DE3024748C2 - Heat sinks for semiconductor components - Google Patents
Heat sinks for semiconductor componentsInfo
- Publication number
- DE3024748C2 DE3024748C2 DE3024748A DE3024748A DE3024748C2 DE 3024748 C2 DE3024748 C2 DE 3024748C2 DE 3024748 A DE3024748 A DE 3024748A DE 3024748 A DE3024748 A DE 3024748A DE 3024748 C2 DE3024748 C2 DE 3024748C2
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- heat sink
- cooling fins
- profile insert
- profile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims 3
- 238000001816 cooling Methods 0.000 claims description 56
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims 3
- 238000001125 extrusion Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 230000009286 beneficial effect Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Querrippen ab, welche gegenüber den Spreizarmen von etwa haifaer Länge sind, also in die vorab erwähnten Kammern einragen, ohne die Flanken der Kühlrippen zu berühren.Transverse ribs, which are about half the length of the spreader arms, so in the aforementioned The chambers protrude without touching the flanks of the cooling fins.
Als günstig hat es sich erwiesen, den Profileinsatz mit einem Klemmkopf auszubilden, welcher zwischen zwei Spreizarmen den Einsatzschlitz anbietetIt has proven to be advantageous to design the profile insert with a clamping head which is positioned between two Spreading arms offers the insert slot
Dank der voranstellenden Maßgaben wird ein hohes Rippenverhältnis bei gleichzeitig geringem Werkzeugaufwand erzielt, da zwischen die längeren Kühlrippen ic jene Profileinsätze klemmend auf die kurzen Kühlrippen aufgebracht sind. Hierdurch werden die Luftströmungsverhältnisse zur Erzielung einer höheren Kühlleistung verbessert Der Strömungswiderstand wird durch die Querrippen an den Einsätzen im Bereich niedrigerer Rippentemperatur erhöht so daß sich ein größerer Luftdurchsatz in der heißen Zone einstellt Zum anderen stellen die oberen, sich gegen die langen Kühlrippen abstützenden Spreizarme geschlossene Strömungskanäle her, so daß auf eine zusätzliche Abdeckung verziehtet werden kann.Thanks to the preceding stipulations, a high rib ratio is achieved with little tool effort at the same time achieved because those profile inserts clamped between the longer cooling fins on the short cooling fins are upset. In this way, the air flow conditions are used to achieve a higher cooling capacity The flow resistance is improved by the cross ribs on the inserts in the lower area Rib temperature increases so that a greater air throughput is established in the hot zone. On the other hand the upper spreading arms supporting themselves against the long cooling fins provide closed flow channels so that it can be moved to an additional cover.
Der erfindungsgemäße Kühlkörper weist alsc Rippen unterschiedlicher Höhe auf, wobei die Höhenunterschiede durch die aufgeklemmten Profileinsätze ausgeglichen werden, welche ihrerseits Querrippen aufweisen und damit zum Kühlverhalten erheblich beitragen. Auf diese Weise kann das Rippenverhältnis von bisher 7,25 :1 auf etwa 4 :1 gesenkt werden. Darüber hinaus wird eine erhebliche Fertigungsvereinfachung erreicht; sowohl der Kühlkörper selbst als auch der Profileinsatz werden von stranggepreßten Profilen abgelängtThe heat sink according to the invention also has ribs of different heights, the height differences being compensated by the clamped profile inserts which in turn have transverse ribs and thus contribute significantly to the cooling behavior. on In this way, the rib ratio can be reduced from 7.25: 1 to about 4: 1. Furthermore a considerable production simplification is achieved; both the heat sink itself and the profile insert are cut to length from extruded profiles
Ein bevorzugtes Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und wird im Folgenden näher beschrieben. Es zeigtA preferred embodiment of the invention is shown in the drawing and is described below described in more detail. It shows
F i g. 1 den Querschnitt durch einen Teil eines Kühlkörpers mit Profileinsatz;F i g. 1 shows the cross section through part of a heat sink with profile insert;
F i g. 2 den Querschnitt durch den Profileinsatz;F i g. 2 shows the cross section through the profile insert;
F i g. 3 ein Ausführungsbeispiel des Kühlkörpers.F i g. 3 shows an embodiment of the heat sink.
Ein Kühlkörper 1 weist gemäß F i g. 1 eine Grundplatte 2 der Starke /von beispielsweise 15 mm mit davon abragenden Kühlrippen 3,4 unterschiedlicher Höhe a (beispielsweise 40 mm) bzw. b (70 mm) und sich zur gerundeten Rippenspitze 5, 6 hin verjüngendem Querschnitt auf.According to FIG. 1 a base plate 2 of thickness / of, for example, 15 mm with cooling fins 3, 4 projecting therefrom of different heights a (for example 40 mm) or b (70 mm) and a cross-section tapering towards the rounded rib tip 5, 6.
Die Sockelbreite c/der längeren Kühlrippen 3 beträgt 5 mm und ist geringfügig größer als di? Sockelbreite e der kürzeren Kühlrippen 4; ebenso ist die Profilbreite / an der Spitze 5 der längeren Kühlrippen 3 mit 2,5 mm nur wenig größer als die Breite g an der Spitze 6 der kürzeren Kühlrippen 4.The base width c / of the longer cooling fins 3 is 5 mm and is slightly larger than di? Base width e of the shorter cooling fins 4; likewise, the profile width / at the tip 5 of the longer cooling fins 3, at 2.5 mm, is only slightly larger than the width g at the tip 6 of the shorter cooling fins 4.
Die Rippenhöhe £der langen Kühlrippe 3 verhält sich zum lichten Rippenabstand /η wie 3 :1, die Rippenhöhe a der kurzen Kühlrippe 4 zu dem in F i g. 1 verdeutlichten engen Rippenabstand η zur benachbarten langen Kühlrippe 3 wie 4 :1. Der Sockelabstand ρ mißt etwa 7 mm.The rib height £ of the long cooling rib 3 is related to the clear rib spacing / η as 3: 1, the rib height a of the short cooling rib 4 to that in FIG. 1 illustrated the narrow fin spacing η to the adjacent long cooling fin 3 such as 4: 1. The base distance ρ measures about 7 mm.
Die Rippenspitzen 6 können geriffelte Flächen aufweisen, um einen Profileinsatz 10 einen besseren Halt zu geben, welcher mit einem klammerartigen Kopfteil 11 auf die kurzen Kühlrippen 4 aufgesteckt werden kann und sich dann mit Spreizarmen 12,13 gegen die Flanken 9 der langen Kühlrippen 3 abstützt. So entstehen zwischen jeweils einem benachbarten Tal langer Kühlrippen 3 vier Kammern 14,15; deren innere Kammern 14 werden von der Grundplatte 2, den Kühlrippen 3, 4, 3 und den Spreizarmen 12 des klammerartigen Kopfteils 11 gebildet, die äußeren X»mmern 15 von den spitzen Bereichen der langen Kühlrippen 3 und dem Profileinsatz oder Aufsteckprofil 10.The rib tips 6 can have corrugated surfaces in order to give a profile insert 10 a better hold give, which can be attached to the short cooling fins 4 with a clamp-like head part 11 and then braced against the flanks 9 of the long cooling fins 3 with spreading arms 12, 13. So arise between in each case an adjacent valley of long cooling fins 3 four chambers 14, 15; their inner chambers 14 are of the base plate 2, the cooling fins 3, 4, 3 and the expansion arms 12 of the clip-like head part 11 formed, the outer X »mmern 15 from the tips Areas of the long cooling fins 3 and the profile insert or clip-on profile 10.
Vom stufenartigen Profilkörper 20 des IVofileinsatzes 10 ragen quer zu dessen Längsachse M beidseits Querrippen 21 ab, die von unterschiedlicher Höhe h sein können (F i g. 2) oder aber gleich lang (Fig. 3).From the step-like profile body 20 of the IVofilament insert 10 protrude transversely to its longitudinal axis M on both sides transverse ribs 21, which can be of different heights h (FIG. 2) or of the same length (FIG. 3).
Die beiden Spreizarme 12 bzw. 13 eines Spreizarmpaares sind in jeweils gleichem Winkel t bzw. w zur Längsachse M geneigt wobei die Spreizarme 12 am Kopfteil 11 einen Klemmschlitz 22 bilden. Die Spreizarme 12,13 jeder Seite verlaufen zueinander etwa parallel.The two spreader arms 12 and 13 of a pair of spreader arms are inclined at the same angle t and w to the longitudinal axis M , the spreader arms 12 forming a clamping slot 22 on the head part 11. The spreading arms 12, 13 on each side run approximately parallel to one another.
Die Gesamtlänge q des Profileinsatzes 10 mißt etwa 35 mm.The total length q of the profile insert 10 measures approximately 35 mm.
Hierzu 2 Blatt ZeichnungenFor this purpose 2 sheets of drawings
Claims (12)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3024748A DE3024748C2 (en) | 1980-06-30 | 1980-06-30 | Heat sinks for semiconductor components |
SE8103779A SE457584B (en) | 1980-06-30 | 1981-06-16 | REFRIGERATOR FOR SEMI-CONDUCTOR |
GB8120125A GB2079052B (en) | 1980-06-30 | 1981-06-30 | Cooling bodies for semiconductors or the like |
FR8112876A FR2485807A1 (en) | 1980-06-30 | 1981-06-30 | HEAT DISSIPATOR FOR SEMICONDUCTORS OR THE LIKE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3024748A DE3024748C2 (en) | 1980-06-30 | 1980-06-30 | Heat sinks for semiconductor components |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3024748A1 DE3024748A1 (en) | 1982-02-04 |
DE3024748C2 true DE3024748C2 (en) | 1986-09-04 |
Family
ID=6106046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3024748A Expired DE3024748C2 (en) | 1980-06-30 | 1980-06-30 | Heat sinks for semiconductor components |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE3024748C2 (en) |
FR (1) | FR2485807A1 (en) |
GB (1) | GB2079052B (en) |
SE (1) | SE457584B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9319259U1 (en) * | 1993-12-15 | 1994-03-24 | Siemens AG, 80333 München | Heatsink |
DE19806978A1 (en) * | 1998-02-19 | 1999-08-26 | Behr Gmbh & Co | Convection cooled heat sink for electronic components |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3518310A1 (en) * | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF |
DE8703604U1 (en) * | 1987-03-11 | 1988-07-21 | Euroatlas GmbH für Umformertechnik und Optronik, 2800 Bremen | Heat sink with semiconductor switch |
DE59106364D1 (en) * | 1990-10-24 | 1995-10-05 | Alusuisse Lonza Services Ag | Heatsinks for semiconductor devices. |
GB2333353A (en) * | 1998-01-16 | 1999-07-21 | Kuo Ching Sung | Heat dissipating device |
DE102004040557A1 (en) * | 2004-08-16 | 2006-02-23 | Kern, Dietmar, Dr.-Ing. | Electronics heatsink |
DE102009037259B4 (en) * | 2009-08-12 | 2012-04-19 | Semikron Elektronik Gmbh & Co. Kg | Arrangement with a cooling device and a power semiconductor module |
US20160369995A1 (en) * | 2015-06-16 | 2016-12-22 | Posco Led Company Ltd. | Optical semiconductor lighting apparatus |
EP3403937B1 (en) * | 2017-05-19 | 2021-01-13 | Goodrich Lighting Systems GmbH | Exterior aircraft light unit |
DE102019107280A1 (en) * | 2019-03-21 | 2020-09-24 | apt Extrusions GmbH & Co. KG | Cooling device for cooling a third-party object to be cooled |
WO2020244727A1 (en) * | 2019-06-03 | 2020-12-10 | Huawei Technologies Co., Ltd. | An apparatus for transferring heat from a heat source to air |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1959193A1 (en) * | 1969-11-25 | 1971-05-27 | Leonhard Roesch | Knitting loops and courses indicator |
DE7913126U1 (en) * | 1979-05-07 | 1979-08-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | HEAT SINK MADE OF EXTRUDED ALUMINUM FOR PERFORMANCE SEMICONDUCTORS |
-
1980
- 1980-06-30 DE DE3024748A patent/DE3024748C2/en not_active Expired
-
1981
- 1981-06-16 SE SE8103779A patent/SE457584B/en not_active IP Right Cessation
- 1981-06-30 GB GB8120125A patent/GB2079052B/en not_active Expired
- 1981-06-30 FR FR8112876A patent/FR2485807A1/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9319259U1 (en) * | 1993-12-15 | 1994-03-24 | Siemens AG, 80333 München | Heatsink |
DE19806978A1 (en) * | 1998-02-19 | 1999-08-26 | Behr Gmbh & Co | Convection cooled heat sink for electronic components |
DE19806978B4 (en) * | 1998-02-19 | 2008-08-21 | Behr Gmbh & Co. Kg | Cooling device for cooling by convection |
Also Published As
Publication number | Publication date |
---|---|
GB2079052B (en) | 1984-10-24 |
GB2079052A (en) | 1982-01-13 |
SE8103779L (en) | 1981-12-31 |
DE3024748A1 (en) | 1982-02-04 |
SE457584B (en) | 1989-01-09 |
FR2485807A1 (en) | 1981-12-31 |
FR2485807B3 (en) | 1983-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: ALUSINGEN GMBH, 7700 SINGEN, DE |
|
8339 | Ceased/non-payment of the annual fee |