JPS57196552A - Radiator - Google Patents

Radiator

Info

Publication number
JPS57196552A
JPS57196552A JP8041081A JP8041081A JPS57196552A JP S57196552 A JPS57196552 A JP S57196552A JP 8041081 A JP8041081 A JP 8041081A JP 8041081 A JP8041081 A JP 8041081A JP S57196552 A JPS57196552 A JP S57196552A
Authority
JP
Japan
Prior art keywords
radiator
grooves
freedom
main body
degree
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8041081A
Other languages
Japanese (ja)
Inventor
Masahiro Nomura
Motoyuki Ichiyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8041081A priority Critical patent/JPS57196552A/en
Publication of JPS57196552A publication Critical patent/JPS57196552A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To enhance the degree of freedom of the thermal design and to facilitate manufacture of a radiator by a method wherein heat radiating fins of the plural number consisting of a metal plate material or a metal round material being formed with wave type unevenness at one end are assembled in grooves in the heat radiating part main body to constitute the radiator. CONSTITUTION:The grooves 4 of the plural number are formed in the radiator main body 3, and the fins 1 consisting of the metal plate formed with wave type unevenness 2 at one end are inserted with pressure in the grooves 4 thereof to form the radiator. Accordingly the degree of freedom of the thermal design is enhanced, and the radiator can be manufactured easily.
JP8041081A 1981-05-27 1981-05-27 Radiator Pending JPS57196552A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8041081A JPS57196552A (en) 1981-05-27 1981-05-27 Radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8041081A JPS57196552A (en) 1981-05-27 1981-05-27 Radiator

Publications (1)

Publication Number Publication Date
JPS57196552A true JPS57196552A (en) 1982-12-02

Family

ID=13717516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8041081A Pending JPS57196552A (en) 1981-05-27 1981-05-27 Radiator

Country Status (1)

Country Link
JP (1) JPS57196552A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0206980A2 (en) * 1985-05-22 1986-12-30 Alusuisse-Lonza Services Ag Heat sink for semiconductor devices and method for manufacturing the same
US5038858A (en) * 1990-03-13 1991-08-13 Thermalloy Incorporated Finned heat sink and method of manufacture
EP0630045A1 (en) * 1993-06-14 1994-12-21 Sumitomo Electric Industries, Limited Finned diamond heatsink and process for the production of the same
EP0744241A2 (en) * 1995-05-16 1996-11-27 TOUSUI, Ltd. Method of joining together a pair of members each having a high thermal conductivity
US5819407A (en) * 1995-04-19 1998-10-13 Tousui, Ltd. Method of joining together a pair of members each having a high thermal conductivity
US6234246B1 (en) * 1995-05-04 2001-05-22 Alusuisse Technology & Management Ltd. Heat exchanger for cooling semi-conductor components

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5642779A (en) * 1909-06-30 1997-07-01 Sumitomo Electric Industries, Ltd. Heat sink and a process for the production of the same
EP0206980A2 (en) * 1985-05-22 1986-12-30 Alusuisse-Lonza Services Ag Heat sink for semiconductor devices and method for manufacturing the same
US5038858A (en) * 1990-03-13 1991-08-13 Thermalloy Incorporated Finned heat sink and method of manufacture
EP0630045A1 (en) * 1993-06-14 1994-12-21 Sumitomo Electric Industries, Limited Finned diamond heatsink and process for the production of the same
EP1035578A1 (en) * 1993-06-14 2000-09-13 Sumitomo Electric Industries, Ltd. Process for the production of a finned diamond heatsink
US5819407A (en) * 1995-04-19 1998-10-13 Tousui, Ltd. Method of joining together a pair of members each having a high thermal conductivity
US6234246B1 (en) * 1995-05-04 2001-05-22 Alusuisse Technology & Management Ltd. Heat exchanger for cooling semi-conductor components
EP0744241A2 (en) * 1995-05-16 1996-11-27 TOUSUI, Ltd. Method of joining together a pair of members each having a high thermal conductivity
EP0744241A3 (en) * 1995-05-16 1997-08-13 Tousui Ltd Method of joining together a pair of members each having a high thermal conductivity

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