DE29822241U1 - Ribbed heatsink - Google Patents

Ribbed heatsink

Info

Publication number
DE29822241U1
DE29822241U1 DE29822241U DE29822241U DE29822241U1 DE 29822241 U1 DE29822241 U1 DE 29822241U1 DE 29822241 U DE29822241 U DE 29822241U DE 29822241 U DE29822241 U DE 29822241U DE 29822241 U1 DE29822241 U1 DE 29822241U1
Authority
DE
Germany
Prior art keywords
heatsink
ribbed
ribbed heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29822241U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAXMANN FRANK 41462 NEUSS DE
Original Assignee
BAXMANN FRANK 41462 NEUSS DE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BAXMANN FRANK 41462 NEUSS DE filed Critical BAXMANN FRANK 41462 NEUSS DE
Priority to DE29822241U priority Critical patent/DE29822241U1/en
Publication of DE29822241U1 publication Critical patent/DE29822241U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
DE29822241U 1998-12-14 1998-12-14 Ribbed heatsink Expired - Lifetime DE29822241U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29822241U DE29822241U1 (en) 1998-12-14 1998-12-14 Ribbed heatsink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29822241U DE29822241U1 (en) 1998-12-14 1998-12-14 Ribbed heatsink

Publications (1)

Publication Number Publication Date
DE29822241U1 true DE29822241U1 (en) 1999-03-04

Family

ID=8066598

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29822241U Expired - Lifetime DE29822241U1 (en) 1998-12-14 1998-12-14 Ribbed heatsink

Country Status (1)

Country Link
DE (1) DE29822241U1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19963374A1 (en) * 1999-12-28 2001-07-12 Alstom Power Schweiz Ag Baden Device for cooling a flow channel wall surrounding a flow channel with at least one rib element
WO2002025698A2 (en) * 2000-09-19 2002-03-28 Boston Cooltec Corporation Cooling body, especially for cooling electronic components

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19963374A1 (en) * 1999-12-28 2001-07-12 Alstom Power Schweiz Ag Baden Device for cooling a flow channel wall surrounding a flow channel with at least one rib element
US6446710B2 (en) 1999-12-28 2002-09-10 Alstom (Switzerland) Ltd Arrangement for cooling a flow-passage wall surrrounding a flow passage, having at least one rib element
DE19963374B4 (en) * 1999-12-28 2007-09-13 Alstom Device for cooling a flow channel wall surrounding a flow channel with at least one rib element
WO2002025698A2 (en) * 2000-09-19 2002-03-28 Boston Cooltec Corporation Cooling body, especially for cooling electronic components
WO2002025698A3 (en) * 2000-09-19 2004-03-25 Boston Cooltec Corp Cooling body, especially for cooling electronic components

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19990415

R021 Search request validly filed

Effective date: 19990107

R163 Identified publications notified

Effective date: 19990827

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: F28D0009000000

Ipc: H01L0023367000

Effective date: 19990930

R150 Term of protection extended to 6 years

Effective date: 20021206

R151 Term of protection extended to 8 years

Effective date: 20050425

R158 Lapse of ip right after 8 years

Effective date: 20070703