DE20016316U1 - Heatsinks for cooling electronic components in particular - Google Patents

Heatsinks for cooling electronic components in particular

Info

Publication number
DE20016316U1
DE20016316U1 DE20016316U DE20016316U DE20016316U1 DE 20016316 U1 DE20016316 U1 DE 20016316U1 DE 20016316 U DE20016316 U DE 20016316U DE 20016316 U DE20016316 U DE 20016316U DE 20016316 U1 DE20016316 U1 DE 20016316U1
Authority
DE
Germany
Prior art keywords
heat sink
sink according
base plate
cooling fins
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20016316U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOSTON COOLTEC CORP
Original Assignee
BOSTON COOLTEC CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOSTON COOLTEC CORP filed Critical BOSTON COOLTEC CORP
Priority to DE20016316U priority Critical patent/DE20016316U1/en
Publication of DE20016316U1 publication Critical patent/DE20016316U1/en
Priority to PCT/DE2001/003565 priority patent/WO2002025698A2/en
Priority to AU2002213800A priority patent/AU2002213800A1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (10)

1. Ein Kühlkörper bestehend aus einer Bodenplatte und einzelnen aufgelöteten Kühlrippen, dadurch gekennzeichnet, daß die Dicke (d3) der verbindenden Lotschicht (8) mindestens 2,5 mal so groß ist, wie die Dicke (d1) der Kühlrippen (3) und die Kühlrippen (3) auf der Bodenplatte (2) aufliegen und die Kühlrippen (3) stoffschlüssig mit der Bodenplatte (2) verbunden sind.1. A heat sink consisting of a base plate and individual soldered cooling fins, characterized in that the thickness (d3) of the connecting solder layer ( 8 ) is at least 2.5 times as large as the thickness (d1) of the cooling fins ( 3 ) and The cooling fins ( 3 ) rest on the base plate ( 2 ) and the cooling fins ( 3 ) are integrally connected to the base plate ( 2 ). 2. Ein Kühlkörper nach Anspruch 1, dadurch gekennzeichnet, daß die verbindende Lotschicht (8) aus einem Gemisch zwischen einem Lot (11) und einem Pulver (10) gut Wärme leitenden Materials besteht, wobei es nicht zu einer Legierung zwischen dem Lot (10) und dem Pulver (11) kommt.2. A heat sink according to claim 1, characterized in that the connecting solder layer ( 8 ) consists of a mixture between a solder ( 11 ) and a powder ( 10 ) of good heat-conducting material, there being no alloy between the solder ( 10 ) and the powder ( 11 ) comes. 3. Ein Kühlkörper nach Anspruch 2, dadurch gekennzeichnet, daß das Mischverhältnis zwischen dem Lot (11) und dem Pulver (10) zwischen 90 : 10 und 60 : 40 liegt.3. A heat sink according to claim 2, characterized in that the mixing ratio between the solder ( 11 ) and the powder ( 10 ) is between 90:10 and 60:40. 4. Ein Kühlkörper nach einem der Ansprüche 2 oder 3, dadurch gekennzeichnet, daß das Pulver (10) jeweils pur oder gemischt aus den Materialien Kupfer, Aluminium, Silber, Gold oder Diamant besteht.4. A heat sink according to one of claims 2 or 3, characterized in that the powder ( 10 ) consists of pure or mixed copper, aluminum, silver, gold or diamond. 5. Ein Kühlkörper nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Bodenplatte (2) aus Aluminium oder Kupfer besteht.5. A heat sink according to one of claims 1 to 4, characterized in that the base plate ( 2 ) consists of aluminum or copper. 6. Ein Kühlkörper nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Bodenplatte (2) als Heat-Pipe ausgeführt ist.6. A heat sink according to one of claims 1 to 4, characterized in that the base plate ( 2 ) is designed as a heat pipe. 7. Ein Kühlkörper nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß an der Bodenplatte (2) Heat-Pipe Rohre () oder Heat-Pipe Elemente angebracht sind.7. A heat sink according to one of claims 1 to 5, characterized in that on the base plate ( 2 ) heat pipe pipes () or heat pipe elements are attached. 8. Ein Kühlkörper nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß die Kühlrippen (3) aus Aluminium oder Kupfer bestehen.8. A heat sink according to one of claims 1 to 7, characterized in that the cooling fins ( 3 ) consist of aluminum or copper. 9. Ein Kühlkörper nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, daß die Kühlrippen (3) Strukturen aufweisen, welche die Kühloberfläche vergrößern, und, bzw. oder Laminareffekte bei der Durchströmung des Kühlkörpers (1) reduzieren.9. A heat sink according to one of claims 1 to 8, characterized in that the cooling fins ( 3 ) have structures which increase the cooling surface, and, or reduce laminar effects when flowing through the heat sink ( 1 ). 10. Ein Kühlkörper nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, daß die Oberfläche des Kühlkörpers zur Verbesserung der Wärmeableitung dunkel, bzw. schwarz eingefärbt ist.10. A heat sink according to one of claims 1 to 9, characterized characterized in that the surface of the heat sink for Improved heat dissipation dark or colored black is.
DE20016316U 2000-09-19 2000-09-19 Heatsinks for cooling electronic components in particular Expired - Lifetime DE20016316U1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE20016316U DE20016316U1 (en) 2000-09-19 2000-09-19 Heatsinks for cooling electronic components in particular
PCT/DE2001/003565 WO2002025698A2 (en) 2000-09-19 2001-09-18 Cooling body, especially for cooling electronic components
AU2002213800A AU2002213800A1 (en) 2000-09-19 2001-09-18 Cooling body, especially for cooling electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20016316U DE20016316U1 (en) 2000-09-19 2000-09-19 Heatsinks for cooling electronic components in particular

Publications (1)

Publication Number Publication Date
DE20016316U1 true DE20016316U1 (en) 2001-04-05

Family

ID=7946743

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20016316U Expired - Lifetime DE20016316U1 (en) 2000-09-19 2000-09-19 Heatsinks for cooling electronic components in particular

Country Status (3)

Country Link
AU (1) AU2002213800A1 (en)
DE (1) DE20016316U1 (en)
WO (1) WO2002025698A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007053090A1 (en) * 2007-11-07 2009-05-20 Rohde & Schwarz Gmbh & Co. Kg Cooling element for electronic components, has cooling rib structure suitable for air cooling, and heat conducting body is provided between components and cooling rib structure
FR2965699A1 (en) * 2010-10-05 2012-04-06 Commissariat Energie Atomique DEVICE FOR THERMAL DISSIPATION FOR AT LEAST ONE ELECTRONIC COMPONENT AND CORRESPONDING METHOD
DE102018216649A1 (en) * 2018-09-27 2020-04-02 Robert Bosch Gmbh Electronic assembly

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7299639B2 (en) * 2004-06-22 2007-11-27 Intel Corporation Thermoelectric module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3212564A (en) * 1962-10-05 1965-10-19 Harry M Passman Heat conductive resiliently compressible structure for space electronics package modules
DE3518310A1 (en) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
SE467721B (en) * 1990-12-20 1992-08-31 Ericsson Telefon Ab L M SET TO MANUFACTURE THE TRANSMISSION BODY AND TOOL TO IMPLEMENT THE SET
DE9404717U1 (en) * 1994-03-22 1995-05-04 Tbs Gmbh Cooling element
JP3617232B2 (en) * 1997-02-06 2005-02-02 住友電気工業株式会社 Semiconductor heat sink, method of manufacturing the same, and semiconductor package using the same
DE29822241U1 (en) * 1998-12-14 1999-03-04 Baxmann Frank Ribbed heatsink

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007053090A1 (en) * 2007-11-07 2009-05-20 Rohde & Schwarz Gmbh & Co. Kg Cooling element for electronic components, has cooling rib structure suitable for air cooling, and heat conducting body is provided between components and cooling rib structure
DE102007053090B4 (en) * 2007-11-07 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Heat sink and cooling arrangement for electrical components and method for producing a heat sink and a cooling arrangement for electrical components
FR2965699A1 (en) * 2010-10-05 2012-04-06 Commissariat Energie Atomique DEVICE FOR THERMAL DISSIPATION FOR AT LEAST ONE ELECTRONIC COMPONENT AND CORRESPONDING METHOD
WO2012046161A1 (en) * 2010-10-05 2012-04-12 Commissariat A L'energie Atomique Et Aux Energies Alternatives Heat-sink device intended for at least one electronic component and corresponding method
US9622382B2 (en) 2010-10-05 2017-04-11 Commissariat A L'energie Atomique Et Aux Energies Alternatives Heat-sink device intended for at least one electronic component and corresponding method
DE102018216649A1 (en) * 2018-09-27 2020-04-02 Robert Bosch Gmbh Electronic assembly

Also Published As

Publication number Publication date
WO2002025698A3 (en) 2004-03-25
WO2002025698A2 (en) 2002-03-28
AU2002213800A1 (en) 2002-04-02

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20010510

R156 Lapse of ip right after 3 years

Effective date: 20040401