 2008-04-22 | 2009-10-29 | Alcan Technology & Management Ag | Heat sink for semiconductor device, has fin sections integrated into single piece and connecting side plates with each other, and plate made up of carbon and graphite ram material and included in opening that is limited by side plates |
| US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
| TWM360549U (en) * | 2009-02-10 | 2009-07-01 | Giga Byte Tech Co Ltd | Heat-dissipating device |
| TWI348017B (en) * | 2009-02-10 | 2011-09-01 | Giga Byte Tech Co Ltd | Method of making a heat sink |
| DE102009037259B4 (en) * | 2009-08-12 | 2012-04-19 | Semikron Elektronik Gmbh & Co. Kg | Arrangement with a cooling device and a power semiconductor module |
| DE102011108221A1 (en) * | 2011-07-21 | 2013-01-24 | Hyco-Vakuumtechnik Gmbh | Electric motor for suction/pressure-pump of sterilizer utilized to e.g. sterilize surgical instrument, has cooling fins, where one of fins has projection extending to other fin and partially closing aperture of cool air channel |
| CN103493196B (en) * | 2012-02-06 | 2016-07-06 | 华为技术有限公司 | There is the fin of stacking fin and the production method of this fin |
| DE202013104990U1 (en) * | 2013-11-06 | 2015-02-09 | Akg Thermotechnik International Gmbh & Co. Kg | heatsink |
| WO2016096042A1 (en) * | 2014-12-19 | 2016-06-23 | Arcelik Anonim Sirketi | Individual cooling fin and an electric motor having the same |
| FR3036918B1 (en) * | 2015-05-29 | 2018-08-10 | Thales | ELECTRONIC CARD AND METHOD OF MANUFACTURING THE SAME |
| EP3624184A1 (en) * | 2018-09-12 | 2020-03-18 | Siemens Aktiengesellschaft | Power module unit, method for producing a power module unit, power supply and frequency converter |
| EP3872845A1 (en) | 2020-02-28 | 2021-09-01 | Siemens Aktiengesellschaft | Method for manufacturing a power module unit |
| CN114378543B (en) * | 2022-02-15 | 2022-10-18 | 苏州市华盛源机电有限公司 | Production method of plug-in type radiating fin |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2984774A (en) * | 1956-10-01 | 1961-05-16 | Motorola Inc | Transistor heat sink assembly |
| DE2502472C2 (en) * | 1975-01-22 | 1982-09-02 | Siemens AG, 1000 Berlin und 8000 München | Heat sink for thyristors |
| DE3024748C2 (en) * | 1980-06-30 | 1986-09-04 | Aluminium Walzwerke Singen Gmbh, 7700 Singen | Heat sinks for semiconductor components |
| JPS57196552A (en) * | 1981-05-27 | 1982-12-02 | Nec Corp | Radiator |
| DE8429523U1 (en) * | 1984-10-08 | 1984-11-29 | Nixdorf Computer Ag, 4790 Paderborn | Heat sinks for electronic components and / or devices |
-
1985
- 1985-05-22 DE DE19853518310 patent/DE3518310A1/en active Granted
-
1986
- 1986-04-25 DE DE8686810187T patent/DE3672028D1/en not_active Expired - Lifetime
- 1986-04-25 EP EP86810187A patent/EP0206980B1/en not_active Expired - Lifetime
- 1986-04-25 AT AT86810187T patent/ATE53708T1/en not_active IP Right Cessation
- 1986-05-16 NO NO861948A patent/NO170958C/en not_active IP Right Cessation
- 1986-05-21 DK DK235786A patent/DK165272C/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0206980A3 (en) | 1988-08-10 |
| EP0206980B1 (en) | 1990-06-13 |
| DE3518310A1 (en) | 1986-11-27 |
| ATE53708T1 (en) | 1990-06-15 |
| EP0206980A2 (en) | 1986-12-30 |
| NO170958B (en) | 1992-09-21 |
| DE3518310C2 (en) | 1989-05-11 |
| DK235786A (en) | 1986-11-23 |
| DK235786D0 (en) | 1986-05-21 |
| NO170958C (en) | 1992-12-30 |
| NO861948L (en) | 1986-11-24 |
| DK165272C (en) | 1993-03-15 |
| DE3672028D1 (en) | 1990-07-19 |
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| PUP | Patent expired |